KR870019073U - 반도체 장치성형금형 청소용 종이기판(paper lead frame) - Google Patents

반도체 장치성형금형 청소용 종이기판(paper lead frame)

Info

Publication number
KR870019073U
KR870019073U KR2019860007190U KR860007190U KR870019073U KR 870019073 U KR870019073 U KR 870019073U KR 2019860007190 U KR2019860007190 U KR 2019860007190U KR 860007190 U KR860007190 U KR 860007190U KR 870019073 U KR870019073 U KR 870019073U
Authority
KR
South Korea
Prior art keywords
semiconductor device
lead frame
molding mold
cleaning semiconductor
device molding
Prior art date
Application number
KR2019860007190U
Other languages
English (en)
Other versions
KR890007880Y1 (ko
Inventor
박영범
Original Assignee
박영범
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 박영범 filed Critical 박영범
Priority to KR2019860007190U priority Critical patent/KR890007880Y1/ko
Publication of KR870019073U publication Critical patent/KR870019073U/ko
Application granted granted Critical
Publication of KR890007880Y1 publication Critical patent/KR890007880Y1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR2019860007190U 1986-05-23 1986-05-23 반도체 장치성형금형 청소용 종이기판(paper lead frame) KR890007880Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019860007190U KR890007880Y1 (ko) 1986-05-23 1986-05-23 반도체 장치성형금형 청소용 종이기판(paper lead frame)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019860007190U KR890007880Y1 (ko) 1986-05-23 1986-05-23 반도체 장치성형금형 청소용 종이기판(paper lead frame)

Publications (2)

Publication Number Publication Date
KR870019073U true KR870019073U (ko) 1987-12-26
KR890007880Y1 KR890007880Y1 (ko) 1989-11-10

Family

ID=19251989

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019860007190U KR890007880Y1 (ko) 1986-05-23 1986-05-23 반도체 장치성형금형 청소용 종이기판(paper lead frame)

Country Status (1)

Country Link
KR (1) KR890007880Y1 (ko)

Also Published As

Publication number Publication date
KR890007880Y1 (ko) 1989-11-10

Similar Documents

Publication Publication Date Title
KR860004481A (ko) 반도체 리이드 프레임의 세정장치
KR880701461A (ko) 반도체 소자 제조공정
EP0331814A3 (en) Lead frame for semiconductor device
DE3277757D1 (en) Lead frame for plastic encapsulated semiconductor device
DK353687A (da) Hoevendemaskine
NO871338D0 (no) Foeringsanordning for poelsemaskin.
EP0452903A3 (en) Lead frame for semiconductor device
DE69030411D1 (de) Leiterrahmen für Halbleiteranordnung
KR870019073U (ko) 반도체 장치성형금형 청소용 종이기판(paper lead frame)
IT1211166B (it) Macchina di formatura di pezzi particolarmente per stampaggio
DE69128185D1 (de) Leiterrahmen für eine harzumhüllte Halbleiteranordnung
KR880701456A (ko) 반도체 소자
DE69026072D1 (de) Anschlussrahmen für Harz-Halbleiterverpackungen
KR930010573U (ko) 반도체 리이드프레임 성형용 금형
KR900011824U (ko) 반도체금형용 프레스의 안내장치
KR870003129Y1 (en) Cleaning frame for semiconductor mould
EP0410116A3 (en) Semiconductor device including lead frames
KR880003791U (ko) 반도체장치
KR920013760U (ko) 반도체 장치용 리드 프레임
KR880020590U (ko) 반도체 금형 지지장치
KR880001342U (ko) 집적회로용 패키지
KR910021033U (ko) 반도체 제조용 페이스트 경화장치
KR900007492U (ko) 반도체용 컴파운드 성형기
KR850003989U (ko) 유리제품 성형용 프레스장치
KR900013463U (ko) 반도체장치 성형금형 청소용 종이기판

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 19970830

Year of fee payment: 11

LAPS Lapse due to unpaid annual fee