TWI424549B - 改良導線的二極體封裝及其製作方法 - Google Patents

改良導線的二極體封裝及其製作方法 Download PDF

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TWI424549B
TWI424549B TW100121436A TW100121436A TWI424549B TW I424549 B TWI424549 B TW I424549B TW 100121436 A TW100121436 A TW 100121436A TW 100121436 A TW100121436 A TW 100121436A TW I424549 B TWI424549 B TW I424549B
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wire
diode
molding compound
lead frame
wires
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TW201205763A (en
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Jae-Ku Kim
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Gne Tech Co Ltd
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Description

改良導線的二極體封裝及其製作方法
本發明有關於一種二極體封裝，尤其一種通過改良導線的結構不僅能夠以簡單的工序製作，而且能夠提高排熱效率的二極體封裝及其製作方法。
最近隨著安裝電子配件時的集成度提高，由於安裝到基板上的各個電子配件釋放出的熱量頻繁發生產品的可靠性降低或者各個電子配件的壽命縮短的問題。特別是如齊納二極體(zener diode)或者發光二極體等通過逆向偏移動作的二極體或者承受大容量電流的功率二極體等的情況下，這種問題尤為嚴重。
圖1是為了說明現有的二極體封裝的示意圖。如圖1所示，現有的二極體封裝在二極體晶片10的上、下兩側面分別焊接導線30、導線40的末端，並且以模塑混料20一起封裝二極體晶片10和導線30、導線40而構成。
參考符號30a及40a表示焊接部。
在工序製作的過程中，兩個導線30、導線40應當對齊而使其排列成一直線，但實務上，要在兩個導線30、導線40對齊至排列成一直線的狀態下進行焊接工序，並在焊接導線30、導線40之後保持其形狀的狀態下以模塑混料20進行封裝是相當繁瑣的作業。
此外，導線30、導線40呈細的導線形狀，因此排熱效率不佳。為了提高排熱效率需要導線30、導線40更粗，此時，導線焊接部30a、焊接部40a需要具備相當的厚度，同樣地，二極體晶片10的尺寸也必須變大。因此當二極體晶片10為小型時很難提高排熱效率。
如上所述，現有的二極體封裝的製作工序非常繁瑣，並且難以提高排熱效率。
本發明的目的在於通過改良導線的結構，不僅能夠以簡單的工序製作而且還能夠提高排熱效率的二極體封裝及其製作方法。
為了實現上述目的的本發明的特徵在於，一種二極體晶片通過模塑混料密封，連接到上述二極體晶片的導線延長至上述模塑混料的外部而構成的二極體封裝，尤其上述導線劃分成上部導線和下部導線，上述上部導線和下部導線為長度較長的扁形板狀而分別具備互相相向的第一端和第二端，上述二極體晶片的上面粘貼上述上部導線的第一端的下面，在上述二極體晶片的下面粘貼上述下部導線的第一端的上面，上述上部導線的第二端和上述下部導線的第二端向模塑混料的一側方向向外延伸。
較佳者，在上述上部導線的第一端由上到下以半球形凹陷而形成向下以半球形突出的半球形接觸口，此時在上述半球形接觸口的中央形成貫通孔。
在上述上部導線和下部導線的第二端分別形成結合孔。
較佳者，上述上部導線從上述第一端到第二端時具備在上述模塑混料的內部向下彎曲的彎曲部，從而使上述上部導線和下部導線的第二端從上述模塑混料向相反方向在相同的高度向外部延伸。
為了實現上述目的，本發明的二極體封裝製作方法包括，準備上述上部導線的第二端連續地向一側連接而使多個上部導線並列連接而構成的上部導線架；和上述下部導線的第二端連續地向一側連接而使多個上部導線並列連接而構成的下部導線架，並對齊上述上部導線架和下部導線架而使在上述下部導線的第一端的上面粘貼二極體晶片，上述上部導線的半球形接觸口粘貼到上述二極體晶片的上面的步驟；通過上述上部導線的半球形接觸口和上述貫通孔在上述二極體晶片進行錫焊的步驟；在上下側以模塑混料結合存在上述二極體晶片的部位而封裝的步驟；及切斷上述上部導線架和下部導線架的第二端的連接部位而解除上述上部導線和下部導線的並列連接的步驟。
本發明的功效在於，由於上述上部導線和下部導線為扁平形的平版形狀，其可以在平版表面上進行排熱，因此比起導線形態即使厚度薄也能提高排熱效率。並且在將上述上部導線架和下部導線架配置成是上述上部導線和下部導線粘貼到上述二極體晶片的上面和底面後僅通過一次接合工序就可以以模塑混料封裝，因此製作工序簡單。由此提高生產率而降低製作成本，並且通過提高排熱效率而提升產品的耐久性及可靠性。
根據本發明的二極體封裝在厚度薄的同時具備高的排熱效率，因此可適用於最近流行的智慧手機、數位電視等上作為智慧二極體使用，也可以作為太陽能電池的旁路二極體(bipass diode)使用。
以下，參照附圖詳細說明本發明的較佳實施例。以下實施例僅僅為了理解本發明的內容而提供，本發明所屬技術領域的技術人員可以在本發明的技術思想內進行諸多變形。因此本發明的權利要求範圍將不僅限於以下之實施例。
圖2是為了說明本發明的二極體封裝的平面圖。圖3是根據圖2的A-A’線的剖面圖。如圖2及圖3所示，與習知的導線形態不同，根據本發明的上部導線130、下部導線140呈長度長的扁的板狀，並劃分為上部導線130和下部導線140。
上部導線130的第一端下面粘貼到二極體晶片110的上面並且在第二端形成貫通的結合孔131。下部導線140的第一端上面粘貼到二極體晶片110的底面並且在第二端形成貫通的結合孔141。粘貼有上部導線130和下部導線140的二極體晶片110通過模塑混料120封裝而密封，從而使上部導線130及下部導線140的第二端分別向外部延伸。
上部導線130從上述第一端延伸到第二端側時，在模塑混料120的內部形成一從二極體晶片110的上方向底部彎曲的彎曲部A，進而使上部導線130和下部導線140在模塑混料120的二側，朝向相反方向，並以相同的高度向外部延伸。
圖4是為了說明上部導線架的平面圖。圖5是根據圖4的A-A’線的橫截面圖。參照圖4及圖5，上部導線架的上部導線130的第二端連續地向一側連接而有多個上部導線130並列連接而構成。
在上部導線130的第一端形成有以半球形由上到下凹陷而向下以半球形突出的半球形接觸口132，並在半球形接觸口的中央形成貫通孔133。
上部導線130在從第一端到第二端側時具有向下彎曲的彎曲部A。這是由於上部導線130的半球形接觸口132粘貼到二極體晶片110的上面，因此為了在上部導線130從模塑混料120向外部延伸時能夠在與下部導線140相同的高度延伸。為此，上部導線130的彎曲部A在半球形接觸口132適當分離而形成而能夠位於模塑混料120的內部。
圖6是為了說明下部導線架的平面圖。圖7是根據圖6的A-A’線的橫截面圖。參照圖6及圖7，下部導線架的下部導線140的第二端連續地向一側連接而有多個下部導線140並列連接而構成。二極體晶片110放置於下部導線140的第二端的上面。
由於上部導線130向下彎曲，因此下部導線140不需要向上彎曲而是呈現出平整的形態。如果上部導線130為平整的形態，則下部導線140從第一端到第二端側時向上彎曲。
圖8是為了說明圖4的上部導線架和圖5的下部導線架的組裝過程的平面圖。圖9是根據圖8的A-A’線的橫截面圖。如圖8及圖9所示，配置成在下部導線140的第一端放置二極體晶片110的狀態下使上部導線130的半球形接觸口132接觸到二極體晶片110的上面而使上部導線130和下部導線140一對一地對應。此時上部導線130和下部導線140的第二端互相向相反方向相向而使上部導線130和下部導線140直線排列。
在此狀態下，進行在半球形接觸口132的凹陷部入口接合上部導線130和二極體晶片110的錫焊(soldering)。此時錫焊通過貫通孔133而實現。貫通孔133的尺寸雖然小，但是半球形接觸口132的凹陷部入口較大，因此在上述錫焊時的工序餘地較大而可以方便的進行錫焊工序。當然，下部導線140和二極體晶片110的接合工序也在上部導線130的設置之前或設置之後進行。
如此接合上部導線130和下部導線140，由於下部導線140在底下支撐二極體晶片110，因此即使懸浮在空間上也與現有的情形不同，其產品的形狀保持不變。如果此時在上方和下方同時以模塑混料裝配，則能夠以一次裝配工序就可以實現通過模塑混料120的封裝。之後沿圖8的切線切割就可以得到如圖3的根據本發明的二極體封裝。沿切線切割之後可以單獨進行通過模塑混料120的封裝，但是前者更適用於大量生產。
圖10是為了說明根據本發明的二極體封裝的實施例圖。如圖10所示，為了提高排熱效率，即使增加上部導線130和下部導線140的寬幅也不會增加厚度，因此能夠容易的上下彎曲而根據情況適當的彎曲上部導線130和下部導線140並通過緊固單元150以多種形態安裝到基板上，例如圖10之(a)或(b)所示。
根據如上所述的本發明，由於上部導線130和下部導線140為扁的板形狀而面上排熱，因此比起線形態的情形即使厚度薄也可以提高排熱效率。並且，在配置上部導線架和下部導線架而使上部導線130和下部導線140粘貼到二極體晶片110的上面和底面之後，通過上下的一次接合工序就能夠以模塑混料120封裝，因此製作工序簡單。由此提高生產率而降低製作成本，並且通過提高排熱效率而提升產品的耐久性及可靠性。
根據本發明的二極體封裝在厚度薄的同時具備高的排熱效率，因此可適用於最近流行的智慧手機、數位電視等上作為智慧二極體使用，也可以作為太陽能電池的旁路二極體(bipass diode)使用。
110．．．二極體晶片
120．．．模塑混料
130．．．上部導線
131,141．．．結合孔
132．．．半球形接觸口
133．．．貫通孔
140．．．下部導線
150．．．緊固單元
A．．．彎曲部
圖1是為了說明現有的二極體封裝的示意圖。
圖2是為了說明本發明的二極體封裝的平面圖。
圖3是根據圖2的A-A’線的橫截面圖。
圖4是為了說明上部導線架的平面圖。
圖5是根據圖4的A-A’線的橫截面圖。
圖6是為了說明下部導線架的平面圖。
圖7是根據圖6的A-A’線的橫截面圖。
圖8是為了說明圖4的上部導線架和圖5的下部導線架的組裝過程的平面圖。
圖9是根據圖8的A-A’線的橫截面圖。
圖10是為了說明根據本發明的二極體封裝的實施例圖。
110．．．二極體晶片
120．．．模塑混料
130．．．上部導線
131,141．．．結合孔
132．．．半球形接觸口
140．．．下部導線

Claims (4)

  1. 一種改良導線的二極體封裝，係透過一模塑混料密封一二極體晶片，其中連接到所述二極體晶片的導線係延伸到所述模塑混料的外部而構成所述之二極體封裝，其特徵在於：所述導線係劃分成一上部導線和一下部導線，所述上部導線和下部導線為長度較長的扁形板狀而分別具備互相相向的第一端和第二端，所述二極體晶片的上面粘貼所述上部導線的第一端的下面，在所述二極體晶片的下面粘貼所述下部導線的第一端的上面，所述上部導線的第二端和所述下部導線的第二端分別向模塑混料的二側方向向外延伸，其中，在所述上部導線的第一端形成由上到下以半球形凹陷而向下以半球形突出的半球形接觸口，此時在所述半球形接觸口的中央形成一用以焊接所述二極體晶片之貫通孔；且在所述上部導線的第二端和下部導線的第二端分別形成一結合孔。
  2. 如申請專利範圍第1項所述的二極體封裝，其特徵在於，所述上部導線從所述第一端延伸到第二端時，在所述模塑混料的內部形成一向下彎曲的彎曲部，從而使所述上部導線和下部導線的第二端從所述模塑混料二側向相反方向，並且在相同的高度向外部延伸。
  3. 如申請專利範圍第1項所述的二極體封裝，其特徵在於，所述下部導線從所述第一端延伸到第二端時，在所述模塑混料的內部形成一向上彎曲的彎曲部，從而使所述上部導線和下部導線的第二端從所述模塑混料二側向相反方向，並且在相同的高度向外部延伸。
  4. 一種申請專利範圍第1項所述的二極體封裝的方法，其特徵在於，包括：準備所述上部導線的第二端連續地向一側連接而使多個上部導線並列連接而構成的上部導線架；所述下部導線的第二端連續地向一側連接而使多個上部導線並列連接而構成的下部導線架，並對齊所述上部導線架和下部導 線架而使在所述下部導線的第一端的上面粘貼二極體晶片，所述上部導線的半球形接觸口粘貼到所述二極體晶片的上面的步驟；通過所述上部導線的半球形接觸口和所述貫通孔在所述二極體晶片進行錫焊的步驟；在上下側以模塑混料結合存在所述二極體晶片的部位而封裝的步驟；及切斷所述上部導線架和下部導線架的第二端的連接部位而解除所述上部導線和下部導線的並列連接的步驟。
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