JP2005194527A5 - - Google Patents
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- JP2005194527A5 JP2005194527A5 JP2004372026A JP2004372026A JP2005194527A5 JP 2005194527 A5 JP2005194527 A5 JP 2005194527A5 JP 2004372026 A JP2004372026 A JP 2004372026A JP 2004372026 A JP2004372026 A JP 2004372026A JP 2005194527 A5 JP2005194527 A5 JP 2005194527A5
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- JP
- Japan
- Prior art keywords
- weight
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- component
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims description 20
- 150000004985 diamines Chemical class 0.000 claims description 17
- 239000004593 Epoxy Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- 229920001721 polyimide Polymers 0.000 claims description 12
- 239000004642 Polyimide Substances 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 10
- 229910052736 halogen Inorganic materials 0.000 claims description 9
- 150000002367 halogens Chemical class 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 7
- 239000003063 flame retardant Substances 0.000 claims description 7
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 6
- 239000000178 monomer Substances 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 claims description 4
- GDGIVSREGUOIJZ-UHFFFAOYSA-N 5-amino-3h-1,3,4-thiadiazole-2-thione Chemical compound NC1=NN=C(S)S1 GDGIVSREGUOIJZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002318 adhesion promoter Substances 0.000 claims description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 3
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 claims description 3
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 claims description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 2
- 229920000877 Melamine resin Polymers 0.000 claims description 2
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- 239000004693 Polybenzimidazole Substances 0.000 claims description 2
- 229920000388 Polyphosphate Polymers 0.000 claims description 2
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 2
- 239000012964 benzotriazole Substances 0.000 claims description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 2
- 239000003054 catalyst Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 125000000524 functional group Chemical group 0.000 claims description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 2
- 239000010452 phosphate Substances 0.000 claims description 2
- XZTOTRSSGPPNTB-UHFFFAOYSA-N phosphono dihydrogen phosphate;1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N)=N1.OP(O)(=O)OP(O)(O)=O XZTOTRSSGPPNTB-UHFFFAOYSA-N 0.000 claims description 2
- 239000004014 plasticizer Substances 0.000 claims description 2
- 229920002480 polybenzimidazole Polymers 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000001205 polyphosphate Substances 0.000 claims description 2
- 235000011176 polyphosphates Nutrition 0.000 claims description 2
- -1 polysiloxane Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 2
- 101001034843 Mus musculus Interferon-induced transmembrane protein 1 Proteins 0.000 claims 1
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 claims 1
- 239000010410 layer Substances 0.000 description 5
- 239000011247 coating layer Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US53346803P | 2003-12-30 | 2003-12-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005194527A JP2005194527A (ja) | 2005-07-21 |
| JP2005194527A5 true JP2005194527A5 (enExample) | 2008-01-31 |
Family
ID=34700203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004372026A Withdrawn JP2005194527A (ja) | 2003-12-30 | 2004-12-22 | フレキシブル回路の用途に有用なポリイミド系接着剤組成物、並びに関連する構成物および方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7220490B2 (enExample) |
| EP (1) | EP1550698A3 (enExample) |
| JP (1) | JP2005194527A (enExample) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100505980C (zh) * | 2003-09-10 | 2009-06-24 | 尤尼吉可株式会社 | 柔性印刷线路板用的基板及其制造方法 |
| US20060019102A1 (en) * | 2004-07-26 | 2006-01-26 | Kuppsuamy Kanakarajan | Flame-retardant halogen-free polyimide films useful as thermal insulation in aircraft applications and methods relating thereto |
| US20070026226A1 (en) * | 2005-07-29 | 2007-02-01 | Jiann-Hsing Chen | Epoxy primer layer for fuser belts |
| US20070026225A1 (en) * | 2005-07-29 | 2007-02-01 | Jiann-Hsing Chen | Primer composition for high temperature belts |
| KR20080066016A (ko) * | 2005-10-24 | 2008-07-15 | 스미토모 베이클리트 컴퍼니 리미티드 | 수지 조성물, 수지 필름, 커버 레이 필름, 층간접착제,금속피복적층판 및 다층 프린트 회로판 |
| US20070206364A1 (en) * | 2006-03-02 | 2007-09-06 | Saint-Gobain Performance Plastics Corporation | Methods of forming a flexible circuit board |
| EP2011842B1 (en) * | 2006-03-03 | 2014-02-26 | PI R & D Co., Ltd. | Photosensitive ink composition for screen printing and method of forming positive relief pattern with use thereof |
| US8491997B2 (en) * | 2006-06-22 | 2013-07-23 | Sabic Innovative Plastics Ip B.V. | Conductive wire comprising a polysiloxane/polyimide copolymer blend |
| US8071693B2 (en) * | 2006-06-22 | 2011-12-06 | Sabic Innovative Plastics Ip B.V. | Polysiloxane/polyimide copolymers and blends thereof |
| US8168726B2 (en) * | 2006-06-22 | 2012-05-01 | Sabic Innovative Plastics Ip B.V. | Process for making polysiloxane/polymide copolymer blends |
| JP5380805B2 (ja) * | 2006-08-31 | 2014-01-08 | Ｊｎｃ株式会社 | インクジェット用インク |
| US7897878B2 (en) * | 2007-01-26 | 2011-03-01 | International Business Machines Corporation | Compliant penetrating packaging interconnect |
| US7847023B2 (en) * | 2007-03-12 | 2010-12-07 | Sabic Innovative Plastics Ip B.V. | Polysiloxane/polyimide copolymer blends |
| US20080236864A1 (en) * | 2007-03-28 | 2008-10-02 | General Electric Company | Cross linked polysiloxane/polyimide copolymers, methods of making, blends thereof, and articles derived therefrom |
| JP5015735B2 (ja) * | 2007-04-06 | 2012-08-29 | 旭化成イーマテリアルズ株式会社 | 樹脂組成物及びそれを用いたフレキシブルプリント配線板 |
| CN101430507A (zh) * | 2007-08-27 | 2009-05-13 | E.I.内穆尔杜邦公司 | 基片上的可光聚合干膜的湿层叠以及与湿层叠有关的组合物 |
| US20090087774A1 (en) * | 2007-08-27 | 2009-04-02 | E.I. Du Pont De Nemours And Company | Compositions and methods for wet lamination of photopolymerizable dry films onto substrates |
| JP2010021297A (ja) * | 2008-07-10 | 2010-01-28 | Compeq Manufacturing Co Ltd | 剥離可能な保護層を有するリジッドフレックス回路基板及びその製造方法 |
| ES2641766T5 (es) * | 2008-08-15 | 2021-08-05 | Otis Elevator Co | Uso de un compuesto a base de melamina como estabilizador de geometría en un conjunto que comprende un miembro de tensión alargado y una funda que cubre el miembro de tensión |
| TWI387027B (zh) * | 2009-02-16 | 2013-02-21 | Advanced Semiconductor Eng | 無核心封裝基板及其製造方法 |
| EP2404487B1 (en) * | 2009-03-06 | 2015-04-22 | E. I. du Pont de Nemours and Company | Multilayer film for electronic circuitry applications and methods relating thereto |
| KR101064816B1 (ko) * | 2009-04-03 | 2011-09-14 | 주식회사 두산 | 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판 |
| US11203192B2 (en) | 2009-08-03 | 2021-12-21 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| US9631054B2 (en) | 2010-07-23 | 2017-04-25 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| US9926415B2 (en) | 2010-08-05 | 2018-03-27 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| US20130011645A1 (en) * | 2010-03-01 | 2013-01-10 | E. I. Du Pont De Nemours And Company | Multilayer film for electronic circuitry applications and methods relating thereto |
| US8475925B2 (en) * | 2010-06-22 | 2013-07-02 | Pbi Performance Products, Inc. | PBI/epoxy coatings |
| KR101716758B1 (ko) * | 2010-12-17 | 2017-03-15 | 콘티넨탈 오토모티브 시스템 주식회사 | 취성재료 코팅 방식의 인쇄회로 기판, 그리고 이를 적용하는 포브 키 장치 |
| JP2013056964A (ja) * | 2011-09-07 | 2013-03-28 | Jnc Corp | インクジェットインク |
| US20130337261A1 (en) * | 2012-05-25 | 2013-12-19 | Nitto Denko Corporation | Moisture-proof material |
| US20140088230A1 (en) * | 2012-09-25 | 2014-03-27 | Snezana Grcev | Flame-retardant polymer composition and article |
| TWI519602B (zh) * | 2014-06-06 | 2016-02-01 | Elite Material Co Ltd | Low dielectric resin composition and the application of its resin film, semi-cured film and circuit board |
| WO2016021646A1 (ja) * | 2014-08-08 | 2016-02-11 | 東レ株式会社 | 仮貼り用接着剤、接着剤層、ウエハ加工体およびこれを用いた半導体装置の製造方法、リワーク溶剤、ポリイミド共重合体、ポリイミド混合樹脂、ならびに樹脂組成物 |
| WO2017073507A1 (ja) * | 2015-10-29 | 2017-05-04 | 東レ株式会社 | 仮貼り用積層体フィルム、仮貼り用積層体フィルムを用いた基板加工体および積層基板加工体の製造方法、ならびにこれらを用いた半導体装置の製造方法 |
| US10189950B2 (en) * | 2015-12-22 | 2019-01-29 | E I Du Pont De Nemours And Company | Polyimide-based polymer thick film compositions |
| TWI582159B (zh) * | 2016-06-24 | 2017-05-11 | 鵬鼎科技股份有限公司 | 樹脂組合物及應用該樹脂組合物的膠片及電路板 |
| CN106190004B (zh) * | 2016-07-20 | 2020-05-15 | 律胜科技（苏州）有限公司 | 一种具有高频特性的接着剂组合物及其用途 |
| KR101945085B1 (ko) * | 2016-08-04 | 2019-04-17 | 타이마이드 테크놀로지 인코포레이션 | 가요성 기판 어셈블리 및 가요성 인쇄 회로를 제조하기 위한 그의 응용 용도 |
| CN106159089B (zh) * | 2016-08-22 | 2019-07-23 | 达迈科技股份有限公司 | 可离型的软性基板及其制造方法 |
| TWI617441B (zh) * | 2017-03-31 | 2018-03-11 | 長興材料工業股份有限公司 | 於基板上製備圖案化覆蓋膜之方法 |
| CN113322714B (zh) * | 2020-02-28 | 2022-12-02 | 中国科学院成都有机化学有限公司 | 一种聚酰亚胺复配型抗高温老化助剂及其绝缘纸和制备方法 |
| CN114836169B (zh) * | 2022-04-18 | 2023-10-17 | 上海通联新材料科技股份有限公司 | 一种胶粘剂及其在覆铜板中的应用 |
| WO2025027948A1 (ja) * | 2023-08-01 | 2025-02-06 | 住友電工プリントサーキット株式会社 | プリント配線板用接着剤組成物、プリント配線板用ボンディングフィルム、プリント配線板用カバーレイおよびプリント配線板 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5952822B2 (ja) | 1978-04-14 | 1984-12-21 | 東レ株式会社 | 耐熱性感光材料 |
| US4937133A (en) | 1988-03-28 | 1990-06-26 | Nippon Steel Chemical Co., Ltd. | Flexible base materials for printed circuits |
| JPH0423879A (ja) | 1990-05-18 | 1992-01-28 | Ube Ind Ltd | 耐熱性イミド接着剤 |
| JP3084585B2 (ja) | 1991-12-09 | 2000-09-04 | チッソ株式会社 | ポリイミド系感光性カバーコート剤 |
| DE69321103T2 (de) | 1992-02-24 | 1999-03-11 | E.I. Du Pont De Nemours And Co., Wilmington, Del. | Flexible, wässrig entwickelbare, durch licht abblidbare dauerhafte ueberzugsmittel fuer gedruckte schaltungen |
| JP2805741B2 (ja) | 1992-12-04 | 1998-09-30 | 宇部興産株式会社 | 耐熱性接着剤組成物 |
| US5300812A (en) | 1992-12-09 | 1994-04-05 | General Electric Company | Plasticized polyetherimide adhesive composition and usage |
| JP3422434B2 (ja) | 1994-05-31 | 2003-06-30 | 新日鐵化学株式会社 | シリケート基含有ポリイミド |
| US5643657A (en) | 1995-04-28 | 1997-07-01 | E. I. Du Pont De Nemours And Company | Aqueous processable, multilayer, photoimageable permanent coatings for printed circuits |
| JPH08319456A (ja) | 1995-04-28 | 1996-12-03 | E I Du Pont De Nemours & Co | 印刷回路用の水系処理可能な軟質の光画像化可能耐久被覆材 |
| US5636620A (en) * | 1996-05-22 | 1997-06-10 | General Motors Corporation | Self diagnosing ignition control |
| US6117510A (en) * | 1996-07-30 | 2000-09-12 | Ube Industries, Ltd. | Adhesive-applied tape |
| US6015510A (en) * | 1996-08-29 | 2000-01-18 | E. I. Du Pont De Nemours And Company | Polymer flame retardant |
| JP3968835B2 (ja) | 1996-12-20 | 2007-08-29 | 日本メクトロン株式会社 | シロキサンポリイミドを含有する耐熱性接着剤 |
| JP3923120B2 (ja) | 1997-01-30 | 2007-05-30 | 新日鐵化学株式会社 | プリント基板用接着剤樹脂組成物 |
| JP3700311B2 (ja) | 1997-02-05 | 2005-09-28 | 日本メクトロン株式会社 | シロキサンポリイミドおよびそれを含有する耐熱性接着剤 |
| JP3689518B2 (ja) | 1997-02-18 | 2005-08-31 | 新日鐵化学株式会社 | 電子材料用樹脂溶液組成物 |
| DE69800652T2 (de) | 1997-02-25 | 2001-08-23 | E.I. Du Pont De Nemours And Co., Wilmington | Flexible, flammhemmende fotopolymerisierbare Zusammensetzung zur Beschichtung von Leiterplatten |
| US5935372A (en) * | 1997-04-29 | 1999-08-10 | Occidental Chemical Corporation | Adhesive sealant for bonding metal parts to ceramics |
| JP3344315B2 (ja) * | 1998-04-28 | 2002-11-11 | 宇部興産株式会社 | 一色塗りポリイミドシロキサン系コ−ト材および硬化膜 |
| JP3950560B2 (ja) * | 1998-08-14 | 2007-08-01 | 株式会社巴川製紙所 | 電子部品用接着剤および電子部品用接着テープ |
| US6274662B1 (en) * | 1999-04-09 | 2001-08-14 | J.M. Huber Corporation | Vulcanizable elastomeric compositions containing surface treated barium sulfate and vulcanizates thereof |
| JP4743732B2 (ja) * | 1999-04-09 | 2011-08-10 | 株式会社カネカ | 線材被覆用接着性積層フィルム |
| JP2002012666A (ja) * | 2000-06-29 | 2002-01-15 | Shin Etsu Chem Co Ltd | ポリイミドシリコーン樹脂、その製造方法およびその組成物 |
| JP4212793B2 (ja) | 2001-08-21 | 2009-01-21 | 信越化学工業株式会社 | 接着剤組成物、これを用いたフレキシブル印刷配線用基板及びカバーレイフィルム |
-
2004
- 2004-07-16 US US10/892,863 patent/US7220490B2/en not_active Expired - Fee Related
- 2004-11-15 EP EP20040027062 patent/EP1550698A3/en not_active Withdrawn
- 2004-12-22 JP JP2004372026A patent/JP2005194527A/ja not_active Withdrawn
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