IT1165498B - Metodo per rivestire con un inchiostro le pareti di fori passanti in supporti per circuiti elettrici e macchina per implementare tlae metodo - Google Patents

Metodo per rivestire con un inchiostro le pareti di fori passanti in supporti per circuiti elettrici e macchina per implementare tlae metodo

Info

Publication number
IT1165498B
IT1165498B IT24266/83A IT2426683A IT1165498B IT 1165498 B IT1165498 B IT 1165498B IT 24266/83 A IT24266/83 A IT 24266/83A IT 2426683 A IT2426683 A IT 2426683A IT 1165498 B IT1165498 B IT 1165498B
Authority
IT
Italy
Prior art keywords
tlae
ink
implement
walls
supports
Prior art date
Application number
IT24266/83A
Other languages
English (en)
Other versions
IT8324266A0 (it
Inventor
Roberto Scorta
Original Assignee
Italtel Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Italtel Spa filed Critical Italtel Spa
Priority to IT24266/83A priority Critical patent/IT1165498B/it
Publication of IT8324266A0 publication Critical patent/IT8324266A0/it
Priority to DE8484201901T priority patent/DE3480822D1/de
Priority to EP84201901A priority patent/EP0147901B1/en
Priority to DE198484201901T priority patent/DE147901T1/de
Application granted granted Critical
Publication of IT1165498B publication Critical patent/IT1165498B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0134—Drum, e.g. rotary drum or dispenser with a plurality of openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0753—Reversing fluid direction, e.g. in holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
IT24266/83A 1983-12-20 1983-12-20 Metodo per rivestire con un inchiostro le pareti di fori passanti in supporti per circuiti elettrici e macchina per implementare tlae metodo IT1165498B (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IT24266/83A IT1165498B (it) 1983-12-20 1983-12-20 Metodo per rivestire con un inchiostro le pareti di fori passanti in supporti per circuiti elettrici e macchina per implementare tlae metodo
DE8484201901T DE3480822D1 (de) 1983-12-20 1984-12-18 Verfahren zur beschichtung von bohrungswaenden in elektrischen schaltungstraegern mit tinte und vorrichtung zur anwendung dieser methode.
EP84201901A EP0147901B1 (en) 1983-12-20 1984-12-18 Method for coating with ink the walls of through holes in supports for electric circuits, and machine for implementing said method
DE198484201901T DE147901T1 (de) 1983-12-20 1984-12-18 Verfahren zur beschichtung von bohrungswaenden in elektrischen schaltungstraegern mit tinte und vorrichtung zur anwendung dieser methode.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT24266/83A IT1165498B (it) 1983-12-20 1983-12-20 Metodo per rivestire con un inchiostro le pareti di fori passanti in supporti per circuiti elettrici e macchina per implementare tlae metodo

Publications (2)

Publication Number Publication Date
IT8324266A0 IT8324266A0 (it) 1983-12-20
IT1165498B true IT1165498B (it) 1987-04-22

Family

ID=11212827

Family Applications (1)

Application Number Title Priority Date Filing Date
IT24266/83A IT1165498B (it) 1983-12-20 1983-12-20 Metodo per rivestire con un inchiostro le pareti di fori passanti in supporti per circuiti elettrici e macchina per implementare tlae metodo

Country Status (3)

Country Link
EP (1) EP0147901B1 (it)
DE (2) DE147901T1 (it)
IT (1) IT1165498B (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8802393D0 (en) * 1988-02-03 1988-03-02 Gen Electric Co Plc Apparatus for selectively coating part of member
EP0327298A3 (en) * 1988-02-03 1990-06-27 THE GENERAL ELECTRIC COMPANY, p.l.c. Apparatus for selectively coating part of a member
DE4439108C1 (de) * 1994-11-02 1996-04-11 Lpkf Cad Cam Systeme Gmbh Verfahren zum Durchkontaktieren von Bohrungen in mehrlagigen Leiterplatten
DE19724366A1 (de) * 1997-06-10 1998-12-17 Thomson Brandt Gmbh Verfahren zur Durchkontaktierung von Leiterplatten
AU1440899A (en) * 1997-11-26 1999-06-15 Karl Michael Wallis Method and apparatus for manufacturing double sided or multi-layered printed circuit boards
DE102014106636B4 (de) * 2014-05-12 2021-04-08 Itc Intercircuit Production Gmbh Durchgangsloch-Füllanlage

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1237658B (de) * 1965-06-15 1967-03-30 Telefunken Patent Verfahren zur Vorbereitung der Metallisierung der Loecher in Isolierstoffplatten fuer gedruckte Leiterplatten
JPS556832A (en) * 1978-06-29 1980-01-18 Nippon Mektron Kk Method of manufacturing flexible circuit substrate
IT1137331B (it) * 1981-04-10 1986-09-10 Italtel Spa Metodo per rendere conduttivi fori passanti in supporti per circuiti elettrici

Also Published As

Publication number Publication date
EP0147901B1 (en) 1989-12-20
EP0147901A2 (en) 1985-07-10
IT8324266A0 (it) 1983-12-20
DE3480822D1 (de) 1990-01-25
DE147901T1 (de) 1985-09-26
EP0147901A3 (en) 1986-07-16

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19931216