TWI323932B - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
TWI323932B
TWI323932B TW94108300A TW94108300A TWI323932B TW I323932 B TWI323932 B TW I323932B TW 94108300 A TW94108300 A TW 94108300A TW 94108300 A TW94108300 A TW 94108300A TW I323932 B TWI323932 B TW I323932B
Authority
TW
Taiwan
Prior art keywords
electrode
semiconductor wafer
semiconductor device
semiconductor
lead terminals
Prior art date
Application number
TW94108300A
Other languages
English (en)
Chinese (zh)
Other versions
TW200605295A (en
Inventor
Isao Ochiai
Original Assignee
Sanyo Electric Co
Kanto Sanyo Semiconductors Co
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Filing date
Publication date
Application filed by Sanyo Electric Co, Kanto Sanyo Semiconductors Co filed Critical Sanyo Electric Co
Publication of TW200605295A publication Critical patent/TW200605295A/zh
Application granted granted Critical
Publication of TWI323932B publication Critical patent/TWI323932B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F11/00—Treatment of sludge; Devices therefor
    • C02F11/02—Biological treatment
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
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    • H01L23/49541—Geometry of the lead-frame
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    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Molecular Biology (AREA)
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  • Water Supply & Treatment (AREA)
  • Chemical & Material Sciences (AREA)
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  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
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JP2010040862A (ja) * 2008-08-06 2010-02-18 Fujikura Ltd 半導体装置
KR101014941B1 (ko) * 2008-10-29 2011-02-15 주식회사 케이이씨 반도체 장치 및 그 제조 방법
JP5529494B2 (ja) * 2009-10-26 2014-06-25 株式会社三井ハイテック リードフレーム
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US5095402A (en) * 1990-10-02 1992-03-10 Rogers Corporation Internally decoupled integrated circuit package
JPH0851179A (ja) 1994-08-08 1996-02-20 Sanyo Electric Co Ltd 集積回路装置およびリードフレーム
US5973396A (en) * 1996-02-16 1999-10-26 Micron Technology, Inc. Surface mount IC using silicon vias in an area array format or same size as die array
KR100186309B1 (ko) * 1996-05-17 1999-03-20 문정환 적층형 버텀 리드 패키지
JP3173410B2 (ja) * 1997-03-14 2001-06-04 松下電器産業株式会社 パッケージ基板およびその製造方法
JPH10270623A (ja) * 1997-03-24 1998-10-09 Sumitomo Metal Mining Co Ltd ボールグリッドアレイ用リードフレームおよびこれを用いた半導体装置、並びにその製造方法
KR100370852B1 (ko) 1999-12-20 2003-02-05 앰코 테크놀로지 코리아 주식회사 반도체패키지
JP3854054B2 (ja) * 2000-10-10 2006-12-06 株式会社東芝 半導体装置
JP2002270718A (ja) * 2001-03-07 2002-09-20 Seiko Epson Corp 配線基板及びその製造方法、半導体装置及びその製造方法、回路基板並びに電子機器
KR100426330B1 (ko) * 2001-07-16 2004-04-08 삼성전자주식회사 지지 테이프를 이용한 초박형 반도체 패키지 소자
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US6979904B2 (en) * 2002-04-19 2005-12-27 Micron Technology, Inc. Integrated circuit package having reduced interconnects
US6800930B2 (en) * 2002-07-31 2004-10-05 Micron Technology, Inc. Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies
JP2004186422A (ja) * 2002-12-03 2004-07-02 Shinko Electric Ind Co Ltd 電子部品実装構造及びその製造方法

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