JP4375968B2 - 導電性シリコーンおよびその製造方法 - Google Patents

導電性シリコーンおよびその製造方法 Download PDF

Info

Publication number
JP4375968B2
JP4375968B2 JP2002580347A JP2002580347A JP4375968B2 JP 4375968 B2 JP4375968 B2 JP 4375968B2 JP 2002580347 A JP2002580347 A JP 2002580347A JP 2002580347 A JP2002580347 A JP 2002580347A JP 4375968 B2 JP4375968 B2 JP 4375968B2
Authority
JP
Japan
Prior art keywords
organopolysiloxane
represented
less
conductive
cured silicone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002580347A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004533501A5 (enExample
JP2004533501A (ja
Inventor
ナライアン，スジャータ
ラント，マイケル
クビック，ダニエル，ジェイ．
ハミルトン，ジョン，エイ．
Original Assignee
ワールド プロパティーズ インク．
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ワールド プロパティーズ インク． filed Critical ワールド プロパティーズ インク．
Publication of JP2004533501A publication Critical patent/JP2004533501A/ja
Publication of JP2004533501A5 publication Critical patent/JP2004533501A5/ja
Application granted granted Critical
Publication of JP4375968B2 publication Critical patent/JP4375968B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
JP2002580347A 2001-04-06 2002-04-05 導電性シリコーンおよびその製造方法 Expired - Lifetime JP4375968B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28202701P 2001-04-06 2001-04-06
PCT/US2002/012765 WO2002082468A1 (en) 2001-04-06 2002-04-05 Electrically conductive silicones and method of manufacture thereof

Publications (3)

Publication Number Publication Date
JP2004533501A JP2004533501A (ja) 2004-11-04
JP2004533501A5 JP2004533501A5 (enExample) 2008-01-10
JP4375968B2 true JP4375968B2 (ja) 2009-12-02

Family

ID=23079779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002580347A Expired - Lifetime JP4375968B2 (ja) 2001-04-06 2002-04-05 導電性シリコーンおよびその製造方法

Country Status (5)

Country Link
US (1) US6902688B2 (enExample)
EP (1) EP1399928B1 (enExample)
JP (1) JP4375968B2 (enExample)
CN (1) CN1273994C (enExample)
WO (1) WO2002082468A1 (enExample)

Families Citing this family (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040092655A1 (en) * 2001-04-02 2004-05-13 Takayoshi Otomo Mouldable silicone gel compositions
GB2402392A (en) * 2002-04-01 2004-12-08 World Properties Inc Electrically conductive polymeric foams and elastomers and methods of manufacture therof
US6783692B2 (en) 2002-10-17 2004-08-31 Dow Corning Corporation Heat softening thermally conductive compositions and methods for their preparation
US7135767B2 (en) * 2003-07-29 2006-11-14 Agilent Technologies, Inc. Integrated circuit substrate material and method
JP2005286195A (ja) * 2004-03-30 2005-10-13 Geltec Co Ltd 押出し可能な架橋済グリース状電磁波吸収材、これを充填・封入した容器、その容器の製法、及びこれらを利用した電磁波吸収方法
EP1833289A1 (en) 2004-12-17 2007-09-12 Kabushiki Kaisha Fine Rubber Kenkyuusho Dielectric raw material, antenna device, portable phone and electromagnetic wave shielding body
EP1829933B1 (en) * 2004-12-17 2015-07-22 ASAHI FR R&D Co., Ltd. Method of controlling specific inductive capacity, dielectric material, mobile phone and human phantom model
US8092910B2 (en) 2005-02-16 2012-01-10 Dow Corning Toray Co., Ltd. Reinforced silicone resin film and method of preparing same
KR101271662B1 (ko) * 2005-02-16 2013-06-05 다우 코닝 도레이 캄파니 리미티드 강화 실리콘 수지 필름 및 이의 제조방법
EP1708317A3 (de) 2005-03-29 2007-11-14 Karl Ronald Schoeller Rollband-Kontakt-Einheit zur permanenten oder bewegungsabhängig intermittierenden galvanischen Verbindung zweier Systeme
EP1877002B1 (en) 2005-04-25 2013-03-13 G&G Biotechnology Ltd. Lightweight implantable prosthetic device
US20090162596A1 (en) * 2005-08-02 2009-06-25 World Properties, Inc. Silicone compositions, methods of manufacture, and articles formed therefrom
US20100183814A1 (en) * 2005-08-02 2010-07-22 Victor Rios Silicone compositions, methods of manufacture, and articles formed therefrom
US20090162651A1 (en) * 2005-08-02 2009-06-25 World Properties, Inc. Silicone compositions, methods of manufacture, and articles formed therefrom
US8334022B2 (en) 2005-08-04 2012-12-18 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
US7589284B2 (en) * 2005-09-12 2009-09-15 Parker Hannifin Corporation Composite polymeric material for EMI shielding
EP1924631A4 (en) * 2005-09-16 2012-03-07 Hyperion Catalysis Int CONDUCTIVE SILICONES AND PROCESS FOR PREPARING THE SAME
ATE517947T1 (de) * 2005-12-21 2011-08-15 Dow Corning Silikonharzfilm, herstellungsverfahren dafür und nanomaterialgefüllte silikonzusammensetzung
EP1973964B1 (en) * 2006-01-19 2011-07-06 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone compositon
KR20080094783A (ko) * 2006-02-02 2008-10-24 다우 코닝 코포레이션 실리콘 수지 필름, 이의 제조방법 및 나노 물질-충전된실리콘 조성물
WO2007097835A2 (en) 2006-02-20 2007-08-30 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
WO2008042056A1 (en) * 2006-10-05 2008-04-10 Dow Corning Corporation Silicone resin film and method of preparing same
US20100112321A1 (en) * 2007-02-06 2010-05-06 Dow Corning Corporation Silicone Resin, Silicone Composition, Coated Substrate, and Reinforced Silicone Resin Film
JP5377334B2 (ja) 2007-02-22 2013-12-25 ダウ コーニング コーポレーション 強化シリコーン樹脂フィルム
EP2118217B1 (en) * 2007-02-22 2012-05-23 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
US8064203B2 (en) * 2007-02-22 2011-11-22 Dow Corning Corporation Process for preparing conductive films and articles prepared using the process
JP5426402B2 (ja) * 2007-02-22 2014-02-26 ダウ コーニング コーポレーション 強化シリコーン樹脂フィルム
EP2118203B1 (en) * 2007-02-22 2012-05-23 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
JP5269885B2 (ja) * 2007-05-01 2013-08-21 ダウ・コーニング・コーポレイション ナノ材料充填シリコーン組成物及び強化シリコーン樹脂フィルム
CN101675097B (zh) * 2007-05-01 2012-03-14 陶氏康宁公司 增强的有机硅树脂膜
JP2011500889A (ja) * 2007-10-12 2011-01-06 ダウ コーニング コーポレーション 強化シリコーン樹脂フィルムおよびナノ繊維充填シリコーン組成物
CN101412851B (zh) * 2008-11-25 2011-10-05 上海市合成树脂研究所 一种有机硅导电胶
US20120012382A1 (en) * 2009-05-13 2012-01-19 Laird Technologies, Inc. Conductive Films for EMI Shielding Applications
WO2011019719A1 (en) * 2009-08-12 2011-02-17 Parker-Hannifin Corporation Fully-cured thermally or electrically-conductive form-in-place gap filler
RU2583888C9 (ru) * 2010-01-18 2016-08-27 Джи энд Джи БИОТЕКНОЛОДЖИ ЛТД Легкий материал грудного имплантата
US8355770B2 (en) * 2010-03-22 2013-01-15 Idt Technology Limited Conductive silicone material for human skin electrode
US8766108B2 (en) 2010-08-30 2014-07-01 Parker Hannifin Corporation Encapsulated expanded crimped metal mesh for sealing and EMI shielding applications
US8759692B2 (en) 2010-08-30 2014-06-24 Parker-Hannifin Corporation Encapsulated expanded crimped metal mesh for sealing, EMI shielding and lightning strike applications
US9049777B2 (en) * 2010-11-01 2015-06-02 Plastics Research Corporation EMI shielded thermoset article
CN102276988B (zh) * 2011-06-08 2012-10-31 北京工业大学 一种单组份Ni-C填充型FIP热硫化高导电硅橡胶及其制备方法
JP5872440B2 (ja) * 2012-02-13 2016-03-01 Ｄｏｗａエレクトロニクス株式会社 球状銀粉およびその製造方法
RU2522614C2 (ru) * 2012-07-11 2014-07-20 Федеральное государственное унитарное предприятие "Государственный ордена Трудового Красного Знамени научно-исследовательский институт химии и технологии элементоорганических соединений" (ФГУП "ГНИИХТЭОС") Способ улучшения адгезии к металлам силиконовых композиционных материалов, получаемых по реакции полиприсоединения
DE102012220700A1 (de) * 2012-11-13 2014-05-15 Wacker Chemie Ag Füllstoffhaltige Siliconzusammensetzungen
KR20150087194A (ko) * 2012-11-20 2015-07-29 요코하마 고무 가부시키가이샤 저온 소성용 도전성 조성물 및 태양 전지 셀
WO2014099639A1 (en) * 2012-12-20 2014-06-26 Dow Corning Corporation Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same
US9447308B2 (en) 2013-03-14 2016-09-20 Dow Corning Corporation Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same
WO2014150302A1 (en) * 2013-03-14 2014-09-25 Dow Corning Corporation Conductive silicone materials and uses
CN103289410A (zh) * 2013-05-22 2013-09-11 吴江市德佐日用化学品有限公司 一种具有低压缩永久变形特性的导电硅橡胶
CN103351839A (zh) * 2013-07-23 2013-10-16 上海魁固塑胶制品有限公司 单组分脱胺型高导电硅橡胶及其制备方法
EP3059286B1 (en) * 2013-10-17 2020-08-26 Shin-Etsu Chemical Co., Ltd. Silicone gel composition, and silicone gel cured product
AR099038A1 (es) 2014-01-08 2016-06-22 General Cable Tech Corp Conductor aéreo recubierto
KR101640218B1 (ko) * 2014-06-26 2016-07-18 파낙스 이텍(주) 전도성 실리콘 수지 조성물 및 이로부터 제조된 전자파 차폐용 가스켓
CA2955812C (en) * 2014-08-05 2021-09-07 General Cable Technologies Corporation Fluoro copolymer coatings for overhead conductors
BR112017019431B1 (pt) 2015-03-12 2022-11-08 G & G Biotechnology Ltd Implante proteico com um compósito de um material de base e um material aditivo
US11319455B2 (en) 2015-11-13 2022-05-03 General Cable Technologies Corporation Cables coated with fluorocopolymer coatings
CN115241696A (zh) 2016-05-31 2022-10-25 安费诺有限公司 高性能线缆终端装置
CN106085340B (zh) * 2016-06-12 2019-01-11 江苏明昊新材料科技股份有限公司 具有触变特性的高导热导电银胶及其制备方法
CN106085341B (zh) * 2016-06-12 2019-01-11 江苏明昊新材料科技股份有限公司 单组分硅酮导电银胶及其制备方法
US10191519B2 (en) * 2016-09-19 2019-01-29 Google Llc Electronic device with gasket sealing receptacle for tongue
WO2018077725A1 (en) * 2016-10-24 2018-05-03 Luxembourg Institute Of Science And Technology (List) Method for forming an electrically conductive multilayer coating with anti-corrosion properties onto a metallic substrate
CN108117757B (zh) * 2016-11-28 2021-06-04 天迈科技股份有限公司 具有导电与防水特性的多功能胶体
US10640232B2 (en) * 2016-12-20 2020-05-05 The Boeing Company Conductive fastening system for composite structures
US11070006B2 (en) 2017-08-03 2021-07-20 Amphenol Corporation Connector for low loss interconnection system
CN107364065B (zh) * 2017-08-14 2023-11-28 深圳市康利邦科技有限公司 曲面玻璃屏保护膜的一体成型加工工艺及其保护膜
US10920077B2 (en) * 2017-12-08 2021-02-16 Lg Chem, Ltd Conductive silicone composition and silicone composite material manufactured thereby
WO2019135969A1 (en) * 2018-01-03 2019-07-11 Texting Tip LLC Fingernail tip stylus
WO2019159182A1 (en) 2018-02-18 2019-08-22 G & G Biotechnology Ltd. Implants with enhanced shell adhesion
LU100768B1 (en) * 2018-04-18 2019-10-22 Luxembourg Inst Science & Tech List Method for forming an electrically conductive multilayer coating with anti-corrosion properties onto a metallic substrate
KR102540533B1 (ko) * 2018-06-01 2023-06-07 현대자동차주식회사 열전도성이 우수한 경량 고분자 조성물과 그 제조방법 및 이 조성물을 이용하여 제조한 물품
CN109054729A (zh) * 2018-07-17 2018-12-21 泰州隆基乐叶光伏科技有限公司 一种湿/热双固化的导电胶及其制备方法
US12022642B2 (en) 2018-08-21 2024-06-25 Laird Technologies, Inc. Patterned electromagnetic interference (EMI) mitigation materials including carbon nanotubes
WO2020061988A1 (en) 2018-09-28 2020-04-02 Dow Silicones Corporation Liquid silicone rubber composition
JP7603588B2 (ja) 2018-12-26 2024-12-20 モメンティブ パフォーマンス マテリアルズ インコーポレイテッド 硬化性シリコーンベースの組成物およびその用途
US12479994B2 (en) 2018-12-26 2025-11-25 Momentive Performance Materials Inc. Curable silicone-based compositions and applications thereof
CN113423767B (zh) * 2018-12-26 2024-01-09 迈图高新材料公司 基于有机硅的固化性组合物和其应用
US11137014B2 (en) 2019-01-08 2021-10-05 The Boeing Company Conductive fastening system and method for improved EME performance
WO2020172395A1 (en) 2019-02-22 2020-08-27 Amphenol Corporation High performance cable connector assembly
CN110294940A (zh) * 2019-06-28 2019-10-01 深圳市飞荣达科技股份有限公司 屏蔽衬垫及其制备方法
CN213862058U (zh) * 2020-04-09 2021-08-03 莱尔德技术股份有限公司 电磁干扰emi吸收体、雷达支架、汽车和汽车部件
US11454661B2 (en) 2020-11-05 2022-09-27 Amplifier Research Corp. Field probe
GB2615904A (en) 2020-12-04 2023-08-23 Rogers Corp Multilayer sheet for preventing thermal runaway
CN112940510A (zh) * 2021-03-11 2021-06-11 广东思泉新材料股份有限公司 一种基于泡沫金属的三维骨架结构的致密导热硅胶复合材料及其制备方法
US12453500B2 (en) * 2021-05-11 2025-10-28 Purdue Research Foundation Poroelastic materials, biosensors comprising poroelastic materials, and methods of making and using poroelastic materials and biosensors
CN113338050A (zh) * 2021-06-07 2021-09-03 深圳先进电子材料国际创新研究院 一种耐高温金属化纤维布和导电硅胶复合材料及其制备方法和smt方面的用途
JP2024545394A (ja) * 2021-11-01 2024-12-06 ロジャーズ・コーポレイション 充填シリコーンフォーム層、組成物及びそれらの製造方法、並びに充填シリコーンフォーム層を含む物品
CN115260985A (zh) * 2022-08-26 2022-11-01 韦尔通(厦门)科技股份有限公司 一种双组份低粘度高导热灌封胶及其制备方法和应用
US12300888B2 (en) 2023-02-02 2025-05-13 Microsonic, Inc. System and method for attenuating radiation emissions from earpiece devices

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3583930A (en) 1968-04-16 1971-06-08 Chomerics Inc Plastics made conductive with coarse metal fillers
US4011360A (en) 1974-04-10 1977-03-08 Chomerics, Inc. Electrically conductive silicone rubber stock
US4279783A (en) 1979-04-04 1981-07-21 Dow Corning Corporation Electrically conductive silicone elastomers
JPS59199756A (ja) 1983-04-27 1984-11-12 Toshiba Silicone Co Ltd 導電性シリコ−ンゴム組成物
JPS63117065A (ja) 1986-11-05 1988-05-21 Toshiba Silicone Co Ltd 室温硬化型導電性シリコ−ンゴム組成物
JPS63251464A (ja) 1987-04-08 1988-10-18 Toray Silicone Co Ltd 導電性シリコ−ンゴム粒状物
JP2618663B2 (ja) 1987-11-30 1997-06-11 東レ・ダウコーニング・シリコーン株式会社 磁性シリコーンゴム粉状物の製造方法
US5075038A (en) 1988-11-04 1991-12-24 Dow Corning Corporation Electrically conductive silicone compositions
CA2000787A1 (en) 1988-11-04 1990-05-04 Richard L. Cole Electrically conductive silicone compositions
JPH05325647A (ja) 1991-03-29 1993-12-10 Siegel:Kk シリコーンゲル多孔質導電体並びにその製造方法
JP3084380B2 (ja) 1991-06-06 2000-09-04 株式会社ジェルテック 導電性シリコーンゲル材の使用方法と改質方法
US5182050A (en) 1991-10-24 1993-01-26 Amp Incorporated Extrinsically/intrinsically conductive gel
JP3318338B2 (ja) 1992-02-28 2002-08-26 東レ・ダウコーニング・シリコーン株式会社 導電性ポリオルガノシロキサン組成物の製造方法
JPH05271548A (ja) 1992-03-27 1993-10-19 Shin Etsu Chem Co Ltd オルガノポリシロキサン組成物及びその硬化物の形成方法
US5366664A (en) 1992-05-04 1994-11-22 The Penn State Research Foundation Electromagnetic shielding materials
DE4320527A1 (de) 1992-06-22 1993-12-23 Whitaker Corp Elektrisch leitfähiges Gel
JPH06144951A (ja) 1992-11-11 1994-05-24 Hiroyuki Kobayashi セラミックス発泡体とその製造方法
CA2129073C (en) 1993-09-10 2007-06-05 John P. Kalinoski Form-in-place emi gaskets
US5498644A (en) 1993-09-10 1996-03-12 Specialty Silicone Products, Inc. Silcone elastomer incorporating electrically conductive microballoons and method for producing same
JP2868986B2 (ja) 1993-10-06 1999-03-10 東レ・ダウコーニング・シリコーン株式会社 導電性シリコーンゴム組成物
JP2819444B2 (ja) * 1993-11-08 1998-10-30 東レ・ダウコーニング・シリコーン株式会社 導電性シリコーンゴム組成物
US5910524A (en) 1995-01-20 1999-06-08 Parker-Hannifin Corporation Corrosion-resistant, form-in-place EMI shielding gasket
JP3950493B2 (ja) * 1996-04-26 2007-08-01 東レ・ダウコーニング株式会社 導電性シリコーンゴム組成物、半導体装置の製造方法およびその半導体装置
JP3436464B2 (ja) 1996-10-31 2003-08-11 東レ・ダウコーニング・シリコーン株式会社 付加反応硬化型導電性シリコーン組成物および導電性シリコーン硬化物の製造方法
US5928569A (en) 1997-02-26 1999-07-27 Specialty Silicone Products, Inc. Substantially uniform moldable blends of silver particulate and organopolysiloxane
US6017587A (en) * 1998-07-09 2000-01-25 Dow Corning Corporation Electrically conductive silicone compositions
JP3922332B2 (ja) 2000-01-17 2007-05-30 信越化学工業株式会社 導電性液状シリコーンゴム組成物
JP3810976B2 (ja) * 2000-02-15 2006-08-16 株式会社小糸製作所 自動車用赤外光照射ランプ

Also Published As

Publication number Publication date
CN1528000A (zh) 2004-09-08
EP1399928A1 (en) 2004-03-24
US20030047718A1 (en) 2003-03-13
JP2004533501A (ja) 2004-11-04
EP1399928B1 (en) 2012-06-13
CN1273994C (zh) 2006-09-06
US6902688B2 (en) 2005-06-07
WO2002082468A1 (en) 2002-10-17

Similar Documents

Publication Publication Date Title
JP4375968B2 (ja) 導電性シリコーンおよびその製造方法
US5075038A (en) Electrically conductive silicone compositions
JP3436464B2 (ja) 付加反応硬化型導電性シリコーン組成物および導電性シリコーン硬化物の製造方法
JP4917164B2 (ja) 電力ケーブル部材
JP6662458B2 (ja) 熱伝導性シリコーンゴム複合シート
CN114729193B (zh) 热传导性硅酮组合物和热传导性硅酮片材
JP6065780B2 (ja) 導電性回路描画用インク組成物、導電性回路形成方法及びそれにより形成された導電性回路
WO2010087525A1 (en) Curable silicone rubber composition
EP3951862A1 (en) Multicomponent type thermally conductive silicone gel composition, thermally conductive member and heat dissipation structure
JP2003055554A (ja) 導電性液状シリコーンゴム組成物、導電性シリコーンゴム成形物およびその製造方法
WO2020100439A1 (ja) 導電性シリコーン組成物、硬化物、積層体、及び、電子回路
JP2020115475A (ja) 導電性ペースト
TW202134396A (zh) 導熱性矽酮樹脂組成物、硬化物及導熱性矽酮散熱片材
EP0367562B1 (en) Electrically conductive silicone compositions
JP2017082125A (ja) 導電性樹脂組成物、配線、配線基板および電子装置
JP6217303B2 (ja) 導電性シリコーンゴム製電極パターンの作製方法並びにオールシリコーンゴム製静電チャック及びその製造方法
KR102416096B1 (ko) 열전도성 시트
JP2020079413A (ja) 絶縁性ペースト
JP2006182823A (ja) 高電圧電気絶縁性シリコーンゴム用組成物、高電圧電気絶縁性シリコーンゴム組成物および高電圧電気絶縁体
JP3664811B2 (ja) 導電性シリコーンゴム組成物および導電性シリコーンゴム
JPH08120176A (ja) 半導電性シリコーンゴム組成物
KR20150072426A (ko) 충전제 함유 실리콘 조성물
JP4840560B2 (ja) 導電性ローラ及びそのシリコーンゴム弾性層と表層との接着性を向上する方法
JP2640480B2 (ja) シリコーンゴム組成物
JP7116056B2 (ja) 定着部材形成用シリコーンゴム組成物および定着部材

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050331

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070821

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20071116

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20080318

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080715

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20080728

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081104

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081112

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090428

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090708

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090901

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090908

R150 Certificate of patent or registration of utility model

Ref document number: 4375968

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120918

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130918

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term