KR970003259U - 웨이퍼 이송 장치 - Google Patents

웨이퍼 이송 장치

Info

Publication number
KR970003259U
KR970003259U KR2019950013922U KR19950013922U KR970003259U KR 970003259 U KR970003259 U KR 970003259U KR 2019950013922 U KR2019950013922 U KR 2019950013922U KR 19950013922 U KR19950013922 U KR 19950013922U KR 970003259 U KR970003259 U KR 970003259U
Authority
KR
South Korea
Prior art keywords
transfer device
wafer transfer
wafer
transfer
Prior art date
Application number
KR2019950013922U
Other languages
English (en)
Other versions
KR200173017Y1 (ko
Inventor
오현수
지용호
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019950013922U priority Critical patent/KR200173017Y1/ko
Publication of KR970003259U publication Critical patent/KR970003259U/ko
Application granted granted Critical
Publication of KR200173017Y1 publication Critical patent/KR200173017Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR2019950013922U 1995-06-20 1995-06-20 웨이퍼 이송 장치 KR200173017Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950013922U KR200173017Y1 (ko) 1995-06-20 1995-06-20 웨이퍼 이송 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950013922U KR200173017Y1 (ko) 1995-06-20 1995-06-20 웨이퍼 이송 장치

Publications (2)

Publication Number Publication Date
KR970003259U true KR970003259U (ko) 1997-01-24
KR200173017Y1 KR200173017Y1 (ko) 2000-03-02

Family

ID=19415918

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950013922U KR200173017Y1 (ko) 1995-06-20 1995-06-20 웨이퍼 이송 장치

Country Status (1)

Country Link
KR (1) KR200173017Y1 (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040100030A (ko) * 2003-05-21 2004-12-02 삼성전자주식회사 반도체 기판 이송 장치 및 이를 구비하는 반도체 기판가공 장치
KR100583641B1 (ko) * 1999-04-27 2006-05-26 삼성전자주식회사 반도체 웨이퍼 이송장치
CN111681982A (zh) * 2020-06-18 2020-09-18 芯米(厦门)半导体设备有限公司 一种晶圆传递装置及具有其的光阻涂布显影设备

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101139371B1 (ko) * 2005-08-04 2012-06-28 엘아이지에이디피 주식회사 기판 클램핑 장치, 이송장치 및 그 검사장치

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100583641B1 (ko) * 1999-04-27 2006-05-26 삼성전자주식회사 반도체 웨이퍼 이송장치
KR20040100030A (ko) * 2003-05-21 2004-12-02 삼성전자주식회사 반도체 기판 이송 장치 및 이를 구비하는 반도체 기판가공 장치
CN111681982A (zh) * 2020-06-18 2020-09-18 芯米(厦门)半导体设备有限公司 一种晶圆传递装置及具有其的光阻涂布显影设备

Also Published As

Publication number Publication date
KR200173017Y1 (ko) 2000-03-02

Similar Documents

Publication Publication Date Title
DE69610457D1 (de) Halbleitervorrichtung
KR970004020A (ko) 반도체장치
KR970005998A (ko) 반도체 장치
DE69631940D1 (de) Halbleitervorrichtung
DE59602432D1 (de) Übergabevorrichtung
DE59607521D1 (de) Halbleiter-Bauelement-Konfiguration
DE19681689T1 (de) Gesichertes Halbleiterbauelement
DE69628482D1 (de) Plattentransportvorrichtung
DE69623375D1 (de) Plattenübertragungsgerät
DE69716544D1 (de) Übertragungsvorrichtung
KR970003259U (ko) 웨이퍼 이송 장치
DE69613028D1 (de) Plattenübertragungsvorrichtung
KR960027794U (ko) 웨이퍼 이송장치
FI954477A0 (fi) Siirtolaite
DE69613032D1 (de) Plattenübertragungsvorrichtung
DE69635334D1 (de) Halbleiteranordnung
KR970046845U (ko) 웨이퍼 이송장치
DE69613027D1 (de) Plattenübertragungsvorrichtung
KR970025773U (ko) 반도체 장치
DE59602448D1 (de) Übergabevorrichtung
DE69625112D1 (de) Plattenübertragungsvorrichtung
KR960032734U (ko) 웨이퍼 세정장치
KR970016477U (ko) 칩 이송장치
KR970003228U (ko) 반도체 장치
KR950031480U (ko) 웨이퍼 이동구

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20041119

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee