JP2003338519A5 - - Google Patents

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Publication number
JP2003338519A5
JP2003338519A5 JP2002146321A JP2002146321A JP2003338519A5 JP 2003338519 A5 JP2003338519 A5 JP 2003338519A5 JP 2002146321 A JP2002146321 A JP 2002146321A JP 2002146321 A JP2002146321 A JP 2002146321A JP 2003338519 A5 JP2003338519 A5 JP 2003338519A5
Authority
JP
Japan
Prior art keywords
semiconductor device
electrode pads
wire
semiconductor chip
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002146321A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003338519A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002146321A priority Critical patent/JP2003338519A/ja
Priority claimed from JP2002146321A external-priority patent/JP2003338519A/ja
Priority to TW92112447A priority patent/TWI297184B/zh
Priority to US10/430,279 priority patent/US6900551B2/en
Priority to KR1020030030463A priority patent/KR20040014167A/ko
Priority to CNB031237061A priority patent/CN100481414C/zh
Publication of JP2003338519A publication Critical patent/JP2003338519A/ja
Priority to US11/035,999 priority patent/US20050121805A1/en
Publication of JP2003338519A5 publication Critical patent/JP2003338519A5/ja
Pending legal-status Critical Current

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JP2002146321A 2002-05-21 2002-05-21 半導体装置及びその製造方法 Pending JP2003338519A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2002146321A JP2003338519A (ja) 2002-05-21 2002-05-21 半導体装置及びその製造方法
TW92112447A TWI297184B (en) 2002-05-21 2003-05-07 A semiconductor device and a method of manufacturing the same
US10/430,279 US6900551B2 (en) 2002-05-21 2003-05-07 Semiconductor device with alternate bonding wire arrangement
KR1020030030463A KR20040014167A (ko) 2002-05-21 2003-05-14 반도체장치 및 그 제조방법
CNB031237061A CN100481414C (zh) 2002-05-21 2003-05-20 半导体器件及其制造方法
US11/035,999 US20050121805A1 (en) 2002-05-21 2005-01-18 Semiconductor device and a method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002146321A JP2003338519A (ja) 2002-05-21 2002-05-21 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2003338519A JP2003338519A (ja) 2003-11-28
JP2003338519A5 true JP2003338519A5 (enExample) 2005-09-29

Family

ID=29545121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002146321A Pending JP2003338519A (ja) 2002-05-21 2002-05-21 半導体装置及びその製造方法

Country Status (5)

Country Link
US (2) US6900551B2 (enExample)
JP (1) JP2003338519A (enExample)
KR (1) KR20040014167A (enExample)
CN (1) CN100481414C (enExample)
TW (1) TWI297184B (enExample)

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CN102456812B (zh) * 2010-10-28 2015-08-12 展晶科技(深圳)有限公司 发光二极管封装结构
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JP5294351B2 (ja) * 2011-04-01 2013-09-18 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5968713B2 (ja) * 2012-07-30 2016-08-10 ルネサスエレクトロニクス株式会社 半導体装置
CN104765169B (zh) * 2015-02-04 2018-01-05 深圳市华星光电技术有限公司 一种阵列基板的检测线路及阵列基板
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EP3422393A4 (en) * 2016-02-23 2020-02-05 Renesas Electronics Corporation SEMICONDUCTOR COMPONENT AND PRODUCTION METHOD THEREFOR
JP6304700B2 (ja) * 2016-09-26 2018-04-04 株式会社パウデック 半導体パッケージ、モジュールおよび電気機器
JP2018107296A (ja) * 2016-12-27 2018-07-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN108574158B (zh) * 2017-03-14 2020-10-09 群创光电股份有限公司 显示装置及其制造方法
JP6768569B2 (ja) * 2017-03-21 2020-10-14 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
JP2022118876A (ja) 2021-02-03 2022-08-16 キオクシア株式会社 半導体装置
KR20230084971A (ko) 2021-12-06 2023-06-13 삼성전자주식회사 반도체 패키지
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