JP2009071234A5 - - Google Patents

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Publication number
JP2009071234A5
JP2009071234A5 JP2007240907A JP2007240907A JP2009071234A5 JP 2009071234 A5 JP2009071234 A5 JP 2009071234A5 JP 2007240907 A JP2007240907 A JP 2007240907A JP 2007240907 A JP2007240907 A JP 2007240907A JP 2009071234 A5 JP2009071234 A5 JP 2009071234A5
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit chip
conductive member
functional surface
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007240907A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009071234A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007240907A priority Critical patent/JP2009071234A/ja
Priority claimed from JP2007240907A external-priority patent/JP2009071234A/ja
Priority to US12/230,728 priority patent/US20090072360A1/en
Publication of JP2009071234A publication Critical patent/JP2009071234A/ja
Publication of JP2009071234A5 publication Critical patent/JP2009071234A5/ja
Pending legal-status Critical Current

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JP2007240907A 2007-09-18 2007-09-18 半導体装置 Pending JP2009071234A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007240907A JP2009071234A (ja) 2007-09-18 2007-09-18 半導体装置
US12/230,728 US20090072360A1 (en) 2007-09-18 2008-09-04 Molded semiconductor device including IC-chip covered with conductor member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007240907A JP2009071234A (ja) 2007-09-18 2007-09-18 半導体装置

Publications (2)

Publication Number Publication Date
JP2009071234A JP2009071234A (ja) 2009-04-02
JP2009071234A5 true JP2009071234A5 (enExample) 2009-05-14

Family

ID=40453552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007240907A Pending JP2009071234A (ja) 2007-09-18 2007-09-18 半導体装置

Country Status (2)

Country Link
US (1) US20090072360A1 (enExample)
JP (1) JP2009071234A (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5577839B2 (ja) * 2009-06-05 2014-08-27 大日本印刷株式会社 半導体装置
US8304887B2 (en) * 2009-12-10 2012-11-06 Texas Instruments Incorporated Module package with embedded substrate and leadframe
JP5747319B2 (ja) * 2011-02-04 2015-07-15 国立大学法人三重大学 軸受装置及びそれを備える装置
US20150061069A1 (en) * 2013-09-05 2015-03-05 Allegro Microsystems, Llc Integrating a capacitor in an integrated circuit
DE102014211524B4 (de) * 2014-06-17 2022-10-20 Robert Bosch Gmbh Elektronikmodul mit einer Vorrichtung zur Wärmeabführung von durch eine in einem Kunststoffgehäuse angeordnete Halbleitereinrichtung erzeugter Wärme und Verfahren zur Herstellung eines Elektronikmoduls
US10283699B2 (en) * 2016-01-29 2019-05-07 Avago Technologies International Sales Pte. Limited Hall-effect sensor isolator
JP2017168704A (ja) 2016-03-17 2017-09-21 東芝メモリ株式会社 半導体装置の製造方法および半導体装置
JP6759738B2 (ja) * 2016-06-13 2020-09-23 株式会社デンソー 磁気センサ
JP6776840B2 (ja) * 2016-11-21 2020-10-28 オムロン株式会社 電子装置およびその製造方法
CN110459532A (zh) * 2019-08-27 2019-11-15 业成科技（成都）有限公司 半导体静电防护结构
CN113793843B (zh) * 2021-09-30 2024-07-30 重庆平创半导体研究院有限责任公司 一种抗辐照封装结构及方法
US20250062196A1 (en) * 2021-12-17 2025-02-20 Vishay Silliconix LLC Semiconductor device and method of forming components for semiconductor device
EP4345890A1 (en) * 2022-09-29 2024-04-03 Infineon Technologies Austria AG A semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5291054A (en) * 1991-06-24 1994-03-01 Sanyo Electric Co., Ltd. Light receiving module for converting light signal to electric signal
DE4212948A1 (de) * 1992-04-18 1993-10-21 Telefunken Microelectron Halbleiterbaugruppe, insbesondere Fernsteuer-Empfangsmodul
JP3278363B2 (ja) * 1996-11-18 2002-04-30 三菱電機株式会社 半導体加速度センサ
US7883278B2 (en) * 2005-07-04 2011-02-08 Fuji Xerox Co., Ltd. Optical module and optical transmission device
EP1795496A2 (en) * 2005-12-08 2007-06-13 Yamaha Corporation Semiconductor device for detecting pressure variations

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