IT7924853A0 - Composizione di un adesivo conduttore. - Google Patents

Composizione di un adesivo conduttore.

Info

Publication number
IT7924853A0
IT7924853A0 IT7924853A IT2485379A IT7924853A0 IT 7924853 A0 IT7924853 A0 IT 7924853A0 IT 7924853 A IT7924853 A IT 7924853A IT 2485379 A IT2485379 A IT 2485379A IT 7924853 A0 IT7924853 A0 IT 7924853A0
Authority
IT
Italy
Prior art keywords
composition
conducting adhesive
conducting
adhesive
Prior art date
Application number
IT7924853A
Other languages
English (en)
Other versions
IT1122393B (it
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of IT7924853A0 publication Critical patent/IT7924853A0/it
Application granted granted Critical
Publication of IT1122393B publication Critical patent/IT1122393B/it

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/04—Epoxynovolacs
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    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
IT2485379A 1978-08-04 1979-08-01 Composizione di un adesivo conduttore IT1122393B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/931,160 US4210704A (en) 1978-08-04 1978-08-04 Electrical devices employing a conductive epoxy resin formulation as a bonding medium

Publications (2)

Publication Number Publication Date
IT7924853A0 true IT7924853A0 (it) 1979-08-01
IT1122393B IT1122393B (it) 1986-04-23

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IT2485379A IT1122393B (it) 1978-08-04 1979-08-01 Composizione di un adesivo conduttore

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US (1) US4210704A (it)
JP (1) JPS5525482A (it)
BE (1) BE878071A (it)
CA (1) CA1142340A (it)
DE (1) DE2931633A1 (it)
FR (1) FR2432753A1 (it)
GB (1) GB2027715A (it)
IT (1) IT1122393B (it)
NL (1) NL7905933A (it)

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JPS57111034A (en) * 1980-12-10 1982-07-10 Hitachi Ltd Semiconductor device and its manufacture
DE3049551A1 (de) * 1980-12-31 1982-07-29 Basf Ag, 6700 Ludwigshafen Elektrisch leitfaehige poly(pyrrol)-derivate
JPS57185316A (en) * 1981-05-11 1982-11-15 Sumitomo Metal Mining Co Ltd Electrically conductive resin paste
US4519941A (en) * 1983-08-09 1985-05-28 National Starch And Chemical Corporation Metal-filled polyimide/polyepoxide blends of improved electrical conductivity
EP0147607B1 (de) * 1983-12-22 1988-05-04 BBC Brown Boveri AG Zinkoxid-Varistor
US4670339A (en) * 1984-06-04 1987-06-02 Advanced Technology Laboratories, Inc. Electrically conductive thin epoxy bond
US4552607A (en) * 1984-06-04 1985-11-12 Advanced Technology Laboratories, Inc. Method of making electrically conductive thin epoxy bond
US4749729A (en) * 1984-06-21 1988-06-07 American Cyanamid Company Epoxy resin compositions curable above 160 F. and below 250 F.
US4604230A (en) * 1984-10-15 1986-08-05 Stauffer Chemical Company Thermally stable adhesive
US4747968A (en) * 1985-05-08 1988-05-31 Sheldahl, Inc. Low temperature cure having single component conductive adhesive
US4780371A (en) * 1986-02-24 1988-10-25 International Business Machines Corporation Electrically conductive composition and use thereof
US4695404A (en) * 1986-04-07 1987-09-22 Amerasia International Technology, Inc. Hyperconductive filled polymers
US4948449A (en) * 1986-05-07 1990-08-14 Minnesota Mining And Manufacturing Company Epoxy resin composition
US4903118A (en) * 1988-03-30 1990-02-20 Director General, Agency Of Industrial Science And Technology Semiconductor device including a resilient bonding resin
US5183593A (en) * 1989-11-14 1993-02-02 Poly-Flex Circuits, Inc. Electrically conductive cement
US5180523A (en) * 1989-11-14 1993-01-19 Poly-Flex Circuits, Inc. Electrically conductive cement containing agglomerate, flake and powder metal fillers
JPH07123179B2 (ja) * 1990-10-05 1995-12-25 信越ポリマー株式会社 異方導電接着剤による回路基板の接続構造
US5608028A (en) * 1994-02-02 1997-03-04 Delco Electronics Corp. Polybutadiene urethane potting material
US5822856A (en) * 1996-06-28 1998-10-20 International Business Machines Corporation Manufacturing circuit board assemblies having filled vias
US6241915B1 (en) 1998-02-27 2001-06-05 Micron Technology, Inc. Epoxy, epoxy system, and method of forming a conductive adhesive connection
US6297564B1 (en) 1998-04-24 2001-10-02 Amerasia International Technology, Inc. Electronic devices employing adhesive interconnections including plated particles
US6548576B1 (en) 2001-11-07 2003-04-15 Bourns, Inc. Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components
NL1024722C2 (nl) * 2002-11-07 2005-12-23 Corning Inc Laag uitgassend rubberachtig polymeermateriaal dat hardbaar is door een licht- of elektronenbundel, alsmede de bereiding en het gebruik daarvan.
JP2005234464A (ja) * 2004-02-23 2005-09-02 Tdk Corp 光トランシーバ及びこれに用いる光モジュール
US9737735B2 (en) 2009-08-14 2017-08-22 Ethicon Llc Ultrasonic surgical apparatus with silicon waveguide
MY162917A (en) * 2011-03-07 2017-07-31 Akzo Nobel Coatings Int Bv Cargo tank coating
ITTO20130926A1 (it) * 2013-11-15 2015-05-16 Alenia Aermacchi Spa Resina epossidica con basso tenore di umidita'

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US3580776A (en) * 1967-06-09 1971-05-25 Leonid Zalmanovich Shenfil Method of producing electric contact between two cemented parts
US3631150A (en) * 1970-05-20 1971-12-28 Dexter Corp Synergistic composition for curing polyepoxides comprising an imidazole compound and dicyandiamide
US3677974A (en) * 1970-09-18 1972-07-18 Us Army Multi-purpose conductive adhesive
IT954638B (it) * 1971-05-03 1973-09-15 Goodrich Co B F Composizione adesiva a base di resina epossidica
US4048188A (en) * 1971-12-07 1977-09-13 The Boots Company Limited 1-Carbonamido imidazoles
US3795047A (en) * 1972-06-15 1974-03-05 Ibm Electrical interconnect structuring for laminate assemblies and fabricating methods therefor
US3862260A (en) * 1973-05-07 1975-01-21 Union Carbide Corp Epoxy curing system
US4038742A (en) * 1976-09-15 1977-08-02 The United States Of America As Represented By The Secretary Of The Army Method of making styrofoam slotted plane-array antenna

Also Published As

Publication number Publication date
FR2432753A1 (fr) 1980-02-29
DE2931633A1 (de) 1980-02-28
US4210704A (en) 1980-07-01
BE878071A (fr) 1979-12-03
NL7905933A (nl) 1980-02-06
GB2027715A (en) 1980-02-27
CA1142340A (en) 1983-03-08
IT1122393B (it) 1986-04-23
JPS5525482A (en) 1980-02-23

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