JP2009065201A5 - - Google Patents

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Publication number
JP2009065201A5
JP2009065201A5 JP2008297133A JP2008297133A JP2009065201A5 JP 2009065201 A5 JP2009065201 A5 JP 2009065201A5 JP 2008297133 A JP2008297133 A JP 2008297133A JP 2008297133 A JP2008297133 A JP 2008297133A JP 2009065201 A5 JP2009065201 A5 JP 2009065201A5
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JP
Japan
Prior art keywords
island
manufacturing
semiconductor device
islands
element mounting
Prior art date
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Granted
Application number
JP2008297133A
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English (en)
Japanese (ja)
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JP2009065201A (ja
JP4784945B2 (ja
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Priority to JP2008297133A priority Critical patent/JP4784945B2/ja
Priority claimed from JP2008297133A external-priority patent/JP4784945B2/ja
Publication of JP2009065201A publication Critical patent/JP2009065201A/ja
Publication of JP2009065201A5 publication Critical patent/JP2009065201A5/ja
Application granted granted Critical
Publication of JP4784945B2 publication Critical patent/JP4784945B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2008297133A 2008-11-20 2008-11-20 半導体装置の製造方法 Expired - Fee Related JP4784945B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008297133A JP4784945B2 (ja) 2008-11-20 2008-11-20 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008297133A JP4784945B2 (ja) 2008-11-20 2008-11-20 半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2006243624A Division JP4383436B2 (ja) 2006-09-08 2006-09-08 半導体装置

Publications (3)

Publication Number Publication Date
JP2009065201A JP2009065201A (ja) 2009-03-26
JP2009065201A5 true JP2009065201A5 (enExample) 2010-10-14
JP4784945B2 JP4784945B2 (ja) 2011-10-05

Family

ID=40559433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008297133A Expired - Fee Related JP4784945B2 (ja) 2008-11-20 2008-11-20 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4784945B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6744149B2 (ja) * 2016-06-20 2020-08-19 ローム株式会社 半導体装置およびその製造方法
JP7268988B2 (ja) * 2018-11-08 2023-05-08 新光電気工業株式会社 電子部品及び電子部品の製造方法
CN116313940B (zh) * 2023-05-18 2023-08-11 上海聚跃检测技术有限公司 一种引线键合结构的切割方法及切割辅助装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6022822B2 (ja) * 1979-06-13 1985-06-04 日本電気株式会社 リ−ドフレ−ム
JPS62150868A (ja) * 1985-12-25 1987-07-04 Hitachi Micro Comput Eng Ltd 半導体装置用リ−ドフレ−ムとそれを使用する樹脂封止方法
JPH04129233A (ja) * 1990-09-19 1992-04-30 Fujitsu Ltd 半導体ｈブリッジ回路
JP3304705B2 (ja) * 1995-09-19 2002-07-22 セイコーエプソン株式会社 チップキャリアの製造方法
JP3261965B2 (ja) * 1996-02-21 2002-03-04 富士電機株式会社 半導体装置
JP3209696B2 (ja) * 1996-03-07 2001-09-17 松下電器産業株式会社 電子部品の製造方法

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