JP2006196922A5 - - Google Patents

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Publication number
JP2006196922A5
JP2006196922A5 JP2006072498A JP2006072498A JP2006196922A5 JP 2006196922 A5 JP2006196922 A5 JP 2006196922A5 JP 2006072498 A JP2006072498 A JP 2006072498A JP 2006072498 A JP2006072498 A JP 2006072498A JP 2006196922 A5 JP2006196922 A5 JP 2006196922A5
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JP
Japan
Prior art keywords
metal layer
cutting
manufacturing
semiconductor device
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006072498A
Other languages
English (en)
Japanese (ja)
Other versions
JP3869849B2 (ja
JP2006196922A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006072498A priority Critical patent/JP3869849B2/ja
Priority claimed from JP2006072498A external-priority patent/JP3869849B2/ja
Publication of JP2006196922A publication Critical patent/JP2006196922A/ja
Publication of JP2006196922A5 publication Critical patent/JP2006196922A5/ja
Application granted granted Critical
Publication of JP3869849B2 publication Critical patent/JP3869849B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2006072498A 2000-04-25 2006-03-16 半導体装置の製造方法 Expired - Lifetime JP3869849B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006072498A JP3869849B2 (ja) 2000-04-25 2006-03-16 半導体装置の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000124102 2000-04-25
JP2006072498A JP3869849B2 (ja) 2000-04-25 2006-03-16 半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2001078791A Division JP2002016181A (ja) 2000-04-25 2001-03-19 半導体装置、その製造方法、及び電着フレーム

Publications (3)

Publication Number Publication Date
JP2006196922A JP2006196922A (ja) 2006-07-27
JP2006196922A5 true JP2006196922A5 (enExample) 2006-09-21
JP3869849B2 JP3869849B2 (ja) 2007-01-17

Family

ID=36802682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006072498A Expired - Lifetime JP3869849B2 (ja) 2000-04-25 2006-03-16 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP3869849B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5098452B2 (ja) * 2007-06-11 2012-12-12 住友金属鉱山株式会社 半導体装置の製造方法
JP5151438B2 (ja) * 2007-12-10 2013-02-27 大日本印刷株式会社 半導体装置およびその製造方法、ならびに半導体装置用基板およびその製造方法
WO2010150365A1 (ja) * 2009-06-24 2010-12-29 アオイ電子株式会社 半導体装置および半導体装置の製造方法
EP2337068A1 (en) 2009-12-18 2011-06-22 Nxp B.V. Pre-soldered leadless package
JP5779748B2 (ja) 2010-11-02 2015-09-16 リコー電子デバイス株式会社 半導体パッケージ及び電子部品実装体
TWI533380B (zh) * 2011-05-03 2016-05-11 旭德科技股份有限公司 封裝結構及其製作方法
JP2012084938A (ja) * 2012-02-03 2012-04-26 Sumitomo Metal Mining Co Ltd 半導体装置製造用基板

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