JP2010050288A5 - - Google Patents

Download PDF

Info

Publication number
JP2010050288A5
JP2010050288A5 JP2008213409A JP2008213409A JP2010050288A5 JP 2010050288 A5 JP2010050288 A5 JP 2010050288A5 JP 2008213409 A JP2008213409 A JP 2008213409A JP 2008213409 A JP2008213409 A JP 2008213409A JP 2010050288 A5 JP2010050288 A5 JP 2010050288A5
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
radiating plate
relay electrode
heat radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008213409A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010050288A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008213409A priority Critical patent/JP2010050288A/ja
Priority claimed from JP2008213409A external-priority patent/JP2010050288A/ja
Publication of JP2010050288A publication Critical patent/JP2010050288A/ja
Publication of JP2010050288A5 publication Critical patent/JP2010050288A5/ja
Withdrawn legal-status Critical Current

Links

JP2008213409A 2008-08-22 2008-08-22 樹脂封止型半導体装置およびその製造方法 Withdrawn JP2010050288A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008213409A JP2010050288A (ja) 2008-08-22 2008-08-22 樹脂封止型半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008213409A JP2010050288A (ja) 2008-08-22 2008-08-22 樹脂封止型半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2010050288A JP2010050288A (ja) 2010-03-04
JP2010050288A5 true JP2010050288A5 (enExample) 2011-08-04

Family

ID=42067137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008213409A Withdrawn JP2010050288A (ja) 2008-08-22 2008-08-22 樹脂封止型半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP2010050288A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106298723A (zh) * 2015-05-13 2017-01-04 无锡华润安盛科技有限公司 一种双岛引线框框架
DE112016007133B4 (de) * 2016-08-10 2021-08-12 Mitsubishi Electric Corporation Halbleitervorrichtung
JP7325384B2 (ja) * 2020-07-22 2023-08-14 三菱電機株式会社 半導体装置の製造方法
CN115346948B (zh) * 2022-10-14 2023-04-07 吉光半导体(绍兴)有限公司 一种半桥模块

Similar Documents

Publication Publication Date Title
US9006870B2 (en) Stacked multi-chip packaging structure and manufacturing method thereof
CN101944514B (zh) 半导体封装结构以及封装制作工艺
KR102402841B1 (ko) 리드 프레임, 반도체 장치, 및 리드 프레임의 제조 방법
JP2010267789A5 (enExample)
JP2009071234A5 (enExample)
JP2011066327A5 (enExample)
JP2011142264A5 (enExample)
JP2009302564A5 (enExample)
US10840172B2 (en) Leadframe, semiconductor package including a leadframe and method for forming a semiconductor package
US9472491B2 (en) Semiconductor package with small gate clip and assembly method
JP2016018931A5 (enExample)
CN108630554A (zh) 用联动导电连接组件以形成封装半导体装置的方法及结构
CN107039368B (zh) 树脂密封型半导体装置
JP2007288050A5 (enExample)
JP2010050288A5 (enExample)
JP2010206162A5 (enExample)
JP2009117819A5 (enExample)
JP6040993B2 (ja) 半導体装置及びその製造方法
JP2012069690A5 (enExample)
JP2004363365A (ja) 半導体装置及びその製造方法
TWI424549B (zh) 改良導線的二極體封裝及其製作方法
WO2011055984A3 (en) Leadframe and method of manufacuring the same
JP2010050288A (ja) 樹脂封止型半導体装置およびその製造方法
JP2006196922A5 (enExample)
CN104882386B (zh) 半导体器件格栅阵列封装