4* 41 1 3 9 A7 ______ B7 五、發明説明（I ) 本發明係有關「表面黏著型排列二極體之製造方法」， 特別是指一種將左、右長條形料帶結合晶片，在外緣射出 成形爲長條狀，並在每二片晶片之間的外緣設有凹溝，以 供使用一極體時，依所需使用數量由長條狀排列二極體上 之凹溝處切斷，便可取得所需之表面黏著型排列二極體。 按，在多數的電子產品、器具上，二極體是不可或缺 的電子零件’藉由二極體所具有的截波整流功能，以讓電 子產品在使用上電流更爲穩定，而依各種不同的電子產品 所需的二極體零件也有不同，有一次一個二極體分開使用， 也有一次二個或數個二極體二起使用者，對二極體之使用 並無特定之數目，因此在一次需要使用多個二極體的產品 上，必須將數個二極體逐一安裝結合，並要調整數個二極 體間之距離，以免二極體太接近而相互碰撞，或者距離過 大佔用過多空間，線路也不好安排，是以，對於二極體之 使用，也存在有些技術上及製造上的問題、麻煩。 而在目前所使用的二極體(請參閱第一圖所示），係將二 極體(A)之導片(B)以沖壓方式製成單個，並於二個成型之導 片(B)間設置一晶片(C)，然後，在二導片(B)外側以絕緣膠 層(D)塑模成型，經塑模成型後，在把二導片(B)之極腳(E) 折拗於絕緣膠層(D)底部’以製成二極體(A)。 惟，如此製造方式所製成的二極體均是單一個體，當電 子產品上需要多數個二極體一起使用時’就必須將每一個 二極體一一的排列、對齊’其中所耗用的時間、人力，也 相當可觀，並增加了產品之成本’頗不符經濟效益。其中 3 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再本頁}4 * 41 1 3 9 A7 ______ B7 V. Description of the invention (I) The present invention relates to the "method of manufacturing a surface-adhesive array of diodes", in particular, a method of combining left and right strips with a wafer on the outside The edge injection is formed into a long shape, and a groove is provided on the outer edge between each two wafers. When a pole is used, the grooves on the diode are arranged in a long shape according to the required number of uses. After cutting, the desired surface-adhesive array diode can be obtained. Press, in most electronic products, appliances, diodes are indispensable electronic parts. With the interception and rectification function of diodes, the current of electronic products can be more stable in use. Different electronic products require different diode parts. One diode is used separately at a time, and two or more diodes are used at the same time. There is no specific number of diodes used. Therefore, on products that require multiple diodes at one time, several diodes must be installed and combined one by one, and the distance between the two diodes must be adjusted to prevent the diodes from being too close and colliding with each other, or the distance is too large. It takes up too much space, and the wiring is not easy to arrange. Therefore, there are also some technical and manufacturing problems and troubles for the use of the diode. At present, the diodes (see the first figure) are formed by stamping the diode (B) of the diode (A) into a single piece, and forming the two pieces (B ), A wafer (C) is set, and then an insulating rubber layer (D) is molded on the outside of the second conductive sheet (B). After the plastic mold is formed, the pins (E) of the second conductive sheet (B) are molded. Folded on the bottom 'of the insulating glue layer (D) to make a diode (A). However, the diodes produced by this manufacturing method are all single entities. When electronic diodes require multiple diodes to be used together, it is necessary to arrange and align each diode one by one. The time and manpower are also considerable, and the cost of the product is increased, which is not in line with economic benefits. Among them, 3 paper sizes are applicable to China National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before this page}
L 、-3-口 經濟部智慧財產局員工消費合作社印製 441 13 9 A7 B7 五、發明説明（么） 也存在不少的缺失，如： (1) 、製造過程採單個二極體製做，一一的製成，不僅耗 時、費工，工作效率也不佳。 (2) 、其二極體成型後，導片的端腳必須彎折於絕緣膠層 下方，在彎折的過程中，若左、右彎折不對稱’會使成型 之二極體左、右邊的高低不平，當二極體置放在電路板上 時，容易產生左、右晃動情況，且若銜接未妥當，也會使 電流的流通受影響。 (3) 、二極體均爲單個製造成型，且體積較大，因此在一 次要使用多個二極體時，必須逐一排置多個二極體，而排 列的前後位置、距離、空間等均需考量，造成工作人員之 不方便，耗時且費工。 (4) 、多數個二極體逐一裝置於電路板上後，必須.一一檢 視每一個二極體間是否分開，極腳是否重疊等問題，以免 產生誤差，又增加了工作人員之作業時間。 (5) 、二極體製造時必須彎折極腳，因此在製作過程所產 生折斷極腳，或者彎折不當等情況，會讓不良品率增加， 頗浪費資源。 有鑑於傳統二極體之製造方式的麻煩，且在使用時所衍 生的問題等，均會對二極體在使用時的品質有所影響，必 須予以改善。 本創作者以多年從事於該類產品設計、製造、販售等 豐碩經驗，遂投注大量心力予硏究、改良、創設，並經多 次實驗、檢測、試用後，硏發出本發明之二極體製造方式。 4 本紙張尺度適用中國國家榡準（CNS ) Μ規格（210X297公釐） (請先閱讀背面之注意事項再本頁)Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs of the Ministry of Economic Affairs of the People's Republic of China 441 13 9 A7 B7 V. There are also many shortcomings in the description of the invention, such as: (1) The manufacturing process uses a single two-pole system Making one by one is not only time-consuming and labor-intensive, but also inefficient. (2) After the diode is formed, the ends of the guide must be bent under the insulating rubber layer. During the bending process, if the left and right bends are not symmetrical, it will cause the left and right of the formed diode. The level on the right is uneven. When the diode is placed on the circuit board, it is easy to cause left and right shaking. If the connection is not proper, the current flow will be affected. (3) The diodes are manufactured in a single shape and have a large volume. Therefore, when multiple diodes are used at one time, multiple diodes must be arranged one by one, and the front and rear positions, distances, and spaces of the array must be arranged. All need to be considered, causing inconvenience to staff, time-consuming and labor-intensive. (4) After most diodes are installed on the circuit board one by one, you must check whether each diode is separated from each other and whether the pins overlap, so as to avoid errors and increase the working time of the staff. . (5) The poles must be bent during the manufacture of the diode. Therefore, the broken poles or improper bending during the manufacturing process will increase the rate of defective products and waste resources. In view of the inconvenience of the traditional manufacturing method of diodes, and the problems arising from the use, the quality of the diodes during use will be affected and must be improved. With many years of experience in designing, manufacturing, and selling such products, the creator has invested a lot of effort in research, improvement, and creation, and after many experiments, tests, and trials, he has issued the second pole of the present invention. Body manufacturing method. 4 This paper size applies to China National Standards (CNS) M specifications (210X297 mm) (Please read the precautions on the back before this page)
、1T 線 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消費合作社印製 44113 9 A7 B7 -------------------------- 五、發明説明（3 ) 本發明之主要目的在於：將左、右長條形料帶結合晶 片，在外緣射出成形爲長條狀，並在每二片晶片之間的外 緣設有凹溝，以供使用二極體時，依所需使用數量由長條 狀排列二極體上之凹溝處切斷，便可取得所需之表面黏著 型排列二極體。 本發明之次要目的在於：二極體以排列狀製成長條型， 在每一個二極體間保持一定間距，不會相互干擾，減少排 列二極體之麻煩。 本發明之再一目的在於：可視所需要的二極體數量， 由長條型排列二極體上取下，置放在電路板上時，不需調 整每一個二極體間的距離，減少工作人員的工作時間及逐 一對正二極體時的麻煩。 本發明之其它目的與詳細之構造，將藉由以下詳細說 明而使之更爲明確，同時參閱所附各圖，俾可使本發明之 技術內容更進一步地揭示明瞭： 圖示說明： 第一圖爲昔式二極體之製造方式示意圖。 第二圖所示係爲本發明之結構立體圖。 第三圖所示係爲本發明之一極體結構剖面圖。 第四圖所示係爲本發明之結構分解圖。 第五圖所示係爲本發明之排列二極體上製造凹溝之示意 圖。 第六圖所示係爲本發明之排列二極體切斷方式示意圖。 5 (請先閲讀背面之注意事項再本頁) 裝· 線 本紙張尺度適用中國國家標準（CNS ) Λ4規格（210X297公釐） A7 B7 44113 9 五、發明説明（4) 第七圖所示係爲本發明之二極體結構立體圖。 第八圖所示係爲本發明之二極體使用型式圖。 圖號說明： (10)二極體 (20)長條狀排歹 仁極體 (21)凹溝 (30)左料帶 (31)左接觸端 (32)左搭接端 (40)右料帶 (41)右接觸端 (42)右搭接端 (70)絕緣外層 (50)晶片 (60)導電膠層 (Α)二極體 (D)絕源膠層 (Β)導片 (Ε)極腳 (C)晶片 請參閱第二圖、第三圖及第四圖所示，本發明之二極 體（10)主要係將呈長條形之左料帶(30)、右料帶(40)內側沖 壓出相對應間隔排列之左接觸端(31)、右接觸端(41)，再於 左料帶(3〇)與右料帶(4〇)得每一對左搭接端(3幻及右搭接端 (42)間設置晶片(5〇)後’在左料帶(3〇)、右料帶(4〇)外緣射出 成型絕緣外層(70)形成長條狀，使左料帶(3〇)、右料帶(4〇) 之左接觸端(31)、右接觸端(41)露在外緣，並且於每二片晶 片(50)之間的外緣底部設有凹溝(21)，並藉凹溝(21)將左料 帶(30)之左接觸端(31)、右料帶(40)之右接觸端(41)予以隔離 絕緣成連結狀但互不導通的複數個排列二極體(20)，而能視 使用數量由凹溝(21)處切斷，即形成該等數量之表面黏著型 排列二極體（10)。 6 本紙張尺度適用中國國家榡準（CNS ) Μ規格（2ΐ0χ297公麓） J---------^-- (請先閲讀背面之注意事項再本買) 訂 經濟部智慧財產局員工消費合作社印製 44113 9 at B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（5 ) 再請參閱第三圖、第四圖所示，本發明之二極體（10)係 包括左料帶(30)、右料帶(40)、晶片(50)等構件，其中： 左料帶(30)，具有左搭接端(32)，外側並具有左接觸端 (31)，藉左接觸端(31)連接數個左料帶(30)，而於該左接觸 端(31)上則排列連接有數個左搭接端(32)。 右料帶(40)，具有右搭接端(42)，外側並具有右接觸端 (41)，藉右接觸端(41)連接數個右料帶(40)，而於該右接觸 端(41)上則排列連接有數個右搭接端(42)。 晶片(50)，係置於每一組相對應的左搭接端(32)與右搭 接端(42)間，經左搭接端(32)與右搭接端(42)接合。 藉由上述構件’將左料帶(30)與右料帶(40)上之數個左 搭接端(32)與右搭接端(42)相對置放，並於每一個左料帶(30) 的左搭接端(32)、與每一個右料帶(4〇)的右搭接端(42)間置 放晶片(50)，藉由晶片(50)將左搭接端(32)與右搭接端(42)接 合，再於數個排列連接的左料帶(3〇)、右料帶(40)外緣塑模 絕緣外層(7〇)，而一體成型爲長條狀排列二極體(20)(如第五 圖所示），然後在長條狀排列二極體(20)上，於每二個片晶 片（50)的外緣底部設有凹溝(21)，同時將左接觸端(31)與右 接觸端(41)切斷，使相鄰之左料帶(30)及右料帶(40)均分離， 即形成排列連接的多數個單獨之二極體（10)(如第六圖所 示）。 在左料帶(30)之左搭接端(32)、右料帶之右搭接端(42) 間連接有晶片(5〇)，晶片(5〇)與左搭接端(32)、右搭接端(42) 可直接焊接固定，也可藉由導電膠層(60)予以固定（如第三 7 (請先閲讀背面之注意事項再本頁) •裝· 訂 -線· 本紙張尺度適用中國國家標準（CNS ) A4規格（210x297公釐） 4 41 1 d A7 B7 五、發明説明（b) 圖所示）。 如第七圖、第八圖所示，欲使用二極體(10)時，在長條 狀排列二極體(20)上選定使用二極體(10)的個數，由凹溝(21) 處切斷，即能得到所需使用數量的二極體（10);並在取下的 二極體（10)中，每一個二極體（10)的電路均爲單獨個體，兩 相鄰的二極體（10)間藉絕緣體連接，使用時二極體（10)間不 會相互干擾。 本發明以排列式左、右料帶配合晶片，製成長條狀排 列二極體，並在長條狀排列二極體上設有凹溝，以當欲使 用二極體時，依選定的二極體數量，由長條狀排列二極體 的包溝處切斷，以取下數個二極體，且相鄰的二極體間並 保持一定的間距，使用時不需調整距離，相當方便實用， 爲全新創設之發明，完全符合發明專利之申請要件，爰依 法向鈞局提呈本案發明專利之申請，尙祈鈞局暨貴審 查委員能惠予審理，並早日賜准本案之發明專利，實感德 便。 (請先閱讀背面之注意事項再^^本頁) £ 經濟部智慧財產局員工消費合作社印製 8 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs of the 1T line Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 44113 9 A7 B7 ----------------------- --- V. Description of the invention (3) The main purpose of the present invention is to combine the left and right long strips with wafers, shoot out and form long strips at the outer edges, and set the outer edges between every two wafers. There are recessed grooves for use of the diode. According to the required number of use, the grooves on the long-arranged diodes are cut to obtain the required surface-adhesive arrayed diodes. A secondary object of the present invention is to make the diodes in an elongated shape in an array shape, maintain a certain distance between each diode, not interfere with each other, and reduce the trouble of arranging the diodes. Yet another object of the present invention is: according to the required number of diodes, it can be removed from the long-arranged diodes, and when placed on the circuit board, there is no need to adjust the distance between each diode, so as to reduce Staff's working hours and trouble when pairing positive diodes. The other objects and detailed structure of the present invention will be made clearer by the following detailed descriptions. At the same time, referring to the accompanying drawings, the technical content of the present invention can be further revealed: Graphical description: First The figure shows the manufacturing method of the past diode. The second figure is a perspective view of the structure of the present invention. The third figure is a cross-sectional view of a polar structure according to the present invention. The fourth figure shows an exploded view of the structure of the present invention. The fifth figure is a schematic diagram of manufacturing grooves on an arrayed diode of the present invention. The sixth figure is a schematic diagram of the array diode cutting method of the present invention. 5 (Please read the precautions on the back first, then this page) The size of the paper for binding and threading is applicable to the Chinese National Standard (CNS) Λ4 specification (210X297 mm) A7 B7 44113 9 V. Description of the invention (4) The system shown in Figure 7 This is a perspective view of the diode structure of the present invention. The eighth figure is a diagram of a diode use pattern of the present invention. Description of drawing number: (10) Diode (20) Strip-shaped barley core polar body (21) Groove (30) Left strip (31) Left contact end (32) Left overlap end (40) Right material With (41) Right contact end (42) Right lap end (70) Insulating outer layer (50) Wafer (60) Conductive adhesive layer (A) Diode (D) Insulating adhesive layer (B) Guide piece (E) For the pin (C) chip, please refer to the second, third and fourth figures. The diode (10) of the present invention is mainly a left strip (30) and a right strip ( 40) The left contact end (31) and right contact end (41) arranged at corresponding intervals are punched out on the inside, and then each pair of left overlap ends (30) and the right strip (40) are obtained. After the chip (50) is set between the 3 magic and right overlap ends (42), the insulating outer layer (70) is formed by injection molding at the outer edges of the left strip (30) and the right strip (40), so that The left contact end (31) and right contact end (41) of the left strip (30) and the right strip (40) are exposed at the outer edges, and are provided at the bottom of the outer edges between every two wafers (50). The groove (21), and the left contact end (31) of the left strip (30) and the right contact end (41) of the right strip (40) are isolated and insulated to form a connection, but not each other. Plural Arrange the diodes (20), and cut off the grooves (21) depending on the quantity used, which will form the surface-adhesive array diodes (10) of these quantities. 6 This paper size applies to China's national standards ( CNS) M specifications (2ΐ0 × 297 feet) J --------- ^-(Please read the precautions on the back before buying this) Order printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs 44113 9 at B7 Economy Printed by the Consumer Cooperative of the Ministry of Intellectual Property Bureau. 5. Description of the invention (5) Please refer to the third and fourth figures. The diode (10) of the present invention includes a left strip (30) and a right strip. (40), wafer (50) and other components, wherein: the left strip (30) has a left overlap end (32), the outer side has a left contact end (31), and a plurality of left are connected by the left contact end (31) A strip (30), and a plurality of left lap ends (32) are arranged and connected to the left contact end (31). The right strip (40) has a right lap end (42), and has an outer side and a right contact. The end (41) is connected to a plurality of right strips (40) by the right contact end (41), and a plurality of right overlapping ends (42) are arranged and connected to the right contact end (41). The chip (50), Tied to each group Between the overlapping end (32) and the right overlapping end (42), the left overlapping end (32) and the right overlapping end (42) are joined. The left strip (30) and the right strip are connected by the above-mentioned member ' The left lap ends (32) on (40) are opposite to the right lap ends (42), and are positioned on the left lap ends (32) of each left strip (30), and on each right strip. The wafer (50) is placed between the right lap end (42) of the belt (40), and the left lap end (32) and the right lap end (42) are joined by the wafer (50), and then arranged in several The outer edges of the left strip (30) and the right strip (40) are molded with an insulating outer layer (70), and integrally formed into a long-arranged diode (20) (as shown in the fifth figure). Then, a groove (21) is provided at the bottom of the outer edge of each of two wafers (50) on the strip-shaped diodes (20), and the left contact end (31) and the right contact end (41) Cut off, so that the adjacent left strip (30) and right strip (40) are separated, that is, a plurality of individual diodes (10) are formed in an array and connected (as shown in the sixth figure). A chip (50) is connected between the left overlap end (32) of the left strip (30) and the right overlap end (42) of the right strip, and the wafer (50) and the left overlap end (32), The right lap end (42) can be fixed directly by welding, or it can be fixed by the conductive adhesive layer (60) (such as the third 7 (please read the precautions on the back before this page) • binding · binding-thread · this paper The dimensions apply to the Chinese National Standard (CNS) A4 specification (210x297 mm) 4 41 1 d A7 B7 V. Description of the invention (b). As shown in the seventh and eighth figures, when the diode (10) is to be used, the number of the diodes (10) to be used is selected on the elongated array of diodes (20), and the grooves (21) are used. ), The required number of diodes (10) can be obtained; and in the removed diodes (10), the circuit of each diode (10) is a separate individual, two phases Adjacent diodes (10) are connected by insulators, and the diodes (10) will not interfere with each other during use. In the invention, the left and right strips of the array are matched with the wafer to form a long-arranged diode, and a groove is provided on the long-arranged diode, so that when the diode is to be used, The number of poles is cut by the long grooves of the diodes to remove several diodes, and adjacent diodes are kept at a certain distance. It is not necessary to adjust the distance during use, which is equivalent. Convenient and practical, it is a newly created invention that fully meets the requirements for the application of an invention patent. I submitted the application for the invention patent to the Bureau in accordance with the law. Patent, real sense. (Please read the notes on the back before ^^ this page) £ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 8 This paper size is applicable to China National Standard (CNS) A4 (210X297 mm)