JP2002530529A - プラスチック面の金属化処理プロセス - Google Patents
プラスチック面の金属化処理プロセスInfo
- Publication number
- JP2002530529A JP2002530529A JP2000582621A JP2000582621A JP2002530529A JP 2002530529 A JP2002530529 A JP 2002530529A JP 2000582621 A JP2000582621 A JP 2000582621A JP 2000582621 A JP2000582621 A JP 2000582621A JP 2002530529 A JP2002530529 A JP 2002530529A
- Authority
- JP
- Japan
- Prior art keywords
- solution
- plastic surface
- process according
- etching
- minutes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920003023 plastic Polymers 0.000 title claims abstract description 101
- 239000004033 plastic Substances 0.000 title claims abstract description 101
- 238000000034 method Methods 0.000 title claims abstract description 90
- 230000008569 process Effects 0.000 title claims abstract description 70
- 238000001465 metallisation Methods 0.000 title claims abstract description 18
- 239000000243 solution Substances 0.000 claims abstract description 82
- 229910052751 metal Inorganic materials 0.000 claims abstract description 53
- 239000002184 metal Substances 0.000 claims abstract description 53
- 239000012266 salt solution Substances 0.000 claims abstract description 48
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims abstract description 25
- 150000003839 salts Chemical class 0.000 claims abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 3
- 238000005530 etching Methods 0.000 claims description 77
- 238000011282 treatment Methods 0.000 claims description 56
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
- 239000012670 alkaline solution Substances 0.000 claims description 16
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 239000007800 oxidant agent Substances 0.000 claims description 13
- 150000001868 cobalt Chemical class 0.000 claims description 12
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical class [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 229910052977 alkali metal sulfide Inorganic materials 0.000 claims description 4
- 229910021529 ammonia Inorganic materials 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 3
- 229910000001 cobalt(II) carbonate Inorganic materials 0.000 claims description 3
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims description 2
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical class [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 229910017052 cobalt Inorganic materials 0.000 abstract 1
- 239000010941 cobalt Substances 0.000 abstract 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 abstract 1
- 239000011133 lead Substances 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 239000011135 tin Substances 0.000 abstract 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 22
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 10
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 239000012153 distilled water Substances 0.000 description 8
- 239000012286 potassium permanganate Substances 0.000 description 8
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 7
- 239000003792 electrolyte Substances 0.000 description 7
- 239000004417 polycarbonate Substances 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 230000004913 activation Effects 0.000 description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 5
- 239000000499 gel Substances 0.000 description 5
- 238000007654 immersion Methods 0.000 description 5
- 239000011734 sodium Substances 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- KHIWWQKSHDUIBK-UHFFFAOYSA-N periodic acid Chemical compound OI(=O)(=O)=O KHIWWQKSHDUIBK-UHFFFAOYSA-N 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- -1 polypropylene Polymers 0.000 description 4
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical group 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 230000001351 cycling effect Effects 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- VDQVEACBQKUUSU-UHFFFAOYSA-M disodium;sulfanide Chemical compound [Na+].[Na+].[SH-] VDQVEACBQKUUSU-UHFFFAOYSA-M 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- 229920005669 high impact polystyrene Polymers 0.000 description 2
- 239000004797 high-impact polystyrene Substances 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 2
- 229920001643 poly(ether ketone) Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920001021 polysulfide Polymers 0.000 description 2
- 239000005077 polysulfide Substances 0.000 description 2
- 150000008117 polysulfides Polymers 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 229910052979 sodium sulfide Inorganic materials 0.000 description 2
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000000080 wetting agent Substances 0.000 description 2
- FZZMTSNZRBFGGU-UHFFFAOYSA-N 2-chloro-7-fluoroquinazolin-4-amine Chemical compound FC1=CC=C2C(N)=NC(Cl)=NC2=C1 FZZMTSNZRBFGGU-UHFFFAOYSA-N 0.000 description 1
- 102100033041 Carbonic anhydrase 13 Human genes 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910021580 Cobalt(II) chloride Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241001137251 Corvidae Species 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
- 101100396994 Drosophila melanogaster Inos gene Proteins 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 101000867860 Homo sapiens Carbonic anhydrase 13 Proteins 0.000 description 1
- 101000650817 Homo sapiens Semaphorin-4D Proteins 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 102100027744 Semaphorin-4D Human genes 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- UYJXRRSPUVSSMN-UHFFFAOYSA-P ammonium sulfide Chemical compound [NH4+].[NH4+].[S-2] UYJXRRSPUVSSMN-UHFFFAOYSA-P 0.000 description 1
- 239000011260 aqueous acid Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- YECBRSTWAYLPIM-UHFFFAOYSA-N chromium;hydrochloride Chemical compound Cl.[Cr] YECBRSTWAYLPIM-UHFFFAOYSA-N 0.000 description 1
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 1
- JAWGVVJVYSANRY-UHFFFAOYSA-N cobalt(3+) Chemical compound [Co+3] JAWGVVJVYSANRY-UHFFFAOYSA-N 0.000 description 1
- 229910000335 cobalt(II) sulfate Inorganic materials 0.000 description 1
- LBFUKZWYPLNNJC-UHFFFAOYSA-N cobalt(ii,iii) oxide Chemical compound [Co]=O.O=[Co]O[Co]=O LBFUKZWYPLNNJC-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- MYWUZJCMWCOHBA-VIFPVBQESA-N methamphetamine Chemical compound CN[C@@H](C)CC1=CC=CC=C1 MYWUZJCMWCOHBA-VIFPVBQESA-N 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000005385 peroxodisulfate group Chemical group 0.000 description 1
- 235000015108 pies Nutrition 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| LT98-161A LT4713B (lt) | 1998-11-13 | 1998-11-13 | Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas |
| DE1999104665 DE19904665A1 (de) | 1999-02-04 | 1999-02-04 | Verfahren zur Metallisierung einer Kunststoffoberfläche |
| EP99115967A EP1001052B1 (de) | 1998-11-13 | 1999-08-13 | Verfahren zur Metallisierung einer Kunststoffoberfläche |
| EP19904665.4 | 1999-08-13 | ||
| EP99115967.4 | 1999-08-13 | ||
| EP98-161 | 1999-08-13 | ||
| PCT/US1999/026066 WO2000029646A1 (en) | 1998-11-13 | 1999-11-05 | Process for metallizing a plastic surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002530529A true JP2002530529A (ja) | 2002-09-17 |
| JP2002530529A5 JP2002530529A5 (enExample) | 2006-02-09 |
Family
ID=27218955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000582621A Pending JP2002530529A (ja) | 1998-11-13 | 1999-11-05 | プラスチック面の金属化処理プロセス |
Country Status (8)
| Country | Link |
|---|---|
| JP (1) | JP2002530529A (enExample) |
| CN (1) | CN1184361C (enExample) |
| AU (1) | AU1243300A (enExample) |
| BR (1) | BR9915280A (enExample) |
| CA (1) | CA2350422A1 (enExample) |
| MX (1) | MXPA01004811A (enExample) |
| TW (1) | TWI221163B (enExample) |
| WO (1) | WO2000029646A1 (enExample) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002146589A (ja) * | 2000-07-20 | 2002-05-22 | Shipley Co Llc | 誘電体表面上に導電層を製造する方法 |
| JP2005336614A (ja) * | 2004-05-27 | 2005-12-08 | Enthone Inc | プラスチック表面をめっきするための方法 |
| JP2007039770A (ja) * | 2005-08-05 | 2007-02-15 | Kakihara Kogyo Kk | 銅フリー樹脂めっきの耐食性向上方法 |
| JP2007039772A (ja) * | 2005-08-05 | 2007-02-15 | Kakihara Kogyo Kk | 銅フリー樹脂めっきの成膜方法 |
| WO2007116493A1 (ja) * | 2006-03-31 | 2007-10-18 | Ebara-Udylite Co., Ltd. | プラスチック用の表面改質液およびそれを利用したプラスチック表面の金属化方法 |
| WO2008132926A1 (ja) * | 2007-04-18 | 2008-11-06 | Ebara-Udylite Co., Ltd. | エッチング液およびこれを用いたプラスチック表面の金属化方法 |
| JP2009022948A (ja) * | 2007-06-20 | 2009-02-05 | Okuno Chem Ind Co Ltd | エッチング液の電解処理方法 |
| JP2009094277A (ja) * | 2007-10-09 | 2009-04-30 | Okuno Chem Ind Co Ltd | スミア除去用組成物 |
| JP2010535935A (ja) * | 2007-08-10 | 2010-11-25 | エントン インコーポレイテッド | プラスチック表面のための無クロム酸洗 |
| US8394289B2 (en) | 2006-04-18 | 2013-03-12 | Okuno Chemicals Industries Co., Ltd. | Composition for etching treatment of resin molded article |
| JP2013511844A (ja) * | 2009-11-18 | 2013-04-04 | スリーエム イノベイティブ プロパティズ カンパニー | Ｉｉ〜ｖｉ半導体のための新規なウェットエッチング剤及び方法 |
| JP2015513003A (ja) * | 2012-03-15 | 2015-04-30 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ | 非導電性プラスチック表面の金属化方法 |
| JP5830807B2 (ja) * | 2013-10-22 | 2015-12-09 | 奥野製薬工業株式会社 | 樹脂材料のエッチング処理用組成物 |
| JP2022551764A (ja) * | 2019-11-21 | 2022-12-13 | コヴェンティア ソチエタ ペル アツィオーニ | 金属化すべきプラスチック部品を調製するための電解処理装置及びプラスチック部品をエッチングする方法 |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0118870D0 (en) | 2001-08-02 | 2001-09-26 | Shipley Co Llc | A combined adhesion promotion and direct metallization process |
| DE10138446A1 (de) * | 2001-08-04 | 2003-02-13 | Enthone Omi Deutschland Gmbh | Verfahren zur Metallisierung von Kunststoffoberflächen |
| US7163835B2 (en) * | 2003-09-26 | 2007-01-16 | E. I. Du Pont De Nemours And Company | Method for producing thin semiconductor films by deposition from solution |
| DE102005051632B4 (de) | 2005-10-28 | 2009-02-19 | Enthone Inc., West Haven | Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen |
| US7354870B2 (en) | 2005-11-14 | 2008-04-08 | National Research Council Of Canada | Process for chemical etching of parts fabricated by stereolithography |
| KR101317667B1 (ko) * | 2005-12-06 | 2013-10-15 | 가부시끼가이샤 제이씨유 | 팔라듐 착체 및 이것을 이용하는 촉매 부여 처리액 |
| DE102011111294B4 (de) * | 2011-08-26 | 2018-12-20 | Atotech Deutschland Gmbh | Verfahren zur Behandlung von Kunststoffsubstraten und Vorrichtung zur Regeneration einer Behandlungslösung |
| EP2639332A1 (de) * | 2012-03-15 | 2013-09-18 | Atotech Deutschland GmbH | Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen |
| EP2639333A1 (de) * | 2012-03-15 | 2013-09-18 | Atotech Deutschland GmbH | Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen |
| LT6070B (lt) * | 2012-12-07 | 2014-09-25 | Atotech Deutschland Gmbh | Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas |
| EP2767614A1 (en) * | 2013-02-13 | 2014-08-20 | ATOTECH Deutschland GmbH | Method for depositing a first metallic layer onto non-conductive polymers |
| CN104975276B (zh) * | 2014-04-11 | 2019-07-12 | 深圳市泛友科技有限公司 | 在塑料表面形成选择性金属线路的方法及塑料部件 |
| WO2015183304A1 (en) * | 2014-05-30 | 2015-12-03 | Uab Rekin International | Chrome-free adhesion pre-treatment for plastics |
| CN105369227B (zh) * | 2015-12-08 | 2017-08-25 | 丽水学院 | 用于酸性高锰酸钾溶液的稳定剂 |
| JP6750293B2 (ja) * | 2016-04-28 | 2020-09-02 | 栗田工業株式会社 | プラスチック表面の処理方法 |
| CN106086838B (zh) * | 2016-06-21 | 2019-04-02 | 太仓碧奇新材料研发有限公司 | 钕锌钴合金/聚丙烯支架材料的制备方法 |
| CN106011801A (zh) * | 2016-06-27 | 2016-10-12 | 镇江阿尔法特种镀膜科技有限公司 | 一种特种工程塑料用粗化溶液 |
| JP6288213B1 (ja) * | 2016-11-01 | 2018-03-07 | 栗田工業株式会社 | プラスチック表面の処理方法 |
| CN110402304A (zh) * | 2016-12-21 | 2019-11-01 | 哈索赫伯特施密特有限两合公司 | 用于酸洗合成材料的酸洗液 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4810333A (en) * | 1987-12-14 | 1989-03-07 | Shipley Company Inc. | Electroplating process |
| US4917761A (en) * | 1989-08-14 | 1990-04-17 | Eastman Kodak Company | Method of rendering polymeric materials hydrophilic for etching |
| US5110633A (en) * | 1989-09-01 | 1992-05-05 | Ciba-Geigy Corporation | Process for coating plastics articles |
| US4919768A (en) * | 1989-09-22 | 1990-04-24 | Shipley Company Inc. | Electroplating process |
| US5192590A (en) * | 1989-11-03 | 1993-03-09 | Raychem Corporation | Coating metal on poly(aryl ether ketone) surfaces |
| US5238550A (en) * | 1991-11-27 | 1993-08-24 | Shipley Company Inc. | Electroplating process |
-
1999
- 1999-11-05 CN CNB998154938A patent/CN1184361C/zh not_active Expired - Fee Related
- 1999-11-05 WO PCT/US1999/026066 patent/WO2000029646A1/en not_active Ceased
- 1999-11-05 AU AU12433/00A patent/AU1243300A/en not_active Abandoned
- 1999-11-05 JP JP2000582621A patent/JP2002530529A/ja active Pending
- 1999-11-05 CA CA002350422A patent/CA2350422A1/en not_active Abandoned
- 1999-11-05 MX MXPA01004811A patent/MXPA01004811A/es not_active Application Discontinuation
- 1999-11-05 BR BR9915280-0A patent/BR9915280A/pt not_active IP Right Cessation
- 1999-11-11 TW TW088119793A patent/TWI221163B/zh not_active IP Right Cessation
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002146589A (ja) * | 2000-07-20 | 2002-05-22 | Shipley Co Llc | 誘電体表面上に導電層を製造する方法 |
| JP2005336614A (ja) * | 2004-05-27 | 2005-12-08 | Enthone Inc | プラスチック表面をめっきするための方法 |
| JP2007039770A (ja) * | 2005-08-05 | 2007-02-15 | Kakihara Kogyo Kk | 銅フリー樹脂めっきの耐食性向上方法 |
| JP2007039772A (ja) * | 2005-08-05 | 2007-02-15 | Kakihara Kogyo Kk | 銅フリー樹脂めっきの成膜方法 |
| WO2007116493A1 (ja) * | 2006-03-31 | 2007-10-18 | Ebara-Udylite Co., Ltd. | プラスチック用の表面改質液およびそれを利用したプラスチック表面の金属化方法 |
| US8394289B2 (en) | 2006-04-18 | 2013-03-12 | Okuno Chemicals Industries Co., Ltd. | Composition for etching treatment of resin molded article |
| JP5177426B2 (ja) * | 2006-04-18 | 2013-04-03 | 奥野製薬工業株式会社 | 樹脂成形体に対するエッチング処理用組成物 |
| WO2008132926A1 (ja) * | 2007-04-18 | 2008-11-06 | Ebara-Udylite Co., Ltd. | エッチング液およびこれを用いたプラスチック表面の金属化方法 |
| JP2009022948A (ja) * | 2007-06-20 | 2009-02-05 | Okuno Chem Ind Co Ltd | エッチング液の電解処理方法 |
| JP2010535935A (ja) * | 2007-08-10 | 2010-11-25 | エントン インコーポレイテッド | プラスチック表面のための無クロム酸洗 |
| KR101576693B1 (ko) | 2007-08-10 | 2015-12-10 | 엔쏜 인코포레이티드 | 플라스틱 표면용 무크롬 산세 |
| JP2009094277A (ja) * | 2007-10-09 | 2009-04-30 | Okuno Chem Ind Co Ltd | スミア除去用組成物 |
| JP2013511844A (ja) * | 2009-11-18 | 2013-04-04 | スリーエム イノベイティブ プロパティズ カンパニー | Ｉｉ〜ｖｉ半導体のための新規なウェットエッチング剤及び方法 |
| JP2015513003A (ja) * | 2012-03-15 | 2015-04-30 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ | 非導電性プラスチック表面の金属化方法 |
| JP5830807B2 (ja) * | 2013-10-22 | 2015-12-09 | 奥野製薬工業株式会社 | 樹脂材料のエッチング処理用組成物 |
| US9657226B2 (en) | 2013-10-22 | 2017-05-23 | Okuno Chemical Industries Co., Ltd. | Composition for etching treatment of resin material |
| KR20170077274A (ko) * | 2013-10-22 | 2017-07-05 | 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 | 수지 재료의 에칭 처리용 조성물 |
| KR102011851B1 (ko) | 2013-10-22 | 2019-08-20 | 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 | 수지 재료의 에칭 처리용 조성물 |
| JP2022551764A (ja) * | 2019-11-21 | 2022-12-13 | コヴェンティア ソチエタ ペル アツィオーニ | 金属化すべきプラスチック部品を調製するための電解処理装置及びプラスチック部品をエッチングする方法 |
| JP7291858B2 (ja) | 2019-11-21 | 2023-06-15 | コヴェンティア ソチエタ ペル アツィオーニ | 金属化すべきプラスチック部品を調製するための電解処理装置及びプラスチック部品をエッチングする方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2350422A1 (en) | 2000-05-25 |
| CN1333843A (zh) | 2002-01-30 |
| CN1184361C (zh) | 2005-01-12 |
| AU1243300A (en) | 2000-06-05 |
| MXPA01004811A (es) | 2002-09-18 |
| BR9915280A (pt) | 2001-08-07 |
| TWI221163B (en) | 2004-09-21 |
| WO2000029646A1 (en) | 2000-05-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2002530529A (ja) | プラスチック面の金属化処理プロセス | |
| US6712948B1 (en) | Process for metallizing a plastic surface | |
| KR100188481B1 (ko) | 유전기질과 도금기질을 직접 전기도금 하는 방법 | |
| KR101927679B1 (ko) | 유전체 기판과 금속 층 사이에 접착을 증진시키는 방법 | |
| US5106473A (en) | Process for metallizing a through-hole board | |
| KR100684821B1 (ko) | 플라스틱 표면의 금속화 방법 | |
| KR100541893B1 (ko) | 금속으로 기판을 코팅하는 방법 | |
| KR20010086023A (ko) | 플라스틱 표면을 금속 처리하는 방법 | |
| CN104073789B (zh) | 化学镀的方法和用于该方法的溶液 | |
| JPH0397873A (ja) | プラスチック製品の塗被法 | |
| JP2003064480A (ja) | 銅−樹脂複合材料の形成方法 | |
| ES2353661T3 (es) | Procedimiento para la activación de substratos para la galvanización de plásticos. | |
| EP2305856A1 (en) | Process for applying a metal coating to a non-conductive substrate | |
| JP4449246B2 (ja) | 無電解めっき材の前処理方法 | |
| CN110139946B (zh) | 塑料上的无铬镀覆蚀刻 | |
| US20030039754A1 (en) | Preactivation of plastic surfaces to be metallized | |
| JPH05287582A (ja) | 非導電性材料表面に電気メッキ層を直接形成する方法 | |
| JP2003193247A (ja) | 無電解めっき素材の前処理方法 | |
| JP2003183881A (ja) | 複合接着性促進および直接金属化法 | |
| CN104204294A (zh) | 促进介电衬底与金属层之间粘着度的方法 | |
| JP2000212759A (ja) | ウレタン樹脂のメッキ品及びそのメッキ方法 | |
| JPH05287583A (ja) | 非導電性材料表面に電気メッキ層を直接形成する方法 | |
| JP2001152353A (ja) | 非導電性プラスチックへの電気めっき方法 | |
| KR20030026470A (ko) | 비전도성 물질의 금 도금을 위한 전처리 방법 | |
| JP2000129022A (ja) | 連続通気性を有する非導電性多孔性材料の金属メッキ方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040109 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040109 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20051201 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060518 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060620 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20060919 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060921 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20061004 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20061024 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070221 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070402 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070330 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20070502 |
|
| A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20070713 |