BE896966A - Zeefdrukproces en -toestel en daarmee verdregen elektische gedrukte ketens - Google Patents

Zeefdrukproces en -toestel en daarmee verdregen elektische gedrukte ketens

Info

Publication number
BE896966A
BE896966A BE2/60122A BE2060122A BE896966A BE 896966 A BE896966 A BE 896966A BE 2/60122 A BE2/60122 A BE 2/60122A BE 2060122 A BE2060122 A BE 2060122A BE 896966 A BE896966 A BE 896966A
Authority
BE
Belgium
Prior art keywords
chains
screen printing
printing process
electric printed
eliminated electric
Prior art date
Application number
BE2/60122A
Other languages
English (en)
Inventor
C Cleemput
Original Assignee
Bell Telephone Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bell Telephone Mfg filed Critical Bell Telephone Mfg
Priority to BE2/60122A priority Critical patent/BE896966A/nl
Publication of BE896966A publication Critical patent/BE896966A/nl
Priority to GB08414091A priority patent/GB2143473B/en
Priority to AU29089/84A priority patent/AU568855B2/en
Priority to FR8408789A priority patent/FR2547155B1/fr
Priority to US06/617,853 priority patent/US4959246A/en
Priority to DE19843420966 priority patent/DE3420966A1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
BE2/60122A 1983-06-06 1983-06-06 Zeefdrukproces en -toestel en daarmee verdregen elektische gedrukte ketens BE896966A (nl)

Priority Applications (6)

Application Number Priority Date Filing Date Title
BE2/60122A BE896966A (nl) 1983-06-06 1983-06-06 Zeefdrukproces en -toestel en daarmee verdregen elektische gedrukte ketens
GB08414091A GB2143473B (en) 1983-06-06 1984-06-01 Screen printing process and apparatus and electrical printed circuits obtained therewith
AU29089/84A AU568855B2 (en) 1983-06-06 1984-06-05 A screen printing process
FR8408789A FR2547155B1 (fr) 1983-06-06 1984-06-05 Procede et dispositif d'impression serigraphique; circuit electrique ainsi obtenu
US06/617,853 US4959246A (en) 1983-06-06 1984-06-06 Screen printing process and apparatus and electrical printed circuits obtained therewith
DE19843420966 DE3420966A1 (de) 1983-06-06 1984-06-06 Siebdruckverfahren und einrichtung zur ausuebung desselben

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE2/60122A BE896966A (nl) 1983-06-06 1983-06-06 Zeefdrukproces en -toestel en daarmee verdregen elektische gedrukte ketens

Publications (1)

Publication Number Publication Date
BE896966A true BE896966A (nl) 1983-12-06

Family

ID=3865637

Family Applications (1)

Application Number Title Priority Date Filing Date
BE2/60122A BE896966A (nl) 1983-06-06 1983-06-06 Zeefdrukproces en -toestel en daarmee verdregen elektische gedrukte ketens

Country Status (6)

Country Link
US (1) US4959246A (nl)
AU (1) AU568855B2 (nl)
BE (1) BE896966A (nl)
DE (1) DE3420966A1 (nl)
FR (1) FR2547155B1 (nl)
GB (1) GB2143473B (nl)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5050498A (en) * 1984-11-02 1991-09-24 Smith Michael S Stencil manufacturing and printing process and apparatus
US4649817A (en) * 1984-11-02 1987-03-17 Smith Michael S Stencil manufacturing and printing process
SE453708B (sv) * 1985-03-05 1988-02-22 Svecia Silkscreen Maskiner Ab Stenciltryckmaskin for att bilda ett materialskikt pa ett inre veggparti for ett genomgaende hal i en platta
DE3509627A1 (de) * 1985-03-16 1986-09-18 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zum durchkontaktieren von loechern in dickschichtschaltungsplatten
DE3509626A1 (de) * 1985-03-16 1986-09-18 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zum erzeugen eines dosierten kurzzeitigen gas-unterdruckimpulses
FR2580135B1 (nl) * 1985-04-05 1988-08-12 Trt Telecom Radio Electr
DE3514093A1 (de) * 1985-04-16 1986-10-23 Kaspar 5241 Gebhardshain Eidenberg Verfahren zum verschliessen von in einer leiterplatte vorgesehenen bohrungen
US4710395A (en) * 1986-05-14 1987-12-01 Delco Electronics Corporation Method and apparatus for through hole substrate printing
US4779565A (en) * 1986-05-14 1988-10-25 Delco Electronics Corporation Apparatus for through hole substrate printing
US4747211A (en) * 1987-02-09 1988-05-31 Sheldahl, Inc. Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films
GB8802393D0 (en) * 1988-02-03 1988-03-02 Gen Electric Co Plc Apparatus for selectively coating part of member
EP0327298A3 (en) * 1988-02-03 1990-06-27 THE GENERAL ELECTRIC COMPANY, p.l.c. Apparatus for selectively coating part of a member
US4968534A (en) * 1989-01-17 1990-11-06 Npd Corp. Method and apparatus for pattern impregnation of a porous web
US5094886A (en) * 1989-01-17 1992-03-10 Npd Corporation Method and apparatus for pattern impregnation of paper and other non-woven web
JP2852342B2 (ja) * 1989-08-22 1999-02-03 松下電器産業株式会社 スクリーン印刷方法
US5110628A (en) * 1990-03-15 1992-05-05 Vlsi Technology, Inc. Method and apparatus for marking or erasing a marking on a semiconductor chip package
JPH0494592A (ja) * 1990-08-10 1992-03-26 Cmk Corp プリント配線板におけるスルーホールに対する充填材の充填方法
DE4318604A1 (de) * 1993-06-04 1994-12-08 Blaupunkt Werke Gmbh Verfahren zur Durchkontaktierung von Leiterplatten
US5527998A (en) * 1993-10-22 1996-06-18 Sheldahl, Inc. Flexible multilayer printed circuit boards and methods of manufacture
US6231333B1 (en) * 1995-08-24 2001-05-15 International Business Machines Corporation Apparatus and method for vacuum injection molding
DE19724366A1 (de) * 1997-06-10 1998-12-17 Thomson Brandt Gmbh Verfahren zur Durchkontaktierung von Leiterplatten
US6461136B1 (en) * 1999-08-26 2002-10-08 International Business Machines Corp. Apparatus for filling high aspect ratio via holes in electronic substrates
DE102005011545A1 (de) 2005-03-10 2006-09-21 Lpkf Laser & Electronics Ag Verfahren zur Kontaktierung von Leiterbahnen einer Leiterplatte
DE102005023102A1 (de) * 2005-05-13 2006-11-16 Unaxis Balzers Ag Verfahren zum strukturierten Verkleben von Oberflächen
EP2351472B1 (en) * 2008-10-30 2012-09-12 BAE Systems PLC Improvements relating to additive manufacturing processes
JP6027794B2 (ja) * 2012-07-04 2016-11-16 ヤマハ発動機株式会社 搬送治具
CN102821547B (zh) * 2012-07-31 2014-03-19 苏州元坤电子有限公司 一种双面线路板加工过程的固定方法
CN103042817B (zh) * 2012-11-29 2015-05-27 强记实业公司 无胶连续式印花机
CN113471111A (zh) * 2021-07-10 2021-10-01 江苏晟驰微电子有限公司 一种孔板钢网印刷实现晶圆玻璃钝化工艺的治具

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3357856A (en) * 1964-02-13 1967-12-12 Electra Mfg Company Method for metallizing openings in miniature printed circuit wafers
FR1552591A (nl) * 1968-01-31 1969-01-03
US4278706A (en) * 1977-12-15 1981-07-14 Trx, Inc. Method for making discrete electrical components
JPS556832A (en) * 1978-06-29 1980-01-18 Nippon Mektron Kk Method of manufacturing flexible circuit substrate
JPS55138294A (en) * 1979-04-11 1980-10-28 Matsushita Electric Ind Co Ltd Method of forming through hole connector
US4301192A (en) * 1980-06-02 1981-11-17 Western Electric Co., Inc. Method for coating thru holes in a printed circuit substrate
US4486738A (en) * 1982-02-16 1984-12-04 General Electric Ceramics, Inc. High reliability electrical components

Also Published As

Publication number Publication date
GB8414091D0 (en) 1984-07-04
FR2547155B1 (fr) 1987-12-18
GB2143473A (en) 1985-02-13
AU2908984A (en) 1984-12-13
GB2143473B (en) 1987-01-21
AU568855B2 (en) 1988-01-14
DE3420966A1 (de) 1984-12-06
FR2547155A1 (fr) 1984-12-07
US4959246A (en) 1990-09-25

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Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: BELL TELEPHONE MFG CY N.V.

Effective date: 19960630