JP2003347491A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2003347491A
JP2003347491A JP2002154344A JP2002154344A JP2003347491A JP 2003347491 A JP2003347491 A JP 2003347491A JP 2002154344 A JP2002154344 A JP 2002154344A JP 2002154344 A JP2002154344 A JP 2002154344A JP 2003347491 A JP2003347491 A JP 2003347491A
Authority
JP
Japan
Prior art keywords
lead
semiconductor device
sealing body
semiconductor chip
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002154344A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003347491A5 (enExample
Inventor
Yasuji Ichinose
八州治 一ノ瀬
Kohei Yamada
耕平 山田
Hiroki Wakumoto
宏樹 涌本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2002154344A priority Critical patent/JP2003347491A/ja
Publication of JP2003347491A publication Critical patent/JP2003347491A/ja
Publication of JP2003347491A5 publication Critical patent/JP2003347491A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12032—Schottky diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2002154344A 2002-05-28 2002-05-28 半導体装置 Pending JP2003347491A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002154344A JP2003347491A (ja) 2002-05-28 2002-05-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002154344A JP2003347491A (ja) 2002-05-28 2002-05-28 半導体装置

Publications (2)

Publication Number Publication Date
JP2003347491A true JP2003347491A (ja) 2003-12-05
JP2003347491A5 JP2003347491A5 (enExample) 2005-06-30

Family

ID=29771173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002154344A Pending JP2003347491A (ja) 2002-05-28 2002-05-28 半導体装置

Country Status (1)

Country Link
JP (1) JP2003347491A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100603521B1 (ko) 2004-09-04 2006-07-28 선문대학교 산학협력단 다이오드 패키징 방법
JP2008277405A (ja) * 2007-04-26 2008-11-13 Rohm Co Ltd 半導体モジュール
JP2008300672A (ja) * 2007-05-31 2008-12-11 Sanyo Electric Co Ltd 半導体装置
KR101101018B1 (ko) 2010-06-21 2011-12-29 김재구 리드선이 개량된 다이오드 패키지 및 그 제조방법
JP2013149718A (ja) * 2012-01-18 2013-08-01 Semiconductor Components Industries Llc 回路装置
WO2013157300A1 (ja) * 2012-04-16 2013-10-24 シャープ株式会社 半導体装置のデバイス実装構造
USD901405S1 (en) 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100603521B1 (ko) 2004-09-04 2006-07-28 선문대학교 산학협력단 다이오드 패키징 방법
JP2008277405A (ja) * 2007-04-26 2008-11-13 Rohm Co Ltd 半導体モジュール
JP2008300672A (ja) * 2007-05-31 2008-12-11 Sanyo Electric Co Ltd 半導体装置
KR101101018B1 (ko) 2010-06-21 2011-12-29 김재구 리드선이 개량된 다이오드 패키지 및 그 제조방법
WO2011162470A3 (ko) * 2010-06-21 2012-02-16 Kim Jae Ku 리드선이 개량된 다이오드 패키지 및 그 제조방법
US9065030B2 (en) 2010-06-21 2015-06-23 Gne Tech Co., Ltd. Diode package having improved lead wire and manufacturing method thereof
JP2013149718A (ja) * 2012-01-18 2013-08-01 Semiconductor Components Industries Llc 回路装置
WO2013157300A1 (ja) * 2012-04-16 2013-10-24 シャープ株式会社 半導体装置のデバイス実装構造
JP2013222781A (ja) * 2012-04-16 2013-10-28 Sharp Corp 半導体装置のデバイス実装構造
USD901405S1 (en) 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device

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