JP2022106838A - 指紋感知モジュール及びその方法 - Google Patents
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Abstract
Description
Claims (20)
- 指紋感知装置の第1の側(22)に配置された感知アレイ(21)を有する指紋感知装置(20)であって、前記感知アレイは、指紋感知素子のアレイを備え、前記指紋感知装置は、前記指紋感知装置を外部回路に接続するための接続パッド(24)を備える、指紋感知装置(20)と、
前記指紋感知装置を覆うように構成された指紋感知装置のカバー構造体(30)であって、前記カバー構造体は、指で触れるように構成され、それによって指紋感知モジュールの感知面を形成する第1の側(32)と、前記感知アレイに対面する第2の側(34)とを有し、前記カバー構造体は、前記指紋感知モジュールを外部回路に電気的に接続するために、前記カバー構造体の前記第2の側に配置された導電トレース(35)を備え、前記カバー構造体の表面積は、前記指紋感知装置の表面積よりも大きい、指紋感知装置のカバー構造体(30)と、を備え、
前記指紋感知装置は、前記指紋感知装置の前記接続パッドを前記カバー構造体の前記導電トレースに電気的に接続するワイヤボンド(66)をさらに備え、
前記接続パッドは、前記指紋感知装置の前記第1の側に配置され、前記指紋感知装置は、
前記指紋感知装置の前記第2の側に取り付けられた第1の側を有するキャリア(60)と、
前記指紋感知装置の前記接続パッドと前記キャリアの前記第1の側との間の第1のワイヤボンド(64)と、
前記第1の側の反対側である前記キャリアの第2の側と前記カバー構造体の前記導電トレースとの間に配置された第2のワイヤボンド(66)と、をさらに備え、
前記指紋感知装置と前記導電トレースとの間の電気接続部が前記キャリアを貫通して形成され、前記電気接続部は、前記第1のワイヤボンド(64)及び前記第2のワイヤボンド(66)を備える、
指紋感知モジュール(2)。 - 前記接続パッドは、前記第1の側(22)の反対側である前記指紋感知装置の第2の側(23)に配置され、前記指紋感知装置は、前記指紋感知装置の前記第1の側から前記指紋感知装置の前記第2の側の前記接続パッドに達するビア接続部(52)を備える基板(50)をさらに備える、請求項1に記載の指紋感知モジュール。
- 前記指紋感知装置と前記カバー構造体との間に配置されたモールド層(68)をさらに備える、請求項1又は2に記載の指紋感知モジュール。
- 前記カバー構造体は、導電トレースを備える少なくとも1つの層と少なくとも1つの絶縁層とを含む積層構造体である、請求項1から3のいずれか一項に記載の指紋感知モジュール。
- 前記カバー構造体の前記第2の側(34)に配置され、前記カバー構造体の前記導電トレースに電気的に接続された受動部品(70)をさらに備える、請求項1から4のいずれか一項に記載の指紋感知モジュール。
- 前記キャリアの前記第1の側(61)に配置され、前記カバー構造体の導電トレースに電気的に接続された受動部品(70)をさらに備える、請求項1に記載の指紋感知モジュール。
- 前記第1の側の反対側である前記指紋感知装置の第2の側に取り付けられた指紋感知制御装置(80)をさらに備える、請求項1から6のいずれか一項に記載の指紋感知モジュール。
- 前記指紋感知制御装置を前記カバー構造体の導電トレースに電気的に接続するワイヤボンド(82)をさらに含む、請求項7に記載の指紋感知モジュール。
- 前記指紋感知制御装置と前記指紋感知モジュールの前記第2の側との間に配置されたシリコンインターポーザ層(84)をさらに備える、請求項7又は8に記載の指紋感知モジュール。
- 前記感知面上に置かれた指と前記指紋感知モジュールの駆動信号回路との間に電気的接続を提供するために前記感知アレイに隣接して配置された電気的導電ベゼルをさらに備える、請求項1から9のいずれか一項に記載の指紋感知モジュール。
- 前記カバー構造体は、前記指紋感知モジュールがT字形の外形を有するように前記指紋感知装置の外側に延在する、請求項1から10のいずれか一項に記載の指紋感知モジュール。
- 前記カバー構造体が可撓性である、請求項1から11のいずれか一項に記載の指紋感知モジュール。
- セキュアエレメントをさらに備える、請求項1から12のいずれか一項に記載の指紋感知モジュール。
- 請求項1から13のいずれか一項に記載の指紋感知モジュール(10)を備えるスマートカード(1)であって、
前記スマートカードは、前記指紋感知モジュールが配置される凹部を含み、
前記指紋感知モジュールの前記カバー構造体は、前記スマートカードの導電インレイの対応する接続パッドに前記導電トレースを接続するための接続パッドを備える、スマートカード。 - 前記凹部は、前記指紋感知モジュールの形状に対応する形状を有する、請求項14に記載のスマートカード。
- 前記凹部がT字形であり、対応するT字形の指紋感知モジュールを受けるように構成される、請求項14又は15に記載のスマートカード。
- 指紋感知モジュールを製造する方法であって、
指紋感知装置の第1の側(22)に配置された感知アレイを有する指紋感知装置(20)を提供し、前記感知アレイは、指紋感知素子のアレイを備え、指紋感知装置は、前記指紋感知装置を外部回路に接続するための接続パッド(24)を備え、
前記指紋感知モジュールを前記外部回路に電気的に接続するために、前記指紋感知装置のカバー構造体の第2の側に配置された導電トレースを備える、前記指紋感知装置のカバー構造体を提供し、
前記指紋感知装置を前記カバー構造体に取り付け、
前記接続パッドと前記導電トレースとの間のワイヤボンディングによって前記指紋感知装置を電気的に接続する、
ことを有し、
前記接続パッドは、前記指紋感知装置の前記第1の側に配置され、前記指紋感知装置は、
前記指紋感知装置の前記第2の側に取り付けられた第1の側を有するキャリア(60)と、
前記指紋感知装置の前記接続パッドと前記キャリアの前記第1の側との間の第1のワイヤボンド(64)と、
前記第1の側の反対側である前記キャリアの第2の側と前記カバー構造体の前記導電トレースとの間に配置された第2のワイヤボンド(66)と、をさらに備え、
前記指紋感知装置と前記導電トレースとの間の電気接続部が前記キャリアを貫通して形成され、前記電気接続部は、前記第1のワイヤボンド(64)及び前記第2のワイヤボンド(66)を備える、指紋感知モジュールを製造する方法。 - 前記第1の側の反対側である前記指紋感知モジュールの第2の側に指紋感知制御装置を取り付けることをさらに有する、請求項17に記載の方法。
- 前記指紋感知モジュールを封入することをさらに有する、請求項17又は18に記載の方法。
- 請求項1から13のいずれか一項に記載の指紋感知モジュールを備えるスマートカードを製造する方法であって、前記方法は、
複数の層を含むスマートカード基板を提供し、
前記スマートカードに凹部を形成し、前記凹部は下部と上部とを含み、前記上部は前記下部の面積より大きい面積を有し、
前記凹部の前記上部と前記スマートカードの導電トレースとの間にビア接続部を形成し、
前記カバー構造体の前記導電トレースが前記ビア接続部と電気的接触を形成するように、前記凹部に感知モジュールを配置する、
ことを有する、スマートカードを製造する方法。
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Application Number | Priority Date | Filing Date | Title |
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SE1651654-4 | 2016-12-15 | ||
SE1651654 | 2016-12-15 | ||
JP2019531057A JP7065094B2 (ja) | 2016-12-15 | 2017-12-04 | 指紋感知モジュール及びその方法 |
PCT/SE2017/051210 WO2018111174A1 (en) | 2016-12-15 | 2017-12-04 | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
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US (1) | US10395164B2 (ja) |
EP (2) | EP3564852B1 (ja) |
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KR (1) | KR102468554B1 (ja) |
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US10395164B2 (en) | 2019-08-27 |
CN108229340A (zh) | 2018-06-29 |
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EP3564852A1 (en) | 2019-11-06 |
KR20190096977A (ko) | 2019-08-20 |
JP2020503606A (ja) | 2020-01-30 |
JP7065094B2 (ja) | 2022-05-11 |
CN207601824U (zh) | 2018-07-10 |
WO2018111174A1 (en) | 2018-06-21 |
EP3336759B1 (en) | 2019-06-19 |
US20180174018A1 (en) | 2018-06-21 |
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