JP2005150647A - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP2005150647A
JP2005150647A JP2003390029A JP2003390029A JP2005150647A JP 2005150647 A JP2005150647 A JP 2005150647A JP 2003390029 A JP2003390029 A JP 2003390029A JP 2003390029 A JP2003390029 A JP 2003390029A JP 2005150647 A JP2005150647 A JP 2005150647A
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Japan
Prior art keywords
semiconductor chip
semiconductor
die pad
electrodes
leads
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Pending
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JP2003390029A
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English (en)
Japanese (ja)
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JP2005150647A5 (enExample
Inventor
Koichi Kanemoto
光一 金本
Kazunari Suzuki
一成 鈴木
Toshihiro Shiotsuki
敏弘 塩月
Hideyuki Suga
秀幸 須賀
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Renesas Technology Corp
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Renesas Technology Corp
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Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2003390029A priority Critical patent/JP2005150647A/ja
Priority to TW93133221A priority patent/TW200529408A/zh
Priority to US10/981,489 priority patent/US20050110127A1/en
Priority to KR1020040091218A priority patent/KR20050049346A/ko
Publication of JP2005150647A publication Critical patent/JP2005150647A/ja
Publication of JP2005150647A5 publication Critical patent/JP2005150647A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/0554—External layer
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    • H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
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    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2225/06562—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking at least one device in the stack being rotated or offset
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    • H01L2924/181—Encapsulation

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2003390029A 2003-11-20 2003-11-20 半導体装置及びその製造方法 Pending JP2005150647A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003390029A JP2005150647A (ja) 2003-11-20 2003-11-20 半導体装置及びその製造方法
TW93133221A TW200529408A (en) 2003-11-20 2004-11-01 Semiconductor device and its manufacturing method
US10/981,489 US20050110127A1 (en) 2003-11-20 2004-11-05 Semiconductor device
KR1020040091218A KR20050049346A (ko) 2003-11-20 2004-11-10 반도체장치 및 그 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003390029A JP2005150647A (ja) 2003-11-20 2003-11-20 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2005150647A true JP2005150647A (ja) 2005-06-09
JP2005150647A5 JP2005150647A5 (enExample) 2006-12-21

Family

ID=34587426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003390029A Pending JP2005150647A (ja) 2003-11-20 2003-11-20 半導体装置及びその製造方法

Country Status (4)

Country Link
US (1) US20050110127A1 (enExample)
JP (1) JP2005150647A (enExample)
KR (1) KR20050049346A (enExample)
TW (1) TW200529408A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008205143A (ja) * 2007-02-20 2008-09-04 Toshiba Corp 半導体装置とそれを用いた半導体モジュール
JP2015073108A (ja) * 2014-11-06 2015-04-16 ルネサスエレクトロニクス株式会社 半導体装置、半導体装置の製造方法、及びリードフレーム
JP2018049942A (ja) * 2016-09-21 2018-03-29 アイシン精機株式会社 変位センサ
JP2021015936A (ja) * 2019-07-16 2021-02-12 Tdk株式会社 電子部品パッケージ
JP2024100997A (ja) * 2018-03-26 2024-07-26 テキサス インスツルメンツ インコーポレイテッド 反転リードピンを有する電子デバイス

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4602223B2 (ja) * 2005-10-24 2010-12-22 株式会社東芝 半導体装置とそれを用いた半導体パッケージ
KR100844630B1 (ko) * 2006-03-29 2008-07-07 산요덴키가부시키가이샤 반도체 장치
US9202776B2 (en) * 2006-06-01 2015-12-01 Stats Chippac Ltd. Stackable multi-chip package system
TWI327365B (en) * 2007-01-19 2010-07-11 Chipmos Technologies Inc Zigzag-stacked chip package structure
JP2008270302A (ja) * 2007-04-16 2008-11-06 Sanyo Electric Co Ltd 半導体装置
KR100881198B1 (ko) * 2007-06-20 2009-02-05 삼성전자주식회사 반도체 패키지 및 이를 실장한 반도체 패키지 모듈
KR101557273B1 (ko) 2009-03-17 2015-10-05 삼성전자주식회사 반도체 패키지
KR101563630B1 (ko) * 2009-09-17 2015-10-28 에스케이하이닉스 주식회사 반도체 패키지
JP2014036179A (ja) * 2012-08-10 2014-02-24 Ps4 Luxco S A R L 半導体装置
JP6110769B2 (ja) * 2013-09-25 2017-04-05 ルネサスエレクトロニクス株式会社 半導体装置
US10373895B2 (en) * 2016-12-12 2019-08-06 Infineon Technologies Austria Ag Semiconductor device having die pads with exposed surfaces
US11469163B2 (en) * 2019-08-02 2022-10-11 Semiconductor Components Industries, Llc Low stress asymmetric dual side module
JP7459465B2 (ja) * 2019-08-28 2024-04-02 富士電機株式会社 半導体装置及び半導体装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5615475A (en) * 1995-01-30 1997-04-01 Staktek Corporation Method of manufacturing an integrated package having a pair of die on a common lead frame
US6476474B1 (en) * 2000-10-10 2002-11-05 Siliconware Precision Industries Co., Ltd. Dual-die package structure and method for fabricating the same
JP2002231882A (ja) * 2001-02-06 2002-08-16 Mitsubishi Electric Corp 半導体装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008205143A (ja) * 2007-02-20 2008-09-04 Toshiba Corp 半導体装置とそれを用いた半導体モジュール
JP2015073108A (ja) * 2014-11-06 2015-04-16 ルネサスエレクトロニクス株式会社 半導体装置、半導体装置の製造方法、及びリードフレーム
JP2018049942A (ja) * 2016-09-21 2018-03-29 アイシン精機株式会社 変位センサ
JP2024100997A (ja) * 2018-03-26 2024-07-26 テキサス インスツルメンツ インコーポレイテッド 反転リードピンを有する電子デバイス
JP2021015936A (ja) * 2019-07-16 2021-02-12 Tdk株式会社 電子部品パッケージ
JP7192688B2 (ja) 2019-07-16 2022-12-20 Tdk株式会社 電子部品パッケージ
US11721618B2 (en) 2019-07-16 2023-08-08 Tdk Corporation Electronic component package
US12205873B2 (en) 2019-07-16 2025-01-21 Tdk Corporation Electronic component package

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Publication number Publication date
TW200529408A (en) 2005-09-01
US20050110127A1 (en) 2005-05-26
KR20050049346A (ko) 2005-05-25

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