JP2004533501A5 - - Google Patents

Download PDF

Info

Publication number
JP2004533501A5
JP2004533501A5 JP2002580347A JP2002580347A JP2004533501A5 JP 2004533501 A5 JP2004533501 A5 JP 2004533501A5 JP 2002580347 A JP2002580347 A JP 2002580347A JP 2002580347 A JP2002580347 A JP 2002580347A JP 2004533501 A5 JP2004533501 A5 JP 2004533501A5
Authority
JP
Japan
Prior art keywords
organopolysiloxane
formula
cured silicone
represented
sio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002580347A
Other languages
English (en)
Japanese (ja)
Other versions
JP4375968B2 (ja
JP2004533501A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2002/012765 external-priority patent/WO2002082468A1/en
Publication of JP2004533501A publication Critical patent/JP2004533501A/ja
Publication of JP2004533501A5 publication Critical patent/JP2004533501A5/ja
Application granted granted Critical
Publication of JP4375968B2 publication Critical patent/JP4375968B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2002580347A 2001-04-06 2002-04-05 導電性シリコーンおよびその製造方法 Expired - Lifetime JP4375968B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28202701P 2001-04-06 2001-04-06
PCT/US2002/012765 WO2002082468A1 (en) 2001-04-06 2002-04-05 Electrically conductive silicones and method of manufacture thereof

Publications (3)

Publication Number Publication Date
JP2004533501A JP2004533501A (ja) 2004-11-04
JP2004533501A5 true JP2004533501A5 (enExample) 2008-01-10
JP4375968B2 JP4375968B2 (ja) 2009-12-02

Family

ID=23079779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002580347A Expired - Lifetime JP4375968B2 (ja) 2001-04-06 2002-04-05 導電性シリコーンおよびその製造方法

Country Status (5)

Country Link
US (1) US6902688B2 (enExample)
EP (1) EP1399928B1 (enExample)
JP (1) JP4375968B2 (enExample)
CN (1) CN1273994C (enExample)
WO (1) WO2002082468A1 (enExample)

Families Citing this family (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040092655A1 (en) * 2001-04-02 2004-05-13 Takayoshi Otomo Mouldable silicone gel compositions
US20030213939A1 (en) * 2002-04-01 2003-11-20 Sujatha Narayan Electrically conductive polymeric foams and elastomers and methods of manufacture thereof
US6783692B2 (en) * 2002-10-17 2004-08-31 Dow Corning Corporation Heat softening thermally conductive compositions and methods for their preparation
US7135767B2 (en) * 2003-07-29 2006-11-14 Agilent Technologies, Inc. Integrated circuit substrate material and method
JP2005286195A (ja) * 2004-03-30 2005-10-13 Geltec Co Ltd 押出し可能な架橋済グリース状電磁波吸収材、これを充填・封入した容器、その容器の製法、及びこれらを利用した電磁波吸収方法
US8715533B2 (en) 2004-12-17 2014-05-06 Asahi R&D Co., Ltd. Dielectric raw material, antenna device, portable phone and electromagnetic wave shielding body
EP1829933B1 (en) * 2004-12-17 2015-07-22 ASAHI FR R&D Co., Ltd. Method of controlling specific inductive capacity, dielectric material, mobile phone and human phantom model
US8092910B2 (en) 2005-02-16 2012-01-10 Dow Corning Toray Co., Ltd. Reinforced silicone resin film and method of preparing same
ATE551398T1 (de) 2005-02-16 2012-04-15 Dow Corning Verstärkte silikonharzfolie und herstellungsverfahren dafür
EP1708317A3 (de) 2005-03-29 2007-11-14 Karl Ronald Schoeller Rollband-Kontakt-Einheit zur permanenten oder bewegungsabhängig intermittierenden galvanischen Verbindung zweier Systeme
ES2412379T3 (es) 2005-04-25 2013-07-11 G&G Biotechnology Ltd. Dispositivo protésico implantable ligero.
US20090162596A1 (en) * 2005-08-02 2009-06-25 World Properties, Inc. Silicone compositions, methods of manufacture, and articles formed therefrom
US20100183814A1 (en) * 2005-08-02 2010-07-22 Victor Rios Silicone compositions, methods of manufacture, and articles formed therefrom
US20090162651A1 (en) * 2005-08-02 2009-06-25 World Properties, Inc. Silicone compositions, methods of manufacture, and articles formed therefrom
WO2007018756A1 (en) 2005-08-04 2007-02-15 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
US7589284B2 (en) * 2005-09-12 2009-09-15 Parker Hannifin Corporation Composite polymeric material for EMI shielding
EP1924631A4 (en) * 2005-09-16 2012-03-07 Hyperion Catalysis Int CONDUCTIVE SILICONES AND PROCESS FOR PREPARING THE SAME
ATE517947T1 (de) * 2005-12-21 2011-08-15 Dow Corning Silikonharzfilm, herstellungsverfahren dafür und nanomaterialgefüllte silikonzusammensetzung
KR101426316B1 (ko) 2006-01-19 2014-08-06 다우 코닝 코포레이션 실리콘 수지 필름, 이의 제조방법, 및 나노물질로 충전된실리콘 조성물
CN101379153B (zh) * 2006-02-02 2011-12-28 陶氏康宁公司 有机硅树脂膜，其制备方法和纳米材料填充的有机硅组合物
US8084097B2 (en) 2006-02-20 2011-12-27 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
EP2066757A1 (en) * 2006-10-05 2009-06-10 Dow Corning Corporation Silicone resin film and method of preparing same
CN101595166A (zh) * 2007-02-06 2009-12-02 陶氏康宁公司 有机硅树脂、有机硅组合物、涂覆基材和增强有机硅树脂膜
ATE474876T1 (de) * 2007-02-22 2010-08-15 Dow Corning Verfahren zur herstellung leitfähiger folien sowie in diesem verfahren hergestellte artikel
CN101627096B (zh) * 2007-02-22 2012-11-07 道康宁公司 增强硅树脂膜及其制备方法
US20100087581A1 (en) * 2007-02-22 2010-04-08 Mark Fisher Reinforced Silicone Resin Film and Method of Preparing Same
CN101636270B (zh) * 2007-02-22 2012-07-04 道康宁公司 增强硅树脂膜
WO2008103228A1 (en) * 2007-02-22 2008-08-28 Dow Corning Corporation Reinforced silicone resin films
US20100143686A1 (en) * 2007-05-01 2010-06-10 Bizhong Zhu Nanomaterial-Filled Silicone Composition and Reinforced Silicone Resin Film
KR20100017503A (ko) * 2007-05-01 2010-02-16 다우 코닝 코포레이션 강화 실리콘 수지 필름
EP2201063B1 (en) * 2007-10-12 2011-07-06 Dow Corning Corporation Reinforced silicone resin film and nanofiber-filled silicone composition
CN101412851B (zh) * 2008-11-25 2011-10-05 上海市合成树脂研究所 一种有机硅导电胶
US20120012382A1 (en) * 2009-05-13 2012-01-19 Laird Technologies, Inc. Conductive Films for EMI Shielding Applications
EP2464706B1 (en) * 2009-08-12 2015-09-02 Parker Hannifin Corp. Fully-cured thermally or electrically-conductive form-in-place gap filler
LT2525839T (lt) * 2010-01-18 2018-11-12 G&G Biotechnology Ltd Mažo svorio krūtų implantų medžiaga
US8355770B2 (en) * 2010-03-22 2013-01-15 Idt Technology Limited Conductive silicone material for human skin electrode
US8766108B2 (en) 2010-08-30 2014-07-01 Parker Hannifin Corporation Encapsulated expanded crimped metal mesh for sealing and EMI shielding applications
US8759692B2 (en) 2010-08-30 2014-06-24 Parker-Hannifin Corporation Encapsulated expanded crimped metal mesh for sealing, EMI shielding and lightning strike applications
US9049777B2 (en) * 2010-11-01 2015-06-02 Plastics Research Corporation EMI shielded thermoset article
CN102276988B (zh) * 2011-06-08 2012-10-31 北京工业大学 一种单组份Ni-C填充型FIP热硫化高导电硅橡胶及其制备方法
JP5872440B2 (ja) * 2012-02-13 2016-03-01 Ｄｏｗａエレクトロニクス株式会社 球状銀粉およびその製造方法
RU2522614C2 (ru) * 2012-07-11 2014-07-20 Федеральное государственное унитарное предприятие "Государственный ордена Трудового Красного Знамени научно-исследовательский институт химии и технологии элементоорганических соединений" (ФГУП "ГНИИХТЭОС") Способ улучшения адгезии к металлам силиконовых композиционных материалов, получаемых по реакции полиприсоединения
DE102012220700A1 (de) * 2012-11-13 2014-05-15 Wacker Chemie Ag Füllstoffhaltige Siliconzusammensetzungen
JPWO2014080789A1 (ja) * 2012-11-20 2017-01-05 横浜ゴム株式会社 低温焼成用導電性組成物および太陽電池セル
CN104854176B (zh) * 2012-12-20 2017-06-06 道康宁公司 可固化有机硅组合物、导电有机硅粘合剂、制备及使用它们的方法以及包含它们的电气装置
JP6416188B2 (ja) * 2013-03-14 2018-10-31 ダウ シリコーンズ コーポレーション 硬化性シリコーン組成物、導電性シリコーン粘着剤、これらの製造及び使用方法、並びにこれらを含有する電気デバイス
WO2014150302A1 (en) * 2013-03-14 2014-09-25 Dow Corning Corporation Conductive silicone materials and uses
CN103289410A (zh) * 2013-05-22 2013-09-11 吴江市德佐日用化学品有限公司 一种具有低压缩永久变形特性的导电硅橡胶
CN103351839A (zh) * 2013-07-23 2013-10-16 上海魁固塑胶制品有限公司 单组分脱胺型高导电硅橡胶及其制备方法
EP3059286B1 (en) * 2013-10-17 2020-08-26 Shin-Etsu Chemical Co., Ltd. Silicone gel composition, and silicone gel cured product
AR099038A1 (es) 2014-01-08 2016-06-22 General Cable Tech Corp Conductor aéreo recubierto
KR101640218B1 (ko) * 2014-06-26 2016-07-18 파낙스 이텍(주) 전도성 실리콘 수지 조성물 및 이로부터 제조된 전자파 차폐용 가스켓
BR112017002151A2 (pt) * 2014-08-05 2018-07-03 Gen Cable Technologies Corp revestimentos de fluoro copolímeros para condutores aéreos
WO2016142949A1 (en) 2015-03-12 2016-09-15 G & G Biotechnology Ltd. Composite implant material
WO2017083689A1 (en) 2015-11-13 2017-05-18 General Cable Technologies Corporation Cables coated with fluorocopolymer coatings
TWI790785B (zh) 2016-05-31 2023-01-21 美商安芬諾股份有限公司 電終端、纜線總成以及纜線端接方法
CN106085341B (zh) * 2016-06-12 2019-01-11 江苏明昊新材料科技股份有限公司 单组分硅酮导电银胶及其制备方法
CN106085340B (zh) * 2016-06-12 2019-01-11 江苏明昊新材料科技股份有限公司 具有触变特性的高导热导电银胶及其制备方法
US10191519B2 (en) * 2016-09-19 2019-01-29 Google Llc Electronic device with gasket sealing receptacle for tongue
EP3528967B1 (en) * 2016-10-24 2023-06-21 Luxembourg Institute of Science and Technology (LIST) Method for forming an electrically conductive multilayer coating with anti-corrosion properties onto a metallic substrate
CN108117757B (zh) * 2016-11-28 2021-06-04 天迈科技股份有限公司 具有导电与防水特性的多功能胶体
US10640232B2 (en) * 2016-12-20 2020-05-05 The Boeing Company Conductive fastening system for composite structures
US10944214B2 (en) 2017-08-03 2021-03-09 Amphenol Corporation Cable connector for high speed interconnects
CN107364065B (zh) * 2017-08-14 2023-11-28 深圳市康利邦科技有限公司 曲面玻璃屏保护膜的一体成型加工工艺及其保护膜
WO2019112228A1 (ko) * 2017-12-08 2019-06-13 주식회사 엘지화학 전도성 실리콘 조성물 및 이에 의해 제조된 실리콘 복합재
WO2019135969A1 (en) * 2018-01-03 2019-07-11 Texting Tip LLC Fingernail tip stylus
WO2019159182A1 (en) 2018-02-18 2019-08-22 G & G Biotechnology Ltd. Implants with enhanced shell adhesion
LU100768B1 (en) * 2018-04-18 2019-10-22 Luxembourg Inst Science & Tech List Method for forming an electrically conductive multilayer coating with anti-corrosion properties onto a metallic substrate
KR102540533B1 (ko) * 2018-06-01 2023-06-07 현대자동차주식회사 열전도성이 우수한 경량 고분자 조성물과 그 제조방법 및 이 조성물을 이용하여 제조한 물품
CN109054729A (zh) * 2018-07-17 2018-12-21 泰州隆基乐叶光伏科技有限公司 一种湿/热双固化的导电胶及其制备方法
US12022642B2 (en) 2018-08-21 2024-06-25 Laird Technologies, Inc. Patterned electromagnetic interference (EMI) mitigation materials including carbon nanotubes
WO2020061988A1 (en) 2018-09-28 2020-04-02 Dow Silicones Corporation Liquid silicone rubber composition
KR20210107778A (ko) 2018-12-26 2021-09-01 모멘티브 퍼포먼스 머티리얼즈 인크. 경화성 실리콘 기반 조성물 및 그 용도
CN113366044A (zh) 2018-12-26 2021-09-07 迈图高新材料公司 基于有机硅的固化性组合物和其应用
JP2022536228A (ja) * 2018-12-26 2022-08-15 モメンティブ パフォーマンス マテリアルズ インコーポレイテッド 硬化性シリコーンベースの組成物およびその用途
US11137014B2 (en) 2019-01-08 2021-10-05 The Boeing Company Conductive fastening system and method for improved EME performance
WO2020172395A1 (en) 2019-02-22 2020-08-27 Amphenol Corporation High performance cable connector assembly
CN110294940A (zh) * 2019-06-28 2019-10-01 深圳市飞荣达科技股份有限公司 屏蔽衬垫及其制备方法
CN113511146A (zh) * 2020-04-09 2021-10-19 莱尔德技术股份有限公司 电磁干扰emi吸收体、雷达支架、汽车和汽车部件
US11454661B2 (en) 2020-11-05 2022-09-27 Amplifier Research Corp. Field probe
DE112021006322T5 (de) 2020-12-04 2023-09-14 Rogers Corporation Mehrschichtfolie zur verhinderung des thermischen durchgehens
CN112940510A (zh) * 2021-03-11 2021-06-11 广东思泉新材料股份有限公司 一种基于泡沫金属的三维骨架结构的致密导热硅胶复合材料及其制备方法
US12453500B2 (en) * 2021-05-11 2025-10-28 Purdue Research Foundation Poroelastic materials, biosensors comprising poroelastic materials, and methods of making and using poroelastic materials and biosensors
CN113338050A (zh) * 2021-06-07 2021-09-03 深圳先进电子材料国际创新研究院 一种耐高温金属化纤维布和导电硅胶复合材料及其制备方法和smt方面的用途
EP4426774A1 (en) 2021-11-01 2024-09-11 Rogers Corporation Filled silicone foam layer, compositions and methods for their manufacture, and articles including the filled silicone foam layer
CN115260985A (zh) * 2022-08-26 2022-11-01 韦尔通(厦门)科技股份有限公司 一种双组份低粘度高导热灌封胶及其制备方法和应用
US12300888B2 (en) 2023-02-02 2025-05-13 Microsonic, Inc. System and method for attenuating radiation emissions from earpiece devices

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3583930A (en) 1968-04-16 1971-06-08 Chomerics Inc Plastics made conductive with coarse metal fillers
US4011360A (en) 1974-04-10 1977-03-08 Chomerics, Inc. Electrically conductive silicone rubber stock
US4279783A (en) 1979-04-04 1981-07-21 Dow Corning Corporation Electrically conductive silicone elastomers
JPS59199756A (ja) 1983-04-27 1984-11-12 Toshiba Silicone Co Ltd 導電性シリコ−ンゴム組成物
JPS63117065A (ja) 1986-11-05 1988-05-21 Toshiba Silicone Co Ltd 室温硬化型導電性シリコ−ンゴム組成物
JPS63251464A (ja) 1987-04-08 1988-10-18 Toray Silicone Co Ltd 導電性シリコ−ンゴム粒状物
JP2618663B2 (ja) 1987-11-30 1997-06-11 東レ・ダウコーニング・シリコーン株式会社 磁性シリコーンゴム粉状物の製造方法
US5075038A (en) 1988-11-04 1991-12-24 Dow Corning Corporation Electrically conductive silicone compositions
CA2000787A1 (en) 1988-11-04 1990-05-04 Richard L. Cole Electrically conductive silicone compositions
JPH05325647A (ja) 1991-03-29 1993-12-10 Siegel:Kk シリコーンゲル多孔質導電体並びにその製造方法
JP3084380B2 (ja) 1991-06-06 2000-09-04 株式会社ジェルテック 導電性シリコーンゲル材の使用方法と改質方法
US5182050A (en) 1991-10-24 1993-01-26 Amp Incorporated Extrinsically/intrinsically conductive gel
JP3318338B2 (ja) 1992-02-28 2002-08-26 東レ・ダウコーニング・シリコーン株式会社 導電性ポリオルガノシロキサン組成物の製造方法
JPH05271548A (ja) * 1992-03-27 1993-10-19 Shin Etsu Chem Co Ltd オルガノポリシロキサン組成物及びその硬化物の形成方法
US5366664A (en) 1992-05-04 1994-11-22 The Penn State Research Foundation Electromagnetic shielding materials
DE4320527A1 (de) 1992-06-22 1993-12-23 Whitaker Corp Elektrisch leitfähiges Gel
JPH06144951A (ja) 1992-11-11 1994-05-24 Hiroyuki Kobayashi セラミックス発泡体とその製造方法
CA2129073C (en) 1993-09-10 2007-06-05 John P. Kalinoski Form-in-place emi gaskets
US5498644A (en) 1993-09-10 1996-03-12 Specialty Silicone Products, Inc. Silcone elastomer incorporating electrically conductive microballoons and method for producing same
JP2868986B2 (ja) 1993-10-06 1999-03-10 東レ・ダウコーニング・シリコーン株式会社 導電性シリコーンゴム組成物
JP2819444B2 (ja) * 1993-11-08 1998-10-30 東レ・ダウコーニング・シリコーン株式会社 導電性シリコーンゴム組成物
US5910524A (en) 1995-01-20 1999-06-08 Parker-Hannifin Corporation Corrosion-resistant, form-in-place EMI shielding gasket
JP3950493B2 (ja) * 1996-04-26 2007-08-01 東レ・ダウコーニング株式会社 導電性シリコーンゴム組成物、半導体装置の製造方法およびその半導体装置
JP3436464B2 (ja) 1996-10-31 2003-08-11 東レ・ダウコーニング・シリコーン株式会社 付加反応硬化型導電性シリコーン組成物および導電性シリコーン硬化物の製造方法
US5928569A (en) 1997-02-26 1999-07-27 Specialty Silicone Products, Inc. Substantially uniform moldable blends of silver particulate and organopolysiloxane
US6017587A (en) 1998-07-09 2000-01-25 Dow Corning Corporation Electrically conductive silicone compositions
JP3922332B2 (ja) 2000-01-17 2007-05-30 信越化学工業株式会社 導電性液状シリコーンゴム組成物
JP3810976B2 (ja) * 2000-02-15 2006-08-16 株式会社小糸製作所 自動車用赤外光照射ランプ

Similar Documents

Publication Publication Date Title
JP2004533501A5 (enExample)
JP6383885B2 (ja) 熱伝導性ポリオルガノシロキサン組成物
CN1273994C (zh) 导电性有机硅及其制造方法
JP6625749B2 (ja) 熱伝導性ポリオルガノシロキサン組成物
JP4745058B2 (ja) 熱伝導性シリコーン組成物
EP3688097B1 (en) Silicone composition comprising filler
JPH03279388A (ja) 架橋によりオルガノポリシロキサンエラストマーを形成する組成物
JP2003031028A (ja) 導電性組成物
JP7003029B2 (ja) 導電性シリコーン組成物、硬化物、積層体、及び、電子回路
CN1311014C (zh) 银基粉末、其制备方法和可固化的硅氧烷组合物
JP6890898B2 (ja) 熱伝導性ポリオルガノシロキサン組成物用表面処理剤
JPH03146557A (ja) 導電性シリコーンゴム組成物およびその硬化物
JP2018118940A (ja) 熱伝導性ポリシロキサン組成物用表面処理剤
JP2016079378A (ja) 熱伝導性シリコーン組成物及びその硬化物
CN110234711B (zh) 导热性聚硅氧烷组合物
JP2002309089A5 (enExample)
JP5080224B2 (ja) 耐溶剤性シリコーンゴム組成物
US20160272790A1 (en) Filler-containing silicone compositions
CN101591504B (zh) 一种单组份有机硅阻燃敷形涂料
EP0110371A1 (en) One-component electrically conductive organopolysiloxane compositions
TW202128882A (zh) 導電性矽氧組成物、導電性矽氧硬化物、導電性矽氧硬化物的製造方法、及導電性矽氧積層體
JPWO2023026615A5 (enExample)
JP2012140548A (ja) 付加硬化型熱伝導性シリコーン組成物
JPH08113713A (ja) 導電性シリコーンゴム組成物
JP6901999B2 (ja) 付加硬化型原料組成物