KR930016259U - 반도체장치용 리이드프레임 - Google Patents
반도체장치용 리이드프레임Info
- Publication number
- KR930016259U KR930016259U KR2019910021123U KR910021123U KR930016259U KR 930016259 U KR930016259 U KR 930016259U KR 2019910021123 U KR2019910021123 U KR 2019910021123U KR 910021123 U KR910021123 U KR 910021123U KR 930016259 U KR930016259 U KR 930016259U
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- semiconductor devices
- semiconductor
- lead
- devices
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910021123U KR940005490Y1 (ko) | 1991-12-03 | 1991-12-03 | 반도체장치용 리이드프레임 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910021123U KR940005490Y1 (ko) | 1991-12-03 | 1991-12-03 | 반도체장치용 리이드프레임 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930016259U true KR930016259U (ko) | 1993-07-28 |
| KR940005490Y1 KR940005490Y1 (ko) | 1994-08-13 |
Family
ID=19323429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019910021123U KR940005490Y1 (ko) | 1991-12-03 | 1991-12-03 | 반도체장치용 리이드프레임 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR940005490Y1 (ko) |
-
1991
- 1991-12-03 KR KR2019910021123U patent/KR940005490Y1/ko active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| KR940005490Y1 (ko) | 1994-08-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| NORF | Unpaid initial registration fee |