CN1184361C - 塑料表面敷镀金属的方法 - Google Patents

塑料表面敷镀金属的方法 Download PDF

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Publication number
CN1184361C
CN1184361C CNB998154938A CN99815493A CN1184361C CN 1184361 C CN1184361 C CN 1184361C CN B998154938 A CNB998154938 A CN B998154938A CN 99815493 A CN99815493 A CN 99815493A CN 1184361 C CN1184361 C CN 1184361C
Authority
CN
China
Prior art keywords
solution
sulfide
metal
etching
metal salt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB998154938A
Other languages
English (en)
Chinese (zh)
Other versions
CN1333843A (zh
Inventor
L·纳鲁斯克维西乌斯
G·罗佐韦斯基斯
J·文克维西乌斯
M·巴拉劳斯卡斯
A·默比乌斯
P·皮斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ensuoen -Omi
Original Assignee
Ensuoen -Omi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from LT98-161A external-priority patent/LT4713B/lt
Priority claimed from DE1999104665 external-priority patent/DE19904665A1/de
Priority claimed from EP99115967A external-priority patent/EP1001052B1/de
Application filed by Ensuoen -Omi filed Critical Ensuoen -Omi
Publication of CN1333843A publication Critical patent/CN1333843A/zh
Application granted granted Critical
Publication of CN1184361C publication Critical patent/CN1184361C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
CNB998154938A 1998-11-13 1999-11-05 塑料表面敷镀金属的方法 Expired - Fee Related CN1184361C (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
LT98-161A LT4713B (lt) 1998-11-13 1998-11-13 Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas
LT98161 1998-11-13
DE1999104665 DE19904665A1 (de) 1999-02-04 1999-02-04 Verfahren zur Metallisierung einer Kunststoffoberfläche
DE19904665.4 1999-02-04
EP99115967A EP1001052B1 (de) 1998-11-13 1999-08-13 Verfahren zur Metallisierung einer Kunststoffoberfläche
EP99115967.4 1999-08-13

Publications (2)

Publication Number Publication Date
CN1333843A CN1333843A (zh) 2002-01-30
CN1184361C true CN1184361C (zh) 2005-01-12

Family

ID=27218955

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB998154938A Expired - Fee Related CN1184361C (zh) 1998-11-13 1999-11-05 塑料表面敷镀金属的方法

Country Status (8)

Country Link
JP (1) JP2002530529A (enExample)
CN (1) CN1184361C (enExample)
AU (1) AU1243300A (enExample)
BR (1) BR9915280A (enExample)
CA (1) CA2350422A1 (enExample)
MX (1) MXPA01004811A (enExample)
TW (1) TWI221163B (enExample)
WO (1) WO2000029646A1 (enExample)

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* Cited by examiner, † Cited by third party
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LT2000074A (lt) * 2000-07-20 2002-01-25 Mykolas Baranauskas Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas
GB0118870D0 (en) 2001-08-02 2001-09-26 Shipley Co Llc A combined adhesion promotion and direct metallization process
DE10138446A1 (de) * 2001-08-04 2003-02-13 Enthone Omi Deutschland Gmbh Verfahren zur Metallisierung von Kunststoffoberflächen
US7163835B2 (en) * 2003-09-26 2007-01-16 E. I. Du Pont De Nemours And Company Method for producing thin semiconductor films by deposition from solution
DE102004026489B3 (de) * 2004-05-27 2005-09-29 Enthone Inc., West Haven Verfahren zur Metallisierung von Kunststoffoberflächen
JP4494309B2 (ja) * 2005-08-05 2010-06-30 柿原工業株式会社 銅フリーのニッケル−クロム樹脂めっきの耐食性向上方法
JP4494310B2 (ja) * 2005-08-05 2010-06-30 柿原工業株式会社 銅フリー樹脂めっきの成膜方法
DE102005051632B4 (de) 2005-10-28 2009-02-19 Enthone Inc., West Haven Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen
US7354870B2 (en) 2005-11-14 2008-04-08 National Research Council Of Canada Process for chemical etching of parts fabricated by stereolithography
KR101317667B1 (ko) * 2005-12-06 2013-10-15 가부시끼가이샤 제이씨유 팔라듐 착체 및 이것을 이용하는 촉매 부여 처리액
EP2006415A2 (en) * 2006-03-31 2008-12-24 Ebara-Udylite Co., Ltd. Surface modification liquid for plastic and method of metallizing plastic surface therewith
EP2009142B8 (en) 2006-04-18 2013-08-14 Okuno Chemical Industries Co., Ltd. Composition for etching treatment of resin molded article
KR20100014699A (ko) * 2007-04-18 2010-02-10 에바라 유지라이토 가부시키가이샤 에칭액 및 이를 이용한 플라스틱 표면의 금속화 방법
JP4849420B2 (ja) * 2007-06-20 2012-01-11 奥野製薬工業株式会社 エッチング液の電解処理方法
PL2025708T3 (pl) * 2007-08-10 2010-03-31 Enthone Roztwór trawiący do powierzchni tworzyw sztucznych nie zawierający chromu
JP5339023B2 (ja) * 2007-10-09 2013-11-13 奥野製薬工業株式会社 スミア除去用組成物
EP2502263B1 (en) * 2009-11-18 2014-09-03 3M Innovative Properties Company Wet etching method for ii-vi semiconductors
DE102011111294B4 (de) * 2011-08-26 2018-12-20 Atotech Deutschland Gmbh Verfahren zur Behandlung von Kunststoffsubstraten und Vorrichtung zur Regeneration einer Behandlungslösung
EP2639334A1 (de) * 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2639332A1 (de) * 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2639333A1 (de) * 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
LT6070B (lt) * 2012-12-07 2014-09-25 Atotech Deutschland Gmbh Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas
EP2767614A1 (en) * 2013-02-13 2014-08-20 ATOTECH Deutschland GmbH Method for depositing a first metallic layer onto non-conductive polymers
ES2685409T3 (es) 2013-10-22 2018-10-08 Okuno Chemical Industries Co., Ltd. Composición para el tratamiento por grabado químico de un material de resina
CN104975276B (zh) * 2014-04-11 2019-07-12 深圳市泛友科技有限公司 在塑料表面形成选择性金属线路的方法及塑料部件
WO2015183304A1 (en) * 2014-05-30 2015-12-03 Uab Rekin International Chrome-free adhesion pre-treatment for plastics
CN105369227B (zh) * 2015-12-08 2017-08-25 丽水学院 用于酸性高锰酸钾溶液的稳定剂
JP6750293B2 (ja) * 2016-04-28 2020-09-02 栗田工業株式会社 プラスチック表面の処理方法
CN106086838B (zh) * 2016-06-21 2019-04-02 太仓碧奇新材料研发有限公司 钕锌钴合金/聚丙烯支架材料的制备方法
CN106011801A (zh) * 2016-06-27 2016-10-12 镇江阿尔法特种镀膜科技有限公司 一种特种工程塑料用粗化溶液
JP6288213B1 (ja) * 2016-11-01 2018-03-07 栗田工業株式会社 プラスチック表面の処理方法
CN110402304A (zh) * 2016-12-21 2019-11-01 哈索赫伯特施密特有限两合公司 用于酸洗合成材料的酸洗液
EP3825441A1 (en) * 2019-11-21 2021-05-26 COVENTYA S.p.A. An electrolytic treatment device for preparing plastic parts to be metallized and a method for etching plastic parts

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US4810333A (en) * 1987-12-14 1989-03-07 Shipley Company Inc. Electroplating process
US4917761A (en) * 1989-08-14 1990-04-17 Eastman Kodak Company Method of rendering polymeric materials hydrophilic for etching
US5110633A (en) * 1989-09-01 1992-05-05 Ciba-Geigy Corporation Process for coating plastics articles
US4919768A (en) * 1989-09-22 1990-04-24 Shipley Company Inc. Electroplating process
US5192590A (en) * 1989-11-03 1993-03-09 Raychem Corporation Coating metal on poly(aryl ether ketone) surfaces
US5238550A (en) * 1991-11-27 1993-08-24 Shipley Company Inc. Electroplating process

Also Published As

Publication number Publication date
CA2350422A1 (en) 2000-05-25
CN1333843A (zh) 2002-01-30
JP2002530529A (ja) 2002-09-17
AU1243300A (en) 2000-06-05
MXPA01004811A (es) 2002-09-18
BR9915280A (pt) 2001-08-07
TWI221163B (en) 2004-09-21
WO2000029646A1 (en) 2000-05-25

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C06 Publication
C10 Entry into substantive examination
PB01 Publication
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20050112

Termination date: 20101105