KR960009128A - 수지-캡슐화 반도체 장치 - Google Patents

수지-캡슐화 반도체 장치 Download PDF

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Publication number
KR960009128A
KR960009128A KR1019950024604A KR19950024604A KR960009128A KR 960009128 A KR960009128 A KR 960009128A KR 1019950024604 A KR1019950024604 A KR 1019950024604A KR 19950024604 A KR19950024604 A KR 19950024604A KR 960009128 A KR960009128 A KR 960009128A
Authority
KR
South Korea
Prior art keywords
resin
semiconductor device
encapsulated semiconductor
encapsulated
semiconductor
Prior art date
Application number
KR1019950024604A
Other languages
English (en)
Other versions
KR100202499B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=16245487&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR960009128(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed filed Critical
Publication of KR960009128A publication Critical patent/KR960009128A/ko
Application granted granted Critical
Publication of KR100202499B1 publication Critical patent/KR100202499B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
KR1019950024604A 1994-08-11 1995-08-09 수지-캡슐화 반도체 장치 KR100202499B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18968694A JP3473640B2 (ja) 1994-08-11 1994-08-11 樹脂封止型半導体装置及びこれに用いるエポキシ樹脂封止材
JP6-189686 1994-08-11

Publications (2)

Publication Number Publication Date
KR960009128A true KR960009128A (ko) 1996-03-22
KR100202499B1 KR100202499B1 (ko) 1999-06-15

Family

ID=16245487

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950024604A KR100202499B1 (ko) 1994-08-11 1995-08-09 수지-캡슐화 반도체 장치

Country Status (4)

Country Link
US (1) US5567990A (ko)
JP (1) JP3473640B2 (ko)
KR (1) KR100202499B1 (ko)
TW (1) TW304971B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW452584B (en) * 1997-10-03 2001-09-01 Hitachi Chemical Co Ltd Epoxy resin composition and semiconductor devices using it as encapsulant
US6784024B2 (en) * 2000-01-18 2004-08-31 Micron Technology, Inc. Die attach curing method for semiconductor device
JP2002319765A (ja) * 2000-12-27 2002-10-31 Ngk Spark Plug Co Ltd 埋め込み樹脂
JP4788053B2 (ja) * 2001-03-27 2011-10-05 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5294835A (en) * 1992-07-28 1994-03-15 Nitto Denko Corporation Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

Also Published As

Publication number Publication date
JP3473640B2 (ja) 2003-12-08
TW304971B (ko) 1997-05-11
US5567990A (en) 1996-10-22
KR100202499B1 (ko) 1999-06-15
JPH0853534A (ja) 1996-02-27

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