Classifications

• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
  • C25D5/54—Electroplating of non-metallic surfaces
  • C25D5/56—Electroplating of non-metallic surfaces of plastics
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
  • C23C18/18—Pretreatment of the material to be coated
  • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
  • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
  • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
  • C23C18/2073—Multistep pretreatment
  • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
  • C23C18/18—Pretreatment of the material to be coated
  • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
  • C23C18/22—Roughening, e.g. by etching
  • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
  • C23C18/18—Pretreatment of the material to be coated
  • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
  • C23C18/28—Sensitising or activating
  • C23C18/285—Sensitising or activating with tin based compound or composition
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
  • C23C18/31—Coating with metals
  • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
  • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents

Definitions

• the invention concerns a process for the metallizing of a plastic surface.
• the plastic surface of a plastic article or the plastic surfaces of several plastic articles are metallized.
• metallized plastics are used for decorative purposes, for example in the sanitary facilities field or m the manufacture of automobiles.
• metallization of plastics also occurs in connection with the surface treatment of electronic components for the purpose of electronic shielding.
• plastics such as ac- rylnitrile-butadiene-styrene (ABS) and possibly ABS-Polycarbonate blends are metallized for decorative purposes.
• ABS ac- rylnitrile-butadiene-styrene
• ABS-Polycarbonate blends are metallized for decorative purposes.
• the plastic surface is first roughened by strong etching, for example with chromic acid or chrome-hydrochloric acid.
• surface roughening is meant especially that, due to the etching process, micro-caverns are created m the plastic surface
• micro-caverns m general, have a size on the order of A to 10 ⁇ m.
• these micro-caverns show a depth (i.e. an extent from the plastic surface toward the interior) in the range of ⁇ to 10 ⁇ m
• the etching takes place at relatively high temperatures and, as a rule, for relatively extended pe ⁇ ods.
• the concentration of an oxidizer added to the etching solution normally is relatively high.
• the roughening of the plastic surface has the purpose of allowing the subsequently to be applied activating layer and/or metal layer to almost hook into the roughened plastic surface.
• the adhesion of a metal layer to the roughened plastic surface is achieved almost in the manner of the snap fastener principle m this known process
• the surface first is activated with colloidal palladium or lonogene palladium. This activation, m the case of the colloidal process, is followed by a removal of a protective tm colloid or, m the case of the lonogene process, a reduction to the elemental palladium.
• copper or nickel is chemically deposited on the plastic surface as a conducting layer.
• micro- caverns are created in the plastic surface by etching in which the metal layer to be applied is mechanically anchored or hooked into Also, the etching occurs at elevated temperatures in this process
• the etching solution generally has a high concentration of an oxidizer
• the plastic surface pre-treated in this manner, subsequently is treated with a copper salt solution, and afterward it is treated with a second solution, containing sulfide ions or polysulfide ions In this manner, an electrically conducting layer of non-stochiomeric copper sulfide is created on the plastic surface.
• the initial step of this known process is followed by the treatment of the plastic surface with both of the cited solutions at room temperature for a duration of maximally 1 minute.
• the invention is based on the technical problem to describe a process of the type mentioned in the beginning by which, in a less complex manner, a large variety of plastics can be metallized m a functionally secure and reproducible manner, whereby they are provided with a metal layer which meets all requirements
• the invention describes a process for metallizing a plastic surface, whereby the following process steps are performed m sequence: 1J) The plastic surface is subjected to etching under mild conditions.
• the plastic surface is treated with a metal salt solution which comprises at least one salt of the group "Cobalt salt, silver salt, tin salt, lead salt".
• the mild etching referred to in the invention means especially that the "etching", or the treatment of the plastic surface, respectively, with a etching solution occurs at low temperatures and/or within a shorter time period at low concentration of the etching solution.
• mild etching conditions can be realized already when one of the preceding three conditions is met.
• the low temperature referred to m the invention means a maximum temperature of 40°C. When the mild etching conditions are created by a low temperature, this is usefully a maximum of 30°C, with a temperature of between 15°C and 25°C being preferred.
• the pre-treatment with the etching solution takes place especially over a time period of 3 to 15 minutes, preferably 5 to 15 minutes and even more preferred 5 to 10 minutes.
• the invention claims that the treatment period is the shorter the higher the temperature.
• mild etching conditions can be also achieved at temperatures in excess of 40°C if the treatment period selected is appropriately short.
• the etching treatment takes place at temperatures of 40°C to 95°C, preferably 50°C to 70°C, for a treatment pe ⁇ od of 15 seconds to 5 minutes, preferably .5 to 3 minutes.
• the invention claims that the treatment pe ⁇ od is the shorter the higher the process temperature.
• the process temperature and/or process time is selected in accordance with the type of the etching solution employed.
• Mild etching as specified m the invention also means that, contrary to the known processes referred to above, a roughening of the plastic surface, or the creation of micro- caverns m the plastic surface, respectively, does not occur.
• the invention envisions that the etching conditions are adjusted so that only small openings or pores, respectively, are created m the plastic surface which have a diameter and especially a depth of ⁇ .09 ⁇ m, with ⁇ .05 ⁇ m preferred.
• depth means the extent of the open- mgs/gateways from the plastic surface into the plastic interior.
• the invention envisions that by creating small openings or pores, respectively, the plastic surface is opened for the diffusion of the metal ions of the metal salt solution. In other words, the plastic surface is transformed into something membrane-like, or a quasi diffusion membrane is created m the plastic surface, respectively.
• Mild etching conditions within the scope of the invention also mean that the etching conditions are applied with the intention that only the mentioned small pores are created in the plastic surface and that micro-caverns or interior hollows, respectively, in the plastic surface do not occur.
• diffusion openings or diffusion channels are created in the area of the plastic surface which have a depth of ⁇ .09 ⁇ m, preferably ⁇ .05 ⁇ m.
• the etching treatment envisioned by the invention can be realized with a etching solution and/or basically also by a plasma treatment or by plasma etching, respectively.
• a etching solution used for etching contains at least one oxidizer. Mild etching within the scope of the invention also means that an oxidizer is used m a low concentration Permanganate and/or peroxodisulfate and/or pe ⁇ odate and/or peroxide can be used as oxidizers.
• etching is by an acid etching solution which contains at least one oxidizer.
• a aqueous etching solution is used which contains permanganate and phosphoric acid (H 3 P0 4 ) and/or sulfu ⁇ c acid. In practical terms, potassium permanganate is used as the permanganate.
• etching treatment is by a basic aqueous solution, containing permanganate.
• permanganate containing permanganate.
• potassium permanganate is used by preference.
• the basic aqueous solution con- tarns lye.
• the invention envisions that the type of etching solution used depends on the type of plastic to be treated. - The preferred concentration of the oxidizer in the etching solution is .05 to .6 mol/1. In practical terms, the etching solution contains .05 to .6 mol/1 permanganate or persulfate.
• the etching solution contains .1 to .5 mol/1 pe ⁇ odate or hydrogen peroxide.
• permanganate is very much pre- ferred for the etching solution.
• the preferred permanganate proportion is 1 g/1 up to the solubility limit of the permanganate, preferably potassium permanganate.
• a permanganate solution contains 2 to 15 g/1 permanganate, preferably 2 to 15 g/1 potassium permanganate.
• the invention envisions that the permanganate solution contain a wetting agent.
• mild etching can also be achieved by the use of a dilute aqueous persulfate solution or pe ⁇ odite solution or a dilute aqueous peroxide solution.
• the mild etching treatment with a etching solution is earned out while agitating the solution.
• the plastic surface is rmsed, for example 1 to 3 minutes m water.
• the treatment with the metal salt solution according to 1.2) is carried out at a tempera- ture of maximally 30°C, preferably at a temperature between 15 and 25°C
• a tempera- ture of maximally 30°C preferably at a temperature between 15 and 25°C
• the treatment with the metal salt solution is performed without agitation
• the preferred treatment time is 30 seconds to 15 minutes, preferably 3 to 12 minutes.
• a metal salt solution is used which has a pH value of between 7.5 and 12.5, preferably adjusted to between 8 and 12.
• a metal salt solution which contains ammonia and/or at least one amme
• an alkaline metal salt solution is used.
• a metal salt solution which contains one or more amines.
• the metal salt solution may contain monoethanolamine and/or tnethanolamine. Treatment with the metal salt solution, withm the scope of the invention, means especially the immersion of the plastic surface into the metal salt solution.
• a cobalt salt solution is used as the metal salt solution.
• the cobalt salt solution contains 1 to 15 g/1 Co(II) salt, preferably 5 to 12 g/1 Co(II) salt.
• the cobalt (II) solution contains cobalt (II) sulfate and/or cobalt (II) chloride.
• the cobalt (II) solution contains ⁇ to 15 g/1 CoS0 4 • 7H 2 0; very much preferred is 1 to 10 g/1 CoS0 4 • 7H 2 0.
• a metal salt solution used is especially a cobalt salt solution, containing at least one oxidizer.
• the oxidizer may be hydrogen peroxide, for example.
• the oxidizer may also be made available by blowing air into the metal salt solution.
• the metal salt solution is a cobalt (II) salt solution
• the oxidizer is preferred to be used with the proviso that at least part of the cobalt (II) is oxidized into cobalt (III).
• the plastic surface is as ⁇ nsed as required.
• the plastic surface is immersed into a aqueous alkaline solution between the process steps 1.2) and 1J).
• the treatment or immersion time is preferably 10 seconds to 3 minutes, .5 to 2 mm- utes is very much preferred.
• a bath temperature of maximally 30°C is used, 15 to 25°C is preferred.
• the aqueous alkaline solution has a pH value of 9 to 14.
• the immersion in the aqueous alkaline solution is preferably in a dilute sodium lye.
• the scope of the invention includes the use of sodium hydroxide and/or potassium hydroxide and/or sodium carbonate for making the aqueous alkaline solution. It is very much preferred that the aqueous alkaline solution contain 5 to 50 g/1 sodium hydroxide or potassium hydroxide.
• the concentration of sodium hydroxide or potassium hydroxide to be the higher, the higher the metal salt concentration of the metal salt solution.
• the plastic surface instead of a aqueous alkaline solution, may also be treated with a aqueous acid dip solution. - It is withm the scope of the invention to rmse with water or distilled wa- ter, respectively, subsequent to the immersion treatment.
• the plastic surface is treated with an alkaline solution of an alkali metal sulfide according to process step 1J).
• An ammonium sulfide may also be used.
• the sulfide for example, may be a monosul- fide, disulfide, tetrasulfide or a polysulfide.
• concentration of the alkali metal monosulfide preferably the sodium sulfide, is preferred to be .5 to 10 g/1; very much preferred is 2 to 8 g/1.
• the alkali solution of the alkali metal sulfide contains 5 to 25 g/1 of sodium hydroxide, for example 10 g/1 sodium hydroxide.
• the treatment with the sulfide solution preferably takes place over a time pe ⁇ od of 15 seconds to 5 minutes; very much preferred is 30 seconds to 2 minutes.
• the treatment with the sulfide solution in accordance with process step 1.3) is earned out preferably at a maximum temperature of 30°C; a temperature of between 15 and 25°C is preferred.
• ⁇ nsmg as required takes place, for example 1 to 3 minutes with cold water.
• the metal salt solution preferably a cobalt salt solution and/or the sulfide solution
• the metal salt solution may at least partially contain the metal m the form of a metal complex.
• the metal salt solution and/or the sulfide solution have a wetting agent added so that improved wetting of the plastic surface results.
• a sulfide solution can be used which contains at least one substance from the group "Alcohol, diol, polyol, ployalkanglycol, ployalkenglycol, gel/sol-buildmg substance, such as silicic acid gel or aluminum oxide gel". It is withm the scope of the invention to use mixtures of these substances in the sulfide solution.
• a metal salt solution preferably a cobalt salt solution
• a cobalt salt solution which contains at least one substance from the group "Alcohol, diol, polyol, ployalkan- glycol, ployalkenglycol, gel/sol-buildmg substance, such as silicic acid gel or aluminum oxide gel". It is withm the scope of the invention to use mixtures of these substances in the metal salt solution.
• drying of the plastic surface is carried out between process step 1J) and process step 1.4). It is withm the scope of the invention that the drying is effected by a heat treatment of the plastic surface (with increased temperature). Preferably, the metallizing of the plastic surface occurs only subsequent to the drying. In principle, when applying the process in accordance with the invention, the treatment with the metal salt solution and/or the treatment with the sulfide solu- tion may be repeated. It is withm the scope of the invention that in the case of multiple treatment with the sulfide solution, the plastic surface is dried subsequent to any treatment.
• the direct metallization of the plastic surface may proceed According to a very much preferred procedure which is especially significant withm the scope of the invention, the plastic surface is nickel plated in a nickel bath in ac- cordance with procedure step 1.4). To this extent an electrolytic direct metallization can be carried out. Electro-chemical nickel plating preferably takes place in a Watts electrolyte. In practice, the treatment time is 10 to 15 minutes in this connection, and the electrolyte temperature is preferred to be 30 to 40°C. It is withm the scope of the invention that for electrochemical nickel plating an initial current density of 3 A/dm 2 is used which later is increased to 3 A/dm 2 . In this manner a nickel layer can be deposited on the plastic surface by electrolytic metallizing.
• the invention is based on the knowledge that the plastic surface when etched as described m the invention is manipulated in such a manner that ultimately, surpnsmgly, a very tight adherence of the applied metal layer to the plastic surface is achieved. These tightly adhering metal layers show a high temperature cycling resistance and, accordingly, survive all the customary temperature cycling shocks. Further, the invention is based on the knowledge that using the process desc ⁇ bed in the invention conditions can be created withm a relatively short time which are optimally suited for the subsequent application of the metal or the nickel layer, respectively. Although it is basic to the scope of the invention that the process steps are repeated and especially to repeat steps 1.2) and 1.3), surpnsmgly, optimal results are also achievable without the repetition of these process steps.
• an acid or an alkaline etching solution is employed.
• an acid etching solution is used for mild etching, consisting of 100 to 300 ml/1 water, 700 to 900 ml/1 concentrated phosphoric acid and 3 to 7 g/1 potassium permanganate.
• the acid etching solution consists of 74% by weight of phosphoric acid, 26% by weight of water and 5 g potassium permanganate
• an alkaline etching solution is used for mild etching which, practice contains 20 to 40 g/1 sodium hydroxide and 5 to 15 g/1 potassium permanganate.
• the aqueous alkaline etching solution consists of 30 g/1 sodium hydroxide and 10 g/1 potassium permanganate.
• an ammomacal metal salt solution which contains .1 to 12 g/1 cobalt (II) sulfate, as well as 10 to 50 ml/1 25% ammonia solution.
• Activation with the cobalt salt solution preferably occurs at room temperature i.e. during a treatment time of 5 to 10 minutes.
• the plastic surface is rmsed with water as re- quired.
• aqueous alkaline solution into which the part preferably is immersed subsequent to the treatment with the metal salt solution 10 to 50 g/1 sodium hydroxide is dissolved in water.
• a aqueous alkaline solution with 20 g/1 sodium hydroxide is employed.
• Immersion in the aqueous alkaline solution takes place at room temperature and over a treatment time period of .5 to 2 minutes.
• a sulfide solution is used as the alkaline sulfide solution which contains .5 to 10 g/1 sodium sulfide (Na 2 S), as well as 5 to 26 g/1 sodium hydroxide.
• an alkaline alkali sulfide solution which contains 5 g/1 sodium sulfide (Na 2 S), as well as 10 g/1 sodium hydroxide.
• the sulfide treatment is carried out at room temperature and over a treatment penod of .5 to 5 minutes.
• the plastic surface is rmsed with water as required. It is withm the scope of the invention that prior to the metallization, especially nickel plating, the plastic surface is dried.
• the application examples 1 and 2 correspond to the state of the art (compa ⁇ son examples), while examples 3 to 6 clarify the process which is the subject of the invention.
• the app - cation examples 1 and 5 ABS plastic discs with a surface of 50 cm 2 were used, while die- pressed products of impact-resistant polystyrol with a surface of 70 cm 2 were used for examples 2, 4 and 6.
• the notation "M" corresponds to the concentration "mol/1".
• the plastic articles were again washed m cold wa- ter. Following this was electro-chemical nickel plating. For this, the articles were treated for 15 minutes in a Watts electrolyte, containing 1J M NiS0 4 • 7 H 2 0, .2 M NiCl 2 • 6 H 2 0 and .5 M H 3 BO 3 . The initial current was 3 A/dm 2 , and the nickel plating was carried out at 40°C.
• the articles then were treated for 30 seconds with a metal salt solution, containing .5 M CuS0 4 • 5 H 2 0 Monoethanolamin having the pH value adjusted to 9.8, and the temperature of the solution was 20°C. Subsequently, the articles were immersed in distilled water for 20 seconds and following this treated with a sulfide solution for 30 seconds which contained M NaS and had a temperature of 20°C. Subsequently, the treatment with the metal salt solution and the following treatment with the sulfide solution as described above was repeated. After this treatment the articles were rinsed in distilled water and electro-chemically nickel plated in a Watts electrolyte as described in Application Example 1.
• Application Example 4 The surface of the articles of impact-resistant polystyrol was pickled for a period of 10 minutes and at room temperature with a solution containing 17 M H 2 S0 4 and 1 M H 2 0 2 . After etching, the articles were rinsed with water and subsequently treated for 10 minutes with a solution containing .01 M CoF 3 and monoethanolamine up to a pH value of 8 and at a temperature of 20°C. The articles then were immersed for 20 seconds in a aqueous alkaline solution which contained sufficient sodium hydroxide that it had a pH value of 14. Subsequently, they were treated for 30 seconds with a sulfide solution containing .05 M K 2 S 4 . The treated articles then were rmsed with distilled water, dried and then nickel plated for 15 minutes in a Watts electrolyte m accordance with Application Example 1.

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• Chemical & Material Sciences (AREA)
• Metallurgy (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Organic Chemistry (AREA)
• Mechanical Engineering (AREA)
• General Chemical & Material Sciences (AREA)
• Inorganic Chemistry (AREA)
• Electrochemistry (AREA)
• Chemically Coating (AREA)
• Treatments Of Macromolecular Shaped Articles (AREA)
• Electroplating Methods And Accessories (AREA)

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• 1999
  • 1999-11-05 WO PCT/US1999/026066 patent/WO2000029646A1/en not_active Ceased
  • 1999-11-05 JP JP2000582621A patent/JP2002530529A/ja active Pending
  • 1999-11-05 CN CNB998154938A patent/CN1184361C/zh not_active Expired - Fee Related
  • 1999-11-05 CA CA002350422A patent/CA2350422A1/en not_active Abandoned
  • 1999-11-05 MX MXPA01004811A patent/MXPA01004811A/es not_active Application Discontinuation
  • 1999-11-05 AU AU12433/00A patent/AU1243300A/en not_active Abandoned
  • 1999-11-05 BR BR9915280-0A patent/BR9915280A/pt not_active IP Right Cessation
  • 1999-11-11 TW TW088119793A patent/TWI221163B/zh not_active IP Right Cessation

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