DE69800652T2 - Flexible, flammhemmende fotopolymerisierbare Zusammensetzung zur Beschichtung von Leiterplatten - Google Patents

Flexible, flammhemmende fotopolymerisierbare Zusammensetzung zur Beschichtung von Leiterplatten

Info

Publication number
DE69800652T2
DE69800652T2 DE69800652T DE69800652T DE69800652T2 DE 69800652 T2 DE69800652 T2 DE 69800652T2 DE 69800652 T DE69800652 T DE 69800652T DE 69800652 T DE69800652 T DE 69800652T DE 69800652 T2 DE69800652 T2 DE 69800652T2
Authority
DE
Germany
Prior art keywords
flexible
printed circuit
flame retardant
circuit boards
photopolymerizable composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69800652T
Other languages
English (en)
Other versions
DE69800652D1 (de
Inventor
Thomas Eugene Dueber
Schadt, Iii
Yueh-Ling Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE69800652D1 publication Critical patent/DE69800652D1/de
Application granted granted Critical
Publication of DE69800652T2 publication Critical patent/DE69800652T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/108—Polyolefin or halogen containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
DE69800652T 1997-02-25 1998-01-08 Flexible, flammhemmende fotopolymerisierbare Zusammensetzung zur Beschichtung von Leiterplatten Expired - Fee Related DE69800652T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80464697A 1997-02-25 1997-02-25

Publications (2)

Publication Number Publication Date
DE69800652D1 DE69800652D1 (de) 2001-05-10
DE69800652T2 true DE69800652T2 (de) 2001-08-23

Family

ID=25189481

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69800652T Expired - Fee Related DE69800652T2 (de) 1997-02-25 1998-01-08 Flexible, flammhemmende fotopolymerisierbare Zusammensetzung zur Beschichtung von Leiterplatten

Country Status (4)

Country Link
US (1) US6218074B1 (de)
EP (1) EP0860742B1 (de)
JP (1) JP2852038B2 (de)
DE (1) DE69800652T2 (de)

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US6680152B2 (en) * 2001-05-31 2004-01-20 Mitsubishi Gas Chemical Company, Inc. Photosensitive resin composition
JP4155771B2 (ja) * 2001-08-27 2008-09-24 大日本印刷株式会社 体積型ホログラム記録用感光性組成物及びそれを用いた体積型ホログラム記録用感光性媒体
CN1324402C (zh) 2001-10-30 2007-07-04 钟渊化学工业株式会社 感光性树脂组合物、使用该组合物的感光性薄膜及层压体
DE60220446T2 (de) * 2001-12-06 2008-01-31 Huntsman Advanced Materials (Switzerland) Gmbh Harzzusammensetzung
US20030153656A1 (en) * 2002-01-11 2003-08-14 Rinus Sjerps Flame retardant polyurethanes and polyisocyanurates, and additives therefor
US20040058276A1 (en) * 2002-09-23 2004-03-25 Dueber Thomas E. Halo resistent, photoimagable coverlay compositions, having, advantageous application and removal properties, and methods relating thereto
AU2003269489A1 (en) * 2002-10-15 2004-05-04 Showa Denko K. K. Hexaarylbiimidazole compounds and photopolymerization initiator compositions containing the same
JP4325238B2 (ja) * 2003-03-24 2009-09-02 日立化成工業株式会社 永久レジスト用感光性フィルム、レジストパターンの形成方法及びプリント配線板
US6833391B1 (en) 2003-05-27 2004-12-21 General Electric Company Curable (meth)acrylate compositions
JP4597129B2 (ja) * 2003-08-29 2010-12-15 アルベマール・コーポレーシヨン 高ハロゲン含量低粘度難燃剤
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US7074463B2 (en) * 2003-09-12 2006-07-11 3M Innovative Properties Company Durable optical element
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US20050148735A1 (en) * 2003-12-30 2005-07-07 Olson David B. Polymerizable composition for optical articles
US20050147838A1 (en) * 2003-12-30 2005-07-07 3M Innovative Properties Company Polymerizable compositions for optical articles
US7220490B2 (en) * 2003-12-30 2007-05-22 E. I. Du Pont De Nemours And Company Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto
EP1730209B1 (de) 2004-01-27 2011-10-05 B.G. Polymers A.C.A. Ltd. Bromierte polymere und diese enthaltende flammwidrige gegenstände
JP2006154740A (ja) * 2004-07-14 2006-06-15 Fuji Photo Film Co Ltd 感光性組成物、パターン形成材料、感光性積層体、並びにパターン形成装置及びパターン形成方法
US20060019102A1 (en) * 2004-07-26 2006-01-26 Kuppsuamy Kanakarajan Flame-retardant halogen-free polyimide films useful as thermal insulation in aircraft applications and methods relating thereto
US7524617B2 (en) * 2004-11-23 2009-04-28 E.I. Du Pont De Nemours And Company Low-temperature curable photosensitive compositions
KR20070103033A (ko) * 2005-02-17 2007-10-22 쓰리엠 이노베이티브 프로퍼티즈 컴파니 낮은 유리 전이 온도를 가진 중합된 유기 상을 포함하는밝기 증진 필름
US7326448B2 (en) 2005-02-17 2008-02-05 3M Innovative Properties Company Polymerizable oligomeric urethane compositions comprising nanoparticles
US20060204676A1 (en) * 2005-03-11 2006-09-14 Jones Clinton L Polymerizable composition comprising low molecular weight organic component
US7400445B2 (en) * 2005-05-31 2008-07-15 3M Innovative Properties Company Optical filters for accelerated weathering devices
US7618766B2 (en) * 2005-12-21 2009-11-17 E. I. Du Pont De Nemours And Company Flame retardant photoimagable coverlay compositions and methods relating thereto
US20070236859A1 (en) * 2006-04-10 2007-10-11 Borland William J Organic encapsulant compositions for protection of electronic components
CN101121762A (zh) * 2006-08-11 2008-02-13 成都科瑞聚数码科技有限公司 一种碱溶性聚合物及其制备方法
US20080145545A1 (en) * 2006-12-15 2008-06-19 Bret Ja Chisholm Metal oxide and sulfur-containing coating compositions, methods of use, and articles prepared therefrom
US7796883B2 (en) * 2007-04-09 2010-09-14 Microsoft Corporation Flexible circuit connection
EP2108508A1 (de) * 2008-04-07 2009-10-14 Cytec Surface Specialties, S.A. Flammhemmende strahlenhärtbare Strukturen
KR101237855B1 (ko) 2010-01-05 2013-02-28 두루케미칼(주) 인계 난연성 물질 및 이의 제조방법
US9309366B2 (en) * 2011-03-16 2016-04-12 Chemtura Corporation Reactive flame retardants blends for flexible polyurethane foams
JP5883928B2 (ja) * 2012-04-27 2016-03-15 富士フイルム株式会社 感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機ｅｌ表示装置、および、液晶表示装置
WO2014014087A1 (ja) * 2012-07-20 2014-01-23 旭化成イーマテリアルズ株式会社 感光性樹脂エレメントの製造方法
CN103951784B (zh) * 2014-04-24 2017-02-08 北京化工大学 一种可逆co2响应光固化低聚物及合成方法
KR20170018067A (ko) 2014-06-23 2017-02-15 카본, 인크. 다중 경화 메커니즘을 갖는 물질로부터 폴리우레탄 3차원 물체를 제조하는 방법
TWI559082B (zh) 2014-07-07 2016-11-21 財團法人工業技術研究院 生質材料與其形成方法與印刷電路板
US9637596B2 (en) 2015-03-10 2017-05-02 International Business Machines Corporation Polyhemiaminal and polyhexahydrotriazine materials from 1,4 conjugate addition reactions
KR102628632B1 (ko) * 2015-06-04 2024-01-23 카티바, 인크. 금속 표면 상에서 에치 레지스트 패턴의 제조 방법
KR102626521B1 (ko) 2015-08-13 2024-01-17 카티바, 인크. 금속 표면 상에 에치 레지스트 패턴을 형성하는 방법
US9944816B2 (en) * 2016-06-02 2018-04-17 Ppg Coatings Europe B.V. Crosslinkable binders for solvent based intumescent coatings
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Also Published As

Publication number Publication date
DE69800652D1 (de) 2001-05-10
US6218074B1 (en) 2001-04-17
EP0860742B1 (de) 2001-04-04
EP0860742A1 (de) 1998-08-26
JP2852038B2 (ja) 1999-01-27
JPH10254132A (ja) 1998-09-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee