FR2430168A1 - Procede de fabrication d'une plaquette a circuit du type flexible - Google Patents
Procede de fabrication d'une plaquette a circuit du type flexibleInfo
- Publication number
- FR2430168A1 FR2430168A1 FR7916747A FR7916747A FR2430168A1 FR 2430168 A1 FR2430168 A1 FR 2430168A1 FR 7916747 A FR7916747 A FR 7916747A FR 7916747 A FR7916747 A FR 7916747A FR 2430168 A1 FR2430168 A1 FR 2430168A1
- Authority
- FR
- France
- Prior art keywords
- manufacturing
- circuit board
- holes
- flexible type
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 230000005684 electric field Effects 0.000 abstract 1
- 238000007639 printing Methods 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
La présente invention a pour objet un procédé de fabrica tion d'une plaquette à circuit du type flexible. Elle est caractérisée en ce qu'on forme sur les deux faces de la plaquette des motifs conducteurs réalisés, par exemple, par une technique d'impression au tamis, ces motifs étant reliés par des trous de passage, une légère pression étant exercée sur le côté de la plaquette qui n'est pas en train d'être imprimée, au voisinage des trous de traversée, en vue de faire pénétrer la matière d'impression qui forme le motif conducteur dans les trous pour revêtir leurs parois d'une couche conductrice. Elle se rapporte au domaine électrique.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7895378A JPS556832A (en) | 1978-06-29 | 1978-06-29 | Method of manufacturing flexible circuit substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2430168A1 true FR2430168A1 (fr) | 1980-01-25 |
Family
ID=13676244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7916747A Withdrawn FR2430168A1 (fr) | 1978-06-29 | 1979-06-28 | Procede de fabrication d'une plaquette a circuit du type flexible |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS556832A (fr) |
BE (1) | BE877349A (fr) |
DE (1) | DE2926335A1 (fr) |
FR (1) | FR2430168A1 (fr) |
GB (1) | GB2030007A (fr) |
IT (1) | IT1121983B (fr) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5877291A (ja) * | 1981-11-02 | 1983-05-10 | 松下電器産業株式会社 | 印刷配線板の製造方法 |
FR2525851A1 (fr) * | 1982-04-23 | 1983-10-28 | Italtel Italiana Telecomunica | Procede pour rendre conducteurs des trous traversants dans des supports pour circuits electriques |
DE3245458A1 (de) * | 1982-12-08 | 1984-06-14 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung von durchkontaktierungen in dickschichttechnik |
BE896966A (nl) * | 1983-06-06 | 1983-12-06 | Bell Telephone Mfg | Zeefdrukproces en -toestel en daarmee verdregen elektische gedrukte ketens |
GB2142478A (en) * | 1983-07-01 | 1985-01-16 | Welwyn Electronics Ltd | Printed circuit boards |
JPS6017991A (ja) * | 1983-07-12 | 1985-01-29 | 株式会社東芝 | スル−ホ−ル基板の製造方法 |
IT1165498B (it) * | 1983-12-20 | 1987-04-22 | Italtel Spa | Metodo per rivestire con un inchiostro le pareti di fori passanti in supporti per circuiti elettrici e macchina per implementare tlae metodo |
DE3429236A1 (de) * | 1984-08-08 | 1986-02-13 | Krone Gmbh, 1000 Berlin | Folie mit beidseitig aufgedruckten elektrischen leiterbahnen |
SE453708B (sv) * | 1985-03-05 | 1988-02-22 | Svecia Silkscreen Maskiner Ab | Stenciltryckmaskin for att bilda ett materialskikt pa ett inre veggparti for ett genomgaende hal i en platta |
DE3509627A1 (de) * | 1985-03-16 | 1986-09-18 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Vorrichtung zum durchkontaktieren von loechern in dickschichtschaltungsplatten |
FR2580135B1 (fr) * | 1985-04-05 | 1988-08-12 | Trt Telecom Radio Electr | |
US4619741A (en) * | 1985-04-11 | 1986-10-28 | Olin Hunt Specialty Products Inc. | Process for preparing a non-conductive substrate for electroplating |
DE3545258A1 (de) * | 1985-12-20 | 1987-06-25 | Licentia Gmbh | Verfahren zur herstellung von schaltungen in duennschichttechnik |
JPS62183197A (ja) * | 1986-02-06 | 1987-08-11 | 凸版印刷株式会社 | フレキシブルスル−ホ−ル回路基板及びその製造方法 |
IT1203535B (it) * | 1986-02-10 | 1989-02-15 | Marelli Autronica | Procedimento per la realizzazione del collegamento meccanico ed elettrico fra due corpi in particolare tra la membrana ed il sopporto di un sensore di pressione a film spesso e dispositivi realizzati con tale procedimento |
JPS62209894A (ja) * | 1986-03-10 | 1987-09-16 | 凸版印刷株式会社 | フレキシブルスル−ホ−ル回路基板の製造方法 |
US4747211A (en) * | 1987-02-09 | 1988-05-31 | Sheldahl, Inc. | Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films |
DE3806884C1 (en) * | 1988-03-03 | 1989-09-21 | Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De | Through-plated contact printed circuit and method for fabricating it |
JPH0834340B2 (ja) * | 1988-12-09 | 1996-03-29 | 日立化成工業株式会社 | 配線板およびその製造法 |
DE3909185A1 (de) * | 1989-03-21 | 1990-09-27 | Endress Hauser Gmbh Co | Kapazitiver drucksensor und verfahren zu seiner herstellung |
JP2797475B2 (ja) * | 1989-07-11 | 1998-09-17 | 松下電器産業株式会社 | スルーホール印刷対応スクリーン印刷機 |
JPH0635499Y2 (ja) * | 1989-08-09 | 1994-09-14 | ファイン電子株式会社 | 両面プリント基板 |
FR2654296B1 (fr) * | 1989-11-03 | 1992-01-10 | Horlogerie Photograph Fse | Circuit imprime a deux faces, et procede pour sa fabrication. |
DE19724366A1 (de) * | 1997-06-10 | 1998-12-17 | Thomson Brandt Gmbh | Verfahren zur Durchkontaktierung von Leiterplatten |
EP1870491B1 (fr) | 2006-06-22 | 2015-05-27 | Enthone, Inc. | Procédé amelioree de métallisation directe des substrat non-conductive, particuliérement des surface polyimide |
US7645943B2 (en) | 2007-07-11 | 2010-01-12 | Delphi Technologies, Inc. | Configurable printed circuit board |
CN113380630A (zh) * | 2020-03-09 | 2021-09-10 | 重庆川仪微电路有限责任公司 | 厚膜电路孔金属化方法及厚膜电路印刷方法 |
CN113643985A (zh) * | 2021-08-06 | 2021-11-12 | 西安微电子技术研究所 | 一种实现厚膜基板正反面图案的互连方法 |
IT202200009725A1 (it) * | 2022-05-11 | 2023-11-11 | Tastitalia S R L | Circuito stampato flessibile ottenuto con un processo semi-additivo |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4939932A (fr) * | 1972-08-26 | 1974-04-15 |
-
1978
- 1978-06-29 JP JP7895378A patent/JPS556832A/ja active Pending
-
1979
- 1979-06-28 BE BE0/196027A patent/BE877349A/fr unknown
- 1979-06-28 FR FR7916747A patent/FR2430168A1/fr not_active Withdrawn
- 1979-06-29 DE DE19792926335 patent/DE2926335A1/de not_active Withdrawn
- 1979-06-29 IT IT24023/79A patent/IT1121983B/it active
- 1979-06-29 GB GB7922633A patent/GB2030007A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
IT1121983B (it) | 1986-04-23 |
GB2030007A (en) | 1980-03-26 |
JPS556832A (en) | 1980-01-18 |
IT7924023A0 (it) | 1979-06-29 |
BE877349A (fr) | 1979-12-28 |
DE2926335A1 (de) | 1980-01-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RE | Withdrawal of published application |