JP2016503240A5 - - Google Patents

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Publication number
JP2016503240A5
JP2016503240A5 JP2015552768A JP2015552768A JP2016503240A5 JP 2016503240 A5 JP2016503240 A5 JP 2016503240A5 JP 2015552768 A JP2015552768 A JP 2015552768A JP 2015552768 A JP2015552768 A JP 2015552768A JP 2016503240 A5 JP2016503240 A5 JP 2016503240A5
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JP
Japan
Prior art keywords
lead frame
lead
dap
frame
plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2015552768A
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English (en)
Japanese (ja)
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JP2016503240A (ja
JP6261055B2 (ja
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Publication date
Priority claimed from US13/737,697 external-priority patent/US8884414B2/en
Application filed filed Critical
Publication of JP2016503240A publication Critical patent/JP2016503240A/ja
Publication of JP2016503240A5 publication Critical patent/JP2016503240A5/ja
Application granted granted Critical
Publication of JP6261055B2 publication Critical patent/JP6261055B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015552768A 2013-01-09 2014-01-09 集積回路モジュール Active JP6261055B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/737,697 US8884414B2 (en) 2013-01-09 2013-01-09 Integrated circuit module with dual leadframe
US13/737,697 2013-01-09
PCT/US2014/010860 WO2014110247A1 (en) 2013-01-09 2014-01-09 Integrated circuit module

Publications (3)

Publication Number Publication Date
JP2016503240A JP2016503240A (ja) 2016-02-01
JP2016503240A5 true JP2016503240A5 (enExample) 2017-01-26
JP6261055B2 JP6261055B2 (ja) 2018-01-17

Family

ID=51060383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015552768A Active JP6261055B2 (ja) 2013-01-09 2014-01-09 集積回路モジュール

Country Status (4)

Country Link
US (2) US8884414B2 (enExample)
JP (1) JP6261055B2 (enExample)
CN (1) CN104956782B (enExample)
WO (1) WO2014110247A1 (enExample)

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CN105895606A (zh) * 2014-12-29 2016-08-24 飞思卡尔半导体公司 具有带状线的封装半导体器件
JP1537980S (enExample) * 2015-04-20 2015-11-16
JP1537979S (enExample) * 2015-04-20 2015-11-16
US9922904B2 (en) * 2015-05-26 2018-03-20 Infineon Technologies Ag Semiconductor device including lead frames with downset
US10381293B2 (en) * 2016-01-21 2019-08-13 Texas Instruments Incorporated Integrated circuit package having an IC die between top and bottom leadframes
US10134660B2 (en) * 2017-03-23 2018-11-20 Nxp Usa, Inc. Semiconductor device having corrugated leads and method for forming
US10636729B2 (en) * 2017-06-19 2020-04-28 Texas Instruments Incorporated Integrated circuit package with pre-wetted contact sidewall surfaces
US10896869B2 (en) * 2018-01-12 2021-01-19 Amkor Technology Singapore Holding Pte. Ltd. Method of manufacturing a semiconductor device
US10867894B2 (en) * 2018-10-11 2020-12-15 Asahi Kasei Microdevices Corporation Semiconductor element including encapsulated lead frames
DE102019118174B3 (de) * 2019-07-04 2020-11-26 Infineon Technologies Ag Verarbeitung von einem oder mehreren trägerkörpern und elektronischen komponenten durch mehrfache ausrichtung
US11158567B2 (en) 2019-08-09 2021-10-26 Texas Instruments Incorporated Package with stacked power stage and integrated control die
US11715679B2 (en) 2019-10-09 2023-08-01 Texas Instruments Incorporated Power stage package including flexible circuit and stacked die
US11302615B2 (en) 2019-12-30 2022-04-12 Texas Instruments Incorporated Semiconductor package with isolated heat spreader
US11264310B2 (en) 2020-06-04 2022-03-01 Texas Instruments Incorporated Spring bar leadframe, method and packaged electronic device with zero draft angle
US11450593B2 (en) * 2020-07-02 2022-09-20 Infineon Technologies Ag Spacer frame for semiconductor packages
US11611170B2 (en) 2021-03-23 2023-03-21 Amkor Technology Singapore Holding Pte. Ltd Semiconductor devices having exposed clip top sides and methods of manufacturing semiconductor devices
US11848244B2 (en) * 2021-09-30 2023-12-19 Texas Instruments Incorporated Leaded wafer chip scale packages
US12424523B2 (en) * 2021-12-20 2025-09-23 Texas Instruments Incorporated Leadframe strip with complimentary unit design

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US5229329A (en) 1991-02-28 1993-07-20 Texas Instruments, Incorporated Method of manufacturing insulated lead frame for integrated circuits
US5686698A (en) 1994-06-30 1997-11-11 Motorola, Inc. Package for electrical components having a molded structure with a port extending into the molded structure
US5789806A (en) 1995-08-02 1998-08-04 National Semiconductor Corporation Leadframe including bendable support arms for downsetting a die attach pad
JPH1070230A (ja) 1996-08-27 1998-03-10 Hitachi Cable Ltd Ｌｏｃ用リードフレーム
US6603195B1 (en) * 2000-06-28 2003-08-05 International Business Machines Corporation Planarized plastic package modules for integrated circuits
JP3773855B2 (ja) * 2001-11-12 2006-05-10 三洋電機株式会社 リードフレーム
JP2004079760A (ja) * 2002-08-19 2004-03-11 Nec Electronics Corp 半導体装置及びその組立方法
JP4100332B2 (ja) * 2003-11-12 2008-06-11 株式会社デンソー 電子装置およびその製造方法
US7285849B2 (en) * 2005-11-18 2007-10-23 Fairchild Semiconductor Corporation Semiconductor die package using leadframe and clip and method of manufacturing
CN101326636A (zh) * 2005-12-09 2008-12-17 飞兆半导体公司 用于组装顶部与底部暴露的封装半导体的装置和方法
US20070290303A1 (en) 2006-06-07 2007-12-20 Texas Instruments Deutschland Gmbh Dual leadframe semiconductor device package
US20080036078A1 (en) 2006-08-14 2008-02-14 Ciclon Semiconductor Device Corp. Wirebond-less semiconductor package
US20090057855A1 (en) * 2007-08-30 2009-03-05 Maria Clemens Quinones Semiconductor die package including stand off structures
US8049312B2 (en) 2009-01-12 2011-11-01 Texas Instruments Incorporated Semiconductor device package and method of assembly thereof
US8354303B2 (en) 2009-09-29 2013-01-15 Texas Instruments Incorporated Thermally enhanced low parasitic power semiconductor package
US8222716B2 (en) * 2009-10-16 2012-07-17 National Semiconductor Corporation Multiple leadframe package
US8203199B2 (en) 2009-12-10 2012-06-19 National Semiconductor Corporation Tie bar and mold cavity bar arrangements for multiple leadframe stack package
US8304887B2 (en) 2009-12-10 2012-11-06 Texas Instruments Incorporated Module package with embedded substrate and leadframe
WO2011155165A1 (ja) * 2010-06-11 2011-12-15 パナソニック株式会社 樹脂封止型半導体装置及びその製造方法
CN102403298B (zh) * 2010-09-07 2016-06-08 飞思卡尔半导体公司 用于半导体器件的引线框
JP5410465B2 (ja) * 2011-02-24 2014-02-05 ローム株式会社 半導体装置および半導体装置の製造方法

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