JP2006269861A5 - - Google Patents

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Publication number
JP2006269861A5
JP2006269861A5 JP2005087644A JP2005087644A JP2006269861A5 JP 2006269861 A5 JP2006269861 A5 JP 2006269861A5 JP 2005087644 A JP2005087644 A JP 2005087644A JP 2005087644 A JP2005087644 A JP 2005087644A JP 2006269861 A5 JP2006269861 A5 JP 2006269861A5
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JP
Japan
Prior art keywords
lower substrate
semiconductor device
upper plate
mold
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005087644A
Other languages
English (en)
Japanese (ja)
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JP2006269861A (ja
JP4553765B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005087644A priority Critical patent/JP4553765B2/ja
Priority claimed from JP2005087644A external-priority patent/JP4553765B2/ja
Priority to US11/386,841 priority patent/US7679175B2/en
Publication of JP2006269861A publication Critical patent/JP2006269861A/ja
Publication of JP2006269861A5 publication Critical patent/JP2006269861A5/ja
Application granted granted Critical
Publication of JP4553765B2 publication Critical patent/JP4553765B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2005087644A 2005-03-25 2005-03-25 半導体装置の製造方法 Expired - Lifetime JP4553765B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005087644A JP4553765B2 (ja) 2005-03-25 2005-03-25 半導体装置の製造方法
US11/386,841 US7679175B2 (en) 2005-03-25 2006-03-23 Semiconductor device including substrate and upper plate having reduced warpage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005087644A JP4553765B2 (ja) 2005-03-25 2005-03-25 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2006269861A JP2006269861A (ja) 2006-10-05
JP2006269861A5 true JP2006269861A5 (enExample) 2008-01-24
JP4553765B2 JP4553765B2 (ja) 2010-09-29

Family

ID=37034369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005087644A Expired - Lifetime JP4553765B2 (ja) 2005-03-25 2005-03-25 半導体装置の製造方法

Country Status (2)

Country Link
US (1) US7679175B2 (enExample)
JP (1) JP4553765B2 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7531957B2 (en) * 2003-09-10 2009-05-12 Fujifilm Corporation Display apparatus and manufacturing method therefor
JP4553813B2 (ja) * 2005-08-29 2010-09-29 Ｏｋｉセミコンダクタ株式会社 半導体装置の製造方法
CN101611490B (zh) * 2007-02-16 2011-07-27 住友电木株式会社 电路板的制造方法、半导体制造装置、电路板和半导体器件
JP4825784B2 (ja) * 2007-12-13 2011-11-30 新光電気工業株式会社 半導体装置用パッケージおよびその製造方法
JP5543086B2 (ja) 2008-06-25 2014-07-09 ピーエスフォー ルクスコ エスエイアールエル 半導体装置及びその製造方法
JP5543125B2 (ja) 2009-04-08 2014-07-09 ピーエスフォー ルクスコ エスエイアールエル 半導体装置および半導体装置の製造方法
JP2010245383A (ja) 2009-04-08 2010-10-28 Elpida Memory Inc 半導体装置および半導体装置の製造方法
JP5579402B2 (ja) 2009-04-13 2014-08-27 ピーエスフォー ルクスコ エスエイアールエル 半導体装置及びその製造方法並びに電子装置
JP5149881B2 (ja) * 2009-09-30 2013-02-20 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US8541886B2 (en) * 2010-03-09 2013-09-24 Stats Chippac Ltd. Integrated circuit packaging system with via and method of manufacture thereof
JP2011192781A (ja) * 2010-03-15 2011-09-29 Disco Corp パッケージ基板の加工方法
KR102066015B1 (ko) 2013-08-13 2020-01-14 삼성전자주식회사 반도체 패키지 및 이의 제조방법
JP2015056563A (ja) * 2013-09-12 2015-03-23 株式会社東芝 半導体装置およびその製造方法
JP2015177061A (ja) * 2014-03-14 2015-10-05 株式会社東芝 半導体装置の製造方法および半導体装置
JP2014112742A (ja) * 2014-03-25 2014-06-19 Ps4 Luxco S A R L 切断前支持基板
US9768149B2 (en) * 2015-05-19 2017-09-19 Micron Technology, Inc. Semiconductor device assembly with heat transfer structure formed from semiconductor material
JP6582783B2 (ja) * 2015-09-16 2019-10-02 富士電機株式会社 半導体装置
US9941186B2 (en) * 2016-06-30 2018-04-10 Taiwan Semiconductor Manufacturing Company Ltd. Method for manufacturing semiconductor structure
KR102506698B1 (ko) * 2018-02-19 2023-03-07 에스케이하이닉스 주식회사 보강용 탑 다이를 포함하는 반도체 패키지 제조 방법
US10685937B2 (en) * 2018-06-15 2020-06-16 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit package having dummy structures and method of forming same
CN118471830A (zh) * 2023-02-02 2024-08-09 长鑫存储技术有限公司 封装结构及其制造方法

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
US5834339A (en) * 1996-03-07 1998-11-10 Tessera, Inc. Methods for providing void-free layers for semiconductor assemblies
US5886396A (en) * 1995-06-05 1999-03-23 Motorola, Inc. Leadframe assembly for conducting thermal energy from a semiconductor die disposed in a package
US5726079A (en) * 1996-06-19 1998-03-10 International Business Machines Corporation Thermally enhanced flip chip package and method of forming
JP3674179B2 (ja) 1996-10-04 2005-07-20 株式会社デンソー ボールグリッドアレイ半導体装置及びその製造方法
JPH10116936A (ja) * 1996-10-09 1998-05-06 Toshiba Microelectron Corp 半導体パッケージ
US6127724A (en) * 1996-10-31 2000-10-03 Tessera, Inc. Packaged microelectronic elements with enhanced thermal conduction
US5990418A (en) * 1997-07-29 1999-11-23 International Business Machines Corporation Hermetic CBGA/CCGA structure with thermal paste cooling
US6627997B1 (en) * 1999-03-26 2003-09-30 Hitachi, Ltd. Semiconductor module and method of mounting
JP3673442B2 (ja) * 2000-03-16 2005-07-20 ローム株式会社 半導体装置の製造方法
JP4574118B2 (ja) * 2003-02-12 2010-11-04 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
JP2004304622A (ja) * 2003-03-31 2004-10-28 Fujitsu Media Device Kk 弾性表面波デバイス及びその製造方法
US7180165B2 (en) * 2003-09-05 2007-02-20 Sanmina, Sci Corporation Stackable electronic assembly
US7170188B2 (en) * 2004-06-30 2007-01-30 Intel Corporation Package stress management
JP4553813B2 (ja) * 2005-08-29 2010-09-29 Ｏｋｉセミコンダクタ株式会社 半導体装置の製造方法

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