IT7924023A0 - Procedimento per la fabbricazione di un pannello circuitale flessibile. - Google Patents

Procedimento per la fabbricazione di un pannello circuitale flessibile.

Info

Publication number
IT7924023A0
IT7924023A0 IT7924023A IT2402379A IT7924023A0 IT 7924023 A0 IT7924023 A0 IT 7924023A0 IT 7924023 A IT7924023 A IT 7924023A IT 2402379 A IT2402379 A IT 2402379A IT 7924023 A0 IT7924023 A0 IT 7924023A0
Authority
IT
Italy
Prior art keywords
procedure
manufacture
flexible circuit
circuit panel
panel
Prior art date
Application number
IT7924023A
Other languages
English (en)
Other versions
IT1121983B (it
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of IT7924023A0 publication Critical patent/IT7924023A0/it
Application granted granted Critical
Publication of IT1121983B publication Critical patent/IT1121983B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
IT24023/79A 1978-06-29 1979-06-29 Procedimento per la fabbricazione di un pannello circuitale flessibile IT1121983B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7895378A JPS556832A (en) 1978-06-29 1978-06-29 Method of manufacturing flexible circuit substrate

Publications (2)

Publication Number Publication Date
IT7924023A0 true IT7924023A0 (it) 1979-06-29
IT1121983B IT1121983B (it) 1986-04-23

Family

ID=13676244

Family Applications (1)

Application Number Title Priority Date Filing Date
IT24023/79A IT1121983B (it) 1978-06-29 1979-06-29 Procedimento per la fabbricazione di un pannello circuitale flessibile

Country Status (6)

Country Link
JP (1) JPS556832A (it)
BE (1) BE877349A (it)
DE (1) DE2926335A1 (it)
FR (1) FR2430168A1 (it)
GB (1) GB2030007A (it)
IT (1) IT1121983B (it)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5877291A (ja) * 1981-11-02 1983-05-10 松下電器産業株式会社 印刷配線板の製造方法
FR2525851A1 (fr) * 1982-04-23 1983-10-28 Italtel Italiana Telecomunica Procede pour rendre conducteurs des trous traversants dans des supports pour circuits electriques
DE3245458A1 (de) * 1982-12-08 1984-06-14 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von durchkontaktierungen in dickschichttechnik
BE896966A (nl) * 1983-06-06 1983-12-06 Bell Telephone Mfg Zeefdrukproces en -toestel en daarmee verdregen elektische gedrukte ketens
GB2142478A (en) * 1983-07-01 1985-01-16 Welwyn Electronics Ltd Printed circuit boards
JPS6017991A (ja) * 1983-07-12 1985-01-29 株式会社東芝 スル−ホ−ル基板の製造方法
IT1165498B (it) * 1983-12-20 1987-04-22 Italtel Spa Metodo per rivestire con un inchiostro le pareti di fori passanti in supporti per circuiti elettrici e macchina per implementare tlae metodo
DE3429236A1 (de) * 1984-08-08 1986-02-13 Krone Gmbh, 1000 Berlin Folie mit beidseitig aufgedruckten elektrischen leiterbahnen
SE453708B (sv) * 1985-03-05 1988-02-22 Svecia Silkscreen Maskiner Ab Stenciltryckmaskin for att bilda ett materialskikt pa ett inre veggparti for ett genomgaende hal i en platta
DE3509627A1 (de) * 1985-03-16 1986-09-18 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zum durchkontaktieren von loechern in dickschichtschaltungsplatten
FR2580135B1 (it) * 1985-04-05 1988-08-12 Trt Telecom Radio Electr
US4619741A (en) * 1985-04-11 1986-10-28 Olin Hunt Specialty Products Inc. Process for preparing a non-conductive substrate for electroplating
DE3545258A1 (de) * 1985-12-20 1987-06-25 Licentia Gmbh Verfahren zur herstellung von schaltungen in duennschichttechnik
JPS62183197A (ja) * 1986-02-06 1987-08-11 凸版印刷株式会社 フレキシブルスル−ホ−ル回路基板及びその製造方法
IT1203535B (it) * 1986-02-10 1989-02-15 Marelli Autronica Procedimento per la realizzazione del collegamento meccanico ed elettrico fra due corpi in particolare tra la membrana ed il sopporto di un sensore di pressione a film spesso e dispositivi realizzati con tale procedimento
JPS62209894A (ja) * 1986-03-10 1987-09-16 凸版印刷株式会社 フレキシブルスル−ホ−ル回路基板の製造方法
US4747211A (en) * 1987-02-09 1988-05-31 Sheldahl, Inc. Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films
DE3806884C1 (en) * 1988-03-03 1989-09-21 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De Through-plated contact printed circuit and method for fabricating it
JPH0834340B2 (ja) * 1988-12-09 1996-03-29 日立化成工業株式会社 配線板およびその製造法
DE3909185A1 (de) * 1989-03-21 1990-09-27 Endress Hauser Gmbh Co Kapazitiver drucksensor und verfahren zu seiner herstellung
JP2797475B2 (ja) * 1989-07-11 1998-09-17 松下電器産業株式会社 スルーホール印刷対応スクリーン印刷機
JPH0635499Y2 (ja) * 1989-08-09 1994-09-14 ファイン電子株式会社 両面プリント基板
FR2654296B1 (fr) * 1989-11-03 1992-01-10 Horlogerie Photograph Fse Circuit imprime a deux faces, et procede pour sa fabrication.
DE19724366A1 (de) * 1997-06-10 1998-12-17 Thomson Brandt Gmbh Verfahren zur Durchkontaktierung von Leiterplatten
EP1870491B1 (de) 2006-06-22 2015-05-27 Enthone, Inc. Verbessertes Verfahren zur Direktmetallisierung von elektrisch nicht leitfähigen Substratoberflächen, insbesondere Polyimidoberflächen
US7645943B2 (en) 2007-07-11 2010-01-12 Delphi Technologies, Inc. Configurable printed circuit board
CN113380630A (zh) * 2020-03-09 2021-09-10 重庆川仪微电路有限责任公司 厚膜电路孔金属化方法及厚膜电路印刷方法
CN113643985A (zh) * 2021-08-06 2021-11-12 西安微电子技术研究所 一种实现厚膜基板正反面图案的互连方法
IT202200009725A1 (it) * 2022-05-11 2023-11-11 Tastitalia S R L Circuito stampato flessibile ottenuto con un processo semi-additivo

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4939932A (it) * 1972-08-26 1974-04-15

Also Published As

Publication number Publication date
BE877349A (fr) 1979-12-28
FR2430168A1 (fr) 1980-01-25
GB2030007A (en) 1980-03-26
JPS556832A (en) 1980-01-18
IT1121983B (it) 1986-04-23
DE2926335A1 (de) 1980-01-10

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