KR940008668U - 반도체 패키지 성형용 금형의 캐비티 세정용 리드프레임 - Google Patents

반도체 패키지 성형용 금형의 캐비티 세정용 리드프레임

Info

Publication number
KR940008668U
KR940008668U KR2019920016738U KR920016738U KR940008668U KR 940008668 U KR940008668 U KR 940008668U KR 2019920016738 U KR2019920016738 U KR 2019920016738U KR 920016738 U KR920016738 U KR 920016738U KR 940008668 U KR940008668 U KR 940008668U
Authority
KR
South Korea
Prior art keywords
molds
lead frame
semiconductor packages
cavity cleaning
molding semiconductor
Prior art date
Application number
KR2019920016738U
Other languages
English (en)
Other versions
KR950009260Y1 (ko
Inventor
강대순
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR92016738U priority Critical patent/KR950009260Y1/ko
Publication of KR940008668U publication Critical patent/KR940008668U/ko
Application granted granted Critical
Publication of KR950009260Y1 publication Critical patent/KR950009260Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR92016738U 1992-09-03 1992-09-03 반도체 패키지 성형용 금형의 캐비티 세정용 리드프레임 KR950009260Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR92016738U KR950009260Y1 (ko) 1992-09-03 1992-09-03 반도체 패키지 성형용 금형의 캐비티 세정용 리드프레임

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR92016738U KR950009260Y1 (ko) 1992-09-03 1992-09-03 반도체 패키지 성형용 금형의 캐비티 세정용 리드프레임

Publications (2)

Publication Number Publication Date
KR940008668U true KR940008668U (ko) 1994-04-21
KR950009260Y1 KR950009260Y1 (ko) 1995-10-23

Family

ID=19339529

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92016738U KR950009260Y1 (ko) 1992-09-03 1992-09-03 반도체 패키지 성형용 금형의 캐비티 세정용 리드프레임

Country Status (1)

Country Link
KR (1) KR950009260Y1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020053660A (ko) * 2000-12-27 2002-07-05 마이클 디. 오브라이언 몰딩 다이 크리닝용 더미 리드프레임
KR100403132B1 (ko) * 2001-12-28 2003-10-30 동부전자 주식회사 반도체패키지 제조용 몰드 캐비티 바

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020053660A (ko) * 2000-12-27 2002-07-05 마이클 디. 오브라이언 몰딩 다이 크리닝용 더미 리드프레임
KR100403132B1 (ko) * 2001-12-28 2003-10-30 동부전자 주식회사 반도체패키지 제조용 몰드 캐비티 바

Also Published As

Publication number Publication date
KR950009260Y1 (ko) 1995-10-23

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