DE69128185D1 - Leiterrahmen für eine harzumhüllte Halbleiteranordnung - Google Patents

Leiterrahmen für eine harzumhüllte Halbleiteranordnung

Info

Publication number
DE69128185D1
DE69128185D1 DE69128185T DE69128185T DE69128185D1 DE 69128185 D1 DE69128185 D1 DE 69128185D1 DE 69128185 T DE69128185 T DE 69128185T DE 69128185 T DE69128185 T DE 69128185T DE 69128185 D1 DE69128185 D1 DE 69128185D1
Authority
DE
Germany
Prior art keywords
resin
semiconductor device
lead frame
encased semiconductor
encased
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69128185T
Other languages
English (en)
Other versions
DE69128185T2 (de
Inventor
Kazunori Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE69128185D1 publication Critical patent/DE69128185D1/de
Publication of DE69128185T2 publication Critical patent/DE69128185T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE69128185T 1990-09-27 1991-09-26 Leiterrahmen für eine harzumhüllte Halbleiteranordnung Expired - Fee Related DE69128185T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2258618A JP2877479B2 (ja) 1990-09-27 1990-09-27 半導体装置用リードフレーム

Publications (2)

Publication Number Publication Date
DE69128185D1 true DE69128185D1 (de) 1997-12-18
DE69128185T2 DE69128185T2 (de) 1998-04-02

Family

ID=17322782

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69128185T Expired - Fee Related DE69128185T2 (de) 1990-09-27 1991-09-26 Leiterrahmen für eine harzumhüllte Halbleiteranordnung

Country Status (5)

Country Link
US (1) US5283466A (de)
EP (1) EP0477937B1 (de)
JP (1) JP2877479B2 (de)
KR (1) KR950010113B1 (de)
DE (1) DE69128185T2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2866572B2 (ja) * 1994-02-07 1999-03-08 三菱電機株式会社 半導体製造方法
JP3205235B2 (ja) * 1995-01-19 2001-09-04 シャープ株式会社 リードフレーム、樹脂封止型半導体装置、その製造方法及び該製造方法で用いる半導体装置製造用金型
US5990544A (en) * 1997-07-07 1999-11-23 Nippon Steel Semiconductor Corp. Lead frame and a semiconductor device having the same
JP3892139B2 (ja) * 1998-03-27 2007-03-14 株式会社ルネサステクノロジ 半導体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4477827A (en) * 1981-02-02 1984-10-16 Northern Telecom Limited Lead frame for leaded semiconductor chip carriers
US4514750A (en) * 1982-01-11 1985-04-30 Texas Instruments Incorporated Integrated circuit package having interconnected leads adjacent the package ends
JPS59147448A (ja) * 1983-02-12 1984-08-23 Fujitsu Ltd 半導体素子搭載用リ−ドフレ−ムおよびこれを用いて製造される半導体装置とその製造方法
JPS6123351A (ja) * 1984-07-11 1986-01-31 Nec Corp リ−ドフレ−ム
JPS61245556A (ja) * 1985-04-24 1986-10-31 Hitachi Ltd リ−ドフレ−ム
US4916506A (en) * 1988-11-18 1990-04-10 Sprague Electric Company Integrated-circuit lead-frame package with low-resistance ground-lead and heat-sink means

Also Published As

Publication number Publication date
US5283466A (en) 1994-02-01
JPH04137553A (ja) 1992-05-12
JP2877479B2 (ja) 1999-03-31
DE69128185T2 (de) 1998-04-02
EP0477937B1 (de) 1997-11-12
EP0477937A1 (de) 1992-04-01
KR950010113B1 (ko) 1995-09-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee