JP2003347491A5 - - Google Patents

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Publication number
JP2003347491A5
JP2003347491A5 JP2002154344A JP2002154344A JP2003347491A5 JP 2003347491 A5 JP2003347491 A5 JP 2003347491A5 JP 2002154344 A JP2002154344 A JP 2002154344A JP 2002154344 A JP2002154344 A JP 2002154344A JP 2003347491 A5 JP2003347491 A5 JP 2003347491A5
Authority
JP
Japan
Prior art keywords
lead
sealing body
leads
resin sealing
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002154344A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003347491A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002154344A priority Critical patent/JP2003347491A/ja
Priority claimed from JP2002154344A external-priority patent/JP2003347491A/ja
Publication of JP2003347491A publication Critical patent/JP2003347491A/ja
Publication of JP2003347491A5 publication Critical patent/JP2003347491A5/ja
Pending legal-status Critical Current

Links

JP2002154344A 2002-05-28 2002-05-28 半導体装置 Pending JP2003347491A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002154344A JP2003347491A (ja) 2002-05-28 2002-05-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002154344A JP2003347491A (ja) 2002-05-28 2002-05-28 半導体装置

Publications (2)

Publication Number Publication Date
JP2003347491A JP2003347491A (ja) 2003-12-05
JP2003347491A5 true JP2003347491A5 (enExample) 2005-06-30

Family

ID=29771173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002154344A Pending JP2003347491A (ja) 2002-05-28 2002-05-28 半導体装置

Country Status (1)

Country Link
JP (1) JP2003347491A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100603521B1 (ko) 2004-09-04 2006-07-28 선문대학교 산학협력단 다이오드 패키징 방법
JP2008277405A (ja) * 2007-04-26 2008-11-13 Rohm Co Ltd 半導体モジュール
JP2008300672A (ja) * 2007-05-31 2008-12-11 Sanyo Electric Co Ltd 半導体装置
KR101101018B1 (ko) 2010-06-21 2011-12-29 김재구 리드선이 개량된 다이오드 패키지 및 그 제조방법
JP5876299B2 (ja) * 2012-01-18 2016-03-02 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 回路装置
JP2013222781A (ja) * 2012-04-16 2013-10-28 Sharp Corp 半導体装置のデバイス実装構造
JP1593817S (enExample) 2017-03-28 2017-12-25

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