JP2005194527A - フレキシブル回路の用途に有用なポリイミド系接着剤組成物、並びに関連する構成物および方法 - Google Patents
フレキシブル回路の用途に有用なポリイミド系接着剤組成物、並びに関連する構成物および方法 Download PDFInfo
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- JP2005194527A JP2005194527A JP2004372026A JP2004372026A JP2005194527A JP 2005194527 A JP2005194527 A JP 2005194527A JP 2004372026 A JP2004372026 A JP 2004372026A JP 2004372026 A JP2004372026 A JP 2004372026A JP 2005194527 A JP2005194527 A JP 2005194527A
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Classifications
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/10—Block or graft copolymers containing polysiloxane sequences
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
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- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
- B32B2379/08—Polyimides
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- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
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- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/012—Flame-retardant; Preventing of inflammation
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/0137—Materials
- H05K2201/0162—Silicon containing polymer, e.g. silicone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Wire Bonding (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US53346803P | 2003-12-30 | 2003-12-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005194527A true JP2005194527A (ja) | 2005-07-21 |
| JP2005194527A5 JP2005194527A5 (enExample) | 2008-01-31 |
Family
ID=34700203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004372026A Withdrawn JP2005194527A (ja) | 2003-12-30 | 2004-12-22 | フレキシブル回路の用途に有用なポリイミド系接着剤組成物、並びに関連する構成物および方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7220490B2 (enExample) |
| EP (1) | EP1550698A3 (enExample) |
| JP (1) | JP2005194527A (enExample) |
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| JP2008274220A (ja) * | 2007-04-06 | 2008-11-13 | Asahi Kasei Corp | 樹脂組成物及びそれを用いたフレキシブルプリント配線板 |
| JP2010021297A (ja) * | 2008-07-10 | 2010-01-28 | Compeq Manufacturing Co Ltd | 剥離可能な保護層を有するリジッドフレックス回路基板及びその製造方法 |
| KR20120068377A (ko) * | 2010-12-17 | 2012-06-27 | 콘티넨탈 오토모티브 시스템 주식회사 | 취성재료 코팅 방식의 인쇄회로 기판, 그리고 이를 적용하는 포브 키 장치 |
| JP2013245351A (ja) * | 2012-05-25 | 2013-12-09 | Nitto Denko Corp | 防湿材 |
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| JPH08319456A (ja) | 1995-04-28 | 1996-12-03 | E I Du Pont De Nemours & Co | 印刷回路用の水系処理可能な軟質の光画像化可能耐久被覆材 |
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-
2004
- 2004-07-16 US US10/892,863 patent/US7220490B2/en not_active Expired - Fee Related
- 2004-11-15 EP EP20040027062 patent/EP1550698A3/en not_active Withdrawn
- 2004-12-22 JP JP2004372026A patent/JP2005194527A/ja not_active Withdrawn
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007049491A1 (ja) * | 2005-10-24 | 2007-05-03 | Sumitomo Bakelite Co., Ltd. | 樹脂組成物、樹脂フィルム、カバーレイフィルム、層間接着剤、金属張積層板および多層プリント回路板 |
| JP5537772B2 (ja) * | 2005-10-24 | 2014-07-02 | 住友ベークライト株式会社 | 樹脂組成物、樹脂フィルム、カバーレイフィルム、層間接着剤、金属張積層板および多層プリント回路板 |
| JP2008274220A (ja) * | 2007-04-06 | 2008-11-13 | Asahi Kasei Corp | 樹脂組成物及びそれを用いたフレキシブルプリント配線板 |
| JP2010021297A (ja) * | 2008-07-10 | 2010-01-28 | Compeq Manufacturing Co Ltd | 剥離可能な保護層を有するリジッドフレックス回路基板及びその製造方法 |
| KR101716758B1 (ko) | 2010-12-17 | 2017-03-15 | 콘티넨탈 오토모티브 시스템 주식회사 | 취성재료 코팅 방식의 인쇄회로 기판, 그리고 이를 적용하는 포브 키 장치 |
| KR20120068377A (ko) * | 2010-12-17 | 2012-06-27 | 콘티넨탈 오토모티브 시스템 주식회사 | 취성재료 코팅 방식의 인쇄회로 기판, 그리고 이를 적용하는 포브 키 장치 |
| JP2013245351A (ja) * | 2012-05-25 | 2013-12-09 | Nitto Denko Corp | 防湿材 |
| JP2015530454A (ja) * | 2012-09-25 | 2015-10-15 | サビック グローバル テクノロジーズ ベスローテン フェンノートシャップ | 難燃性ポリマー組成物および物品 |
| JPWO2017073507A1 (ja) * | 2015-10-29 | 2018-08-16 | 東レ株式会社 | 仮貼り用積層体フィルム、仮貼り用積層体フィルムを用いた基板加工体および積層基板加工体の製造方法、ならびにこれらを用いた半導体装置の製造方法 |
| JP2021088711A (ja) * | 2015-12-22 | 2021-06-10 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ | ポリイミド系ポリマー厚膜組成物 |
| JP7168701B2 (ja) | 2015-12-22 | 2022-11-09 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | ポリイミド系ポリマー厚膜組成物 |
| KR20180016229A (ko) * | 2016-08-04 | 2018-02-14 | 타이마이드 테크놀로지 인코포레이션 | 가요성 기판 어셈블리 및 가요성 인쇄 회로를 제조하기 위한 그의 응용 용도 |
| US10212821B2 (en) | 2016-08-04 | 2019-02-19 | Taimide Technology Incorporation | Flexible substrate assembly and its application for fabricating flexible printed circuits |
| KR101945085B1 (ko) * | 2016-08-04 | 2019-04-17 | 타이마이드 테크놀로지 인코포레이션 | 가요성 기판 어셈블리 및 가요성 인쇄 회로를 제조하기 위한 그의 응용 용도 |
| US10334738B2 (en) | 2016-08-04 | 2019-06-25 | Taimide Technology Incorporation | Flexible substrate assembly and its application for fabricating flexible printed circuits |
| CN106159089A (zh) * | 2016-08-22 | 2016-11-23 | 达迈科技股份有限公司 | 可离型的软性基板及其制造方法 |
| CN106159089B (zh) * | 2016-08-22 | 2019-07-23 | 达迈科技股份有限公司 | 可离型的软性基板及其制造方法 |
| WO2025027948A1 (ja) * | 2023-08-01 | 2025-02-06 | 住友電工プリントサーキット株式会社 | プリント配線板用接着剤組成物、プリント配線板用ボンディングフィルム、プリント配線板用カバーレイおよびプリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1550698A3 (en) | 2006-02-08 |
| US20050143534A1 (en) | 2005-06-30 |
| EP1550698A2 (en) | 2005-07-06 |
| US7220490B2 (en) | 2007-05-22 |
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