CN103594604A - 电极被全包裹封装的led支架、贴片型led灯及其制造方法 - Google Patents
电极被全包裹封装的led支架、贴片型led灯及其制造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 65
- 239000002184 metal Substances 0.000 claims abstract description 65
- 238000001746 injection moulding Methods 0.000 claims abstract description 31
- 239000003292 glue Substances 0.000 claims abstract description 16
- 238000004806 packaging method and process Methods 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 7
- 238000005452 bending Methods 0.000 claims description 16
- 229920003023 plastic Polymers 0.000 claims description 16
- 239000004033 plastic Substances 0.000 claims description 16
- 238000005538 encapsulation Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 abstract 1
- 239000000725 suspension Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 18
- 238000004080 punching Methods 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
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Abstract
本发明提供了电极被全包裹封装的贴片型LED灯的制造方法,包括:在金属板上冲切并折弯竖立彼此间隔开的正、负极电极,竖立的正、负极电极与金属板形成大于0度且小于180度的角度;注塑形成的注塑杯,电极在注塑杯里形成悬空结构,这样就形成了一种新型的SMD-LED支架;将LED芯片固晶在固晶载体内;用金属焊线将LED芯片与正、负电极焊接连通;用封装胶水将正、负电极、LED芯片和焊线形成全方位整体包封的封装结构;将多个相连的LED封装结构从金属板上分切下来而得到贴片型LED灯。本发明优点是,用封装胶水将支架的竖立的电极、芯片、焊线整体地全方位包裹在一起而使焊线不会移位被拉断形成开路,造成死灯现象,性能更可靠,并且防水性能更好。
Description
技术领域
本发明涉及LED应用领域,具体涉及一种电极被全包裹封装的LED支架及贴片LED灯。
背景技术
传统的SMD-LED支架及贴片型LED,通常都是通过金属板或者是金属带冲切、冲压、电镀后注塑形成的LED支架,然后在LED支架的杯底的金属基板上固晶焊线,滴LED封装胶于支架杯内进行封装而形成贴片型LED灯珠。因注塑的塑料、金属基板、封装胶属于三种不同属性的材料,三者粘接在一起是属于一种物理粘接,而且耐久性、耐候性差,即使肉眼上看不出其粘接瑕疵,但在几十倍的放大镜上看去其连接界面上存有缝隙,而且这种连接非常脆弱。这就决定了支架的金属电极有松动移位的风险,从而造成焊接在金属基板上的合金线易于拉断形成电路断开,造成LED死灯的现象;同时界面上存在的缝隙而使得不能将湿气挡在LED灯珠体外,也就是说在水汽潮湿严重的地方,必然会有湿气渗入其内,造成LED死灯。
因此,现有技术需要改进的LED支架及贴片型LED灯。
发明内容
根据本发明,将LED贴片支架电极用模具折压竖立,然后再注塑形成注塑杯,在杯里的支架电极形成悬空,封装时,封装胶水对支架的电极,芯片,焊线形成整体的全方位的包裹,形成LED贴片灯。本发明的一种全包裹封装的LED贴片LED灯与传统的LED贴片灯相比,其优点是用封装胶水将支架的竖立的电极,芯片,焊线形成整体的全方位的包裹在一起,使焊接在芯片与电极上的金属线不会因电极的松动移位被拉断形成开路,造成死灯的现象,性能更可靠,并且防水性能更好。
根据本发明,提供了一种电极被全包裹封装的LED支架的制造方法,包括:在金属板上冲切并折弯竖立形成彼此间隔开的正、负极金属电极,一部分电极是LED的导电电极,另一部分电极既是安装LED芯片的固晶载体又是导电电极,其中,竖立的正、负极金属电极与金属板形成大于0度且小于180度的角度;注塑形成注塑杯,其中,金属电极在所述的注塑杯里形成悬空结构,这样就形成了一种新型的SMD-LED支架;
根据本发明的一实施例,竖立的金属电极的截面是“丨”形的、或者是倒“L”形的。
根据本发明的一实施例,所述固晶载体是凹面杯状型、或者是平台状型、或者是塔尖型。
根据本发明,还提供了一种电极被全包裹封装的贴片型LED灯的制造方法,包括:在金属板上冲切并折弯竖立形成彼此间隔开的正、负极金属电极,一部分电极是LED的导电电极,另一部分电极既是安装LED芯片的固晶载体又是导电电极,其中,竖立的正、负极金属电极与金属板形成大于0度且小于180度的角度;注塑形成注塑杯,其中,金属电极在所述的注塑杯里形成悬空结构,这样就形成了一种新型的SMD-LED支架;将LED芯片固晶在固晶载体内;用金属焊线将LED芯片与正、负电极焊接连通;用封装胶水将正、负金属电极、LED芯片和焊线形成全方位整体包封的封装结构;其中,将多个相连的LED封装结构从金属板上分切下来而得到贴片型LED灯。
根据本发明的一实施例,所述的贴片型LED灯,其特征在于:所述的金属焊脚是只设置在LED底部的一面上的结构类型。
根据本发明,还提供了一种电极被全包裹封装的贴片型LED灯的制造方法,包括:在金属板上冲切并折弯竖立形成彼此间隔开的正、负极金属电极,一部分电极是LED的导电电极,另一部分电极既是安装LED芯片的固晶载体又是导电电极,其中,竖立的正、负极金属电极与金属板形成大于0度且小于180度的角度;注塑形成注塑杯,其中,金属电极在所述的注塑杯里形成悬空结构,这样就形成了一种新型的SMD-LED支架;将LED芯片固晶在所述固晶载体内;用金属焊线将LED芯片与正、负电极焊接连通;用封装胶水将正、负金属电极、LED芯片和焊线形成全方位整体包封的封装结构;其中,将多个相连的贴片型LED封装结构,从焊脚处折弯至LED侧面形成将同一焊脚折弯成两个焊接面的结构,然后在从金属板上分切下来,形成同一焊脚有两个焊接面的新型贴片LED。
根据本发明的一实施例,所述的金属焊脚是将焊脚折弯并贴在LED侧面而使同一焊脚形成底面和侧面两个焊接面的结构类型。
根据本发明,还提供了一种电极被全包裹封装的贴片型LED灯,包括:与LED底面形成大于0度且小于180度的角度的竖立正、负极金属电极(2);用于与外部连接的金属焊脚(2.1);注塑形成的塑胶体(4),其中,在塑胶体(4)上设置塑料反射杯(8);固晶焊线在竖立金属电极上的LED芯片(5);将正、负金属电极(2)、LED芯片(5)和焊线(6)形成全方位整体包封的封装胶水(7)。
根据本发明的一实施例,所述的封装胶水一次滴入杯里成型。
根据本发明的一实施例,所述的封装胶水分两次滴入杯里完成封装,即,先滴荧光粉胶固化后,再滴透光胶。
在以下对附图和具体实施方式的描述中,将阐述本发明的一个或多个实施例的细节。从这些描述、附图以及权利要求中,可以清楚本发明的其它特征、目的和优点。
附图说明
图1为本发明一实施例平板金属的示意图。
图2为本发明一实施例将平板金属用模具冲切后的示意图。
图3为本发明一实施例用模具将金属电极折弯,使电极截面形成倒“L”形的示意图。
图4为本发明一实施例用模具将部分金属电极冲压形成凹面杯状型的示意图。
图5为本发明一实施例注塑形成LED支架的示意图。
图6为本发明一实施例在电极凹面反射杯内固晶芯片后的示意图。
图7为本发明一实施例用金属线将芯片各电极焊接连接导通示意图。
图8为本发明一实施例将封装胶水滴在注塑反射杯内,将支架凸起的电极,芯片,金属线牢固固定包裹在一起的示意图。
图9为本发明一实施例将连片LED分切成一种单粒贴片LED灯的立体示意图。
图10为本发明一实施例将连片LED用模具折弯后再分切,形成另一种单粒贴片LED灯的立体示意图.
图11为竖立电极截面是“丨”形,电极顶面固晶载体是凹面杯状型的示意图。
图12为竖立电极截面是“丨”形,电极顶面固晶载体是平台状型的示意图。
图13为将竖立电极截面是“丨”形,电极顶面固晶载体是塔尖型的示意图。
图14为竖立金属电极截面为倒“L”形,电极顶面固晶载体是平台状型的示意图。
图15为竖立金属电极截面为倒“L”形,电极顶面固晶载体是凹面杯状型的示意图。
具体实施方式
下面将针对本发明的电极被全包裹封装的LED支架及贴片LED灯的具体实施进行更详细的描述。
但是,本领域技术人员应当理解,这些实施方式仅仅列举了一些本发明的具体实施例,对本发明及其保护范围无任何限制,本领域的普通技术人员在理解本发明基本构思的情形下,可以对这些进行一些显而易见的变化和改动,这些都属于本发明的范围内,本发明的保护范围仅由权利要求来限定。
将如图1所示的金属板1用模具冲切,将不需要的金属冲掉,形成如图2所示的支架雏形,其中电极2所在的金属部位还未被折弯竖立,电极与电极间通过冲切而彼此间隔开,并仍与金属板整体相连而固定,形成图2所示的支架雏形。
然后,例如用模具进行冲压和折弯,将该金属板1中的电极2折弯成截面为倒“L”形的电极2(如图3所示)。然后用模具在一部分电极的顶面进行冲压,而形成凹面杯状型3的结构(如图4所示)。
根据一优选实施例,图11展示了竖立电极截面是“丨”形,电极顶面固晶载体是凹面杯状型3的示意图。
另外,图12为竖立电极截面是“丨”形,电极顶面固晶载体是平台状型的示意图。图13为将竖立电极截面是“丨”形,电极顶面固晶载体是塔尖型的示意图。图14为竖立金属电极截面为倒“L”形,电极顶面固晶载体是平台状型的示意图。图15为竖立金属电极截面为倒“L”形,电极顶面固晶载体是凹面杯状型的示意图。
在得到如图4所示的结构后,对支架2的电极焊点进行镀银处理,然后置入注塑机的注塑模具中,注入原料注塑,胶体4镶嵌包裹在金属板1上,胶体4内形成一塑料杯8,在塑料杯8里的支架电极2凸起悬空,这样,就在该金属板1上形成了一种新型的SMD-LED支架(如图5所示)。
然后将LED芯片5固晶在LED支架的凹面杯3内(如图6所示)→进行焊线工序,用金属线6将LED芯片5与正、负极金属电极2焊接连通(如图7所示)→测试检查→将封装胶水滴入胶体4的塑料杯8中,固化,封装胶水将凸起的电极2、芯片5、金属合金线6同时牢固的固定包裹在一起(如图8所示)。
然后,用模具分切,而形成单粒的新型贴片LED灯,例如如图9中标号2.1所示的金属焊脚只在LED底部的一面上结构类型的单粒贴片型LED灯。根据另一实施例,也可以折弯后再分切,而形成例如如图10所示的单粒的贴片型LED灯。图10为根据本发明的该实施例,将连片LED在焊脚处折弯至LED侧面,形成将同一焊脚折弯成底面和侧面两个焊接面,然后分切下来,形成同一焊脚有两个焊接面的新型贴片LED。
然后再分光→编带→包装→入库,制作成一种电极被全包裹封装的新型表面贴装LED灯珠。
以上结合附图针对电极被全包裹封装的LED支架及贴片LED灯的若干具体实施例对本发明进行了详细的描述。但是,本领域技术人员应当理解,以上所述仅仅是举例说明和描述一些具体实施方式,对本发明的范围,尤其是权利要求的范围,并不具有任何限制。
Claims (10)
1.一种电极被全包裹封装的LED支架的制造方法,其特征在于,包括:
在金属板上冲切并折弯竖立形成彼此间隔开的正、负极金属电极,其中一部分电极是LED的导电电极,另一部分电极既是安装LED芯片的固晶载体又是导电电极,其中,竖立的正、负极金属电极与金属板形成大于0度且小于180度的角度;
注塑形成注塑杯,其中,金属电极在所述的注塑杯里形成悬空结构,这样就形成了一种新型的SMD-LED支架。
2.根据权利要求1所述的LED支架的制造方法,其特征在于:竖立的金属电极的截面是“丨”形的、或者是倒“L”形的。
3.根据权利要求1所述的LED支架的制造方法,其特征在于:所述固晶载体是凹面杯状型、或者是平台状型、或者是塔尖型。
4.一种电极被全包裹封装的贴片型LED灯的制造方法,其特征在于,包括:
在金属板上冲切并折弯竖立形成彼此间隔开的正、负极金属电极,一部分电极是LED的导电电极,另一部分电极既是安装LED芯片的固晶载体又是导电电极,其中,竖立的正、负极金属电极与金属板形成大于0度且小于180度的角度;
注塑形成注塑杯,其中,金属电极在所述的注塑杯里形成悬空结构,这样就形成了一种新型的SMD-LED支架;
将LED芯片固晶在固晶载体内;
用金属焊线将LED芯片与正、负电极焊接连通;
用封装胶水将正、负金属电极、LED芯片和焊线形成全方位整体包封的封装结构;
其中,将多个相连的LED封装结构从金属板上分切下来而得到贴片型LED灯。
5.根据权利要求4所述的方法,其特征在于:所述的金属焊脚是只设置在LED底部的一面上的结构类型。
6.一种电极被全包裹封装的贴片型LED灯的制造方法,其特征在于,包括:
在金属板上冲切并折弯竖立形成彼此间隔开的正、负极金属电极,其中一部分电极是LED的导电电极,另一部分电极既是安装LED芯片的固晶载体又是导电电极,其中,竖立的正、负极金属电极与金属板形成大于0度且小于180度的角度;
注塑形成注塑杯,其中,金属电极在所述的注塑杯里形成悬空结构,这样就形成了一种新型的SMD-LED支架;
将LED芯片固晶在所述固晶载体内;
用金属焊线将LED芯片与正、负电极焊接连通;
用封装胶水将正、负金属电极、LED芯片和焊线形成全方位整体包封的封装结构;
其中,将多个相连的贴片型LED封装结构,从焊脚处折弯至LED侧面形成将同一焊脚折弯成两个焊接面的结构,然后在从金属板上分切下来,形成同一焊脚有两个焊接面的新型贴片LED。
7.根据权利要求5所述的方法,其特征在于:所述的金属焊脚是将焊脚折弯并贴在LED侧面而使同一焊脚形成底面和侧面两个焊接面的结构类型。
8.一种电极被全包裹封装的贴片型LED灯,包括:
与LED底面形成大于0度且小于180度的角度的竖立正、负极金属电极(2);
用于与外部连接的金属焊脚(2.1);
注塑形成的塑胶体(4),其中,在塑胶体(4)上设置塑料反射杯(8);
固晶焊线在竖立金属电极上的LED芯片(5);
将正、负金属电极(2)、LED芯片(5)和焊线(6)形成全方位整体包封的封装胶水(7)。
9.根据权利要求8所述的贴片型LED灯,其特征在于:所述的封装胶水一次滴入杯里成型。
10.根据权利要求8所述的贴片型LED灯,其特征在于:所述的封装胶水分两次滴入杯里完成封装,即,先滴荧光粉胶固化后,再滴透光胶。
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