JP2010050288A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2010050288A5 JP2010050288A5 JP2008213409A JP2008213409A JP2010050288A5 JP 2010050288 A5 JP2010050288 A5 JP 2010050288A5 JP 2008213409 A JP2008213409 A JP 2008213409A JP 2008213409 A JP2008213409 A JP 2008213409A JP 2010050288 A5 JP2010050288 A5 JP 2010050288A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- radiating plate
- relay electrode
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 claims 15
- 238000004519 manufacturing process Methods 0.000 claims 5
- 239000004020 conductor Substances 0.000 claims 3
- 239000011810 insulating material Substances 0.000 claims 3
- 238000000034 method Methods 0.000 claims 2
- 238000004080 punching Methods 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008213409A JP2010050288A (ja) | 2008-08-22 | 2008-08-22 | 樹脂封止型半導体装置およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008213409A JP2010050288A (ja) | 2008-08-22 | 2008-08-22 | 樹脂封止型半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010050288A JP2010050288A (ja) | 2010-03-04 |
| JP2010050288A5 true JP2010050288A5 (enExample) | 2011-08-04 |
Family
ID=42067137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008213409A Withdrawn JP2010050288A (ja) | 2008-08-22 | 2008-08-22 | 樹脂封止型半導体装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010050288A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106298723A (zh) * | 2015-05-13 | 2017-01-04 | 无锡华润安盛科技有限公司 | 一种双岛引线框框架 |
| DE112016007133B4 (de) * | 2016-08-10 | 2021-08-12 | Mitsubishi Electric Corporation | Halbleitervorrichtung |
| JP7325384B2 (ja) * | 2020-07-22 | 2023-08-14 | 三菱電機株式会社 | 半導体装置の製造方法 |
| CN115346948B (zh) * | 2022-10-14 | 2023-04-07 | 吉光半导体(绍兴)有限公司 | 一种半桥模块 |
-
2008
- 2008-08-22 JP JP2008213409A patent/JP2010050288A/ja not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9006870B2 (en) | Stacked multi-chip packaging structure and manufacturing method thereof | |
| CN101944514B (zh) | 半导体封装结构以及封装制作工艺 | |
| KR102402841B1 (ko) | 리드 프레임, 반도체 장치, 및 리드 프레임의 제조 방법 | |
| CN207338306U (zh) | 用联动导电连接组件的经封装的半导体装置结构及子组件 | |
| JP2014220439A5 (enExample) | ||
| JP2010267789A5 (enExample) | ||
| JP2009071234A5 (enExample) | ||
| JP2011066327A5 (enExample) | ||
| JP2011142264A5 (enExample) | ||
| US10840172B2 (en) | Leadframe, semiconductor package including a leadframe and method for forming a semiconductor package | |
| JP2016018931A5 (enExample) | ||
| JP2014510407A5 (enExample) | ||
| CN107039368B (zh) | 树脂密封型半导体装置 | |
| JP2007288050A5 (enExample) | ||
| JP2010050288A5 (enExample) | ||
| JP2010206162A5 (enExample) | ||
| JP2009117819A5 (enExample) | ||
| WO2014080476A1 (ja) | 半導体装置及びその製造方法 | |
| JP2012069690A5 (enExample) | ||
| JP2004363365A (ja) | 半導体装置及びその製造方法 | |
| WO2011055984A3 (en) | Leadframe and method of manufacuring the same | |
| JP2010050288A (ja) | 樹脂封止型半導体装置およびその製造方法 | |
| TWI424549B (zh) | 改良導線的二極體封裝及其製作方法 | |
| JP2006196922A5 (enExample) | ||
| CN104882386B (zh) | 半导体器件格栅阵列封装 |