IN2015DN03023A - - Google Patents

Info

Publication number
IN2015DN03023A
IN2015DN03023A IN3023DEN2015A IN2015DN03023A IN 2015DN03023 A IN2015DN03023 A IN 2015DN03023A IN 3023DEN2015 A IN3023DEN2015 A IN 3023DEN2015A IN 2015DN03023 A IN2015DN03023 A IN 2015DN03023A
Authority
IN
India
Prior art keywords
substrate
grind
major surface
grinding
abrasive
Prior art date
Application number
Other languages
English (en)
Inventor
Robert A ; Rizzuto
Ajay Krishnan
Christopher; Arcona
Anand; Tanikella
Original Assignee
Saint Gobain Ceramics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Ceramics filed Critical Saint Gobain Ceramics
Publication of IN2015DN03023A publication Critical patent/IN2015DN03023A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
IN3023DEN2015 2012-09-28 2013-09-18 IN2015DN03023A (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261707528P 2012-09-28 2012-09-28
PCT/US2013/060442 WO2014052130A1 (en) 2012-09-28 2013-09-18 Modified microgrinding process

Publications (1)

Publication Number Publication Date
IN2015DN03023A true IN2015DN03023A (enrdf_load_stackoverflow) 2015-10-02

Family

ID=50385635

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3023DEN2015 IN2015DN03023A (enrdf_load_stackoverflow) 2012-09-28 2013-09-18

Country Status (8)

Country Link
US (1) US20140094094A1 (enrdf_load_stackoverflow)
JP (1) JP6120974B2 (enrdf_load_stackoverflow)
KR (1) KR20150056633A (enrdf_load_stackoverflow)
CN (1) CN104813448A (enrdf_load_stackoverflow)
IN (1) IN2015DN03023A (enrdf_load_stackoverflow)
RU (1) RU2015114097A (enrdf_load_stackoverflow)
TW (1) TWI494981B (enrdf_load_stackoverflow)
WO (1) WO2014052130A1 (enrdf_load_stackoverflow)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI553723B (zh) * 2014-05-27 2016-10-11 Crystalwise Technology Sapphire wafer processing methods and their processing in the process of intermediates
CN104015122A (zh) * 2014-06-18 2014-09-03 蓝思科技股份有限公司 一种蓝宝石面板的双面铜盘研磨工艺
US20170069791A1 (en) * 2015-09-08 2017-03-09 Epistar Corporation Light-emitting device and method of manufacturing thereof
CN105290904B (zh) * 2015-10-12 2017-08-18 中国建筑材料科学研究总院 消除光学玻璃亚表面裂纹的方法
JP6323515B2 (ja) * 2016-08-31 2018-05-16 株式会社Sumco 半導体ウェーハのラッピング方法および半導体ウェーハ
JP7085323B2 (ja) * 2017-08-03 2022-06-16 東洋鋼鈑株式会社 研磨用または研削用のキャリアおよびそれを用いた磁気ディスク用アルミ基板の製造方法
JP2019141974A (ja) * 2018-02-22 2019-08-29 株式会社ミズホ 両面ラップ盤とそれを用いた薄肉ファインセラミックスの研削方法
CN109012918B (zh) * 2018-10-12 2024-01-12 河南先导机械力化学研究院有限公司 行星球磨机
CN111098224B (zh) * 2018-10-26 2022-08-26 东莞新科技术研究开发有限公司 半导体基板及其表面研磨方法
US11342256B2 (en) 2019-01-24 2022-05-24 Applied Materials, Inc. Method of fine redistribution interconnect formation for advanced packaging applications
CN110018028B (zh) * 2019-04-17 2023-01-13 宸鸿科技(厦门)有限公司 一种蓝宝石基材电子组件的金相切片样品制备方法
IT201900006740A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di strutturazione di substrati
IT201900006736A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di fabbricazione di package
US11931855B2 (en) 2019-06-17 2024-03-19 Applied Materials, Inc. Planarization methods for packaging substrates
JP7236970B2 (ja) * 2019-09-23 2023-03-10 日本特殊陶業株式会社 セラミックヒータ及びグロープラグ
US11862546B2 (en) 2019-11-27 2024-01-02 Applied Materials, Inc. Package core assembly and fabrication methods
CN110900342B (zh) * 2019-11-29 2020-12-08 上海磐盟电子材料有限公司 一种磨片机
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
US11400545B2 (en) 2020-05-11 2022-08-02 Applied Materials, Inc. Laser ablation for package fabrication
CN111761505B (zh) * 2020-07-10 2021-07-27 浙江中晶科技股份有限公司 一种硅片双面磨削设备及其生产工艺
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
US11521937B2 (en) 2020-11-16 2022-12-06 Applied Materials, Inc. Package structures with built-in EMI shielding
US11404318B2 (en) 2020-11-20 2022-08-02 Applied Materials, Inc. Methods of forming through-silicon vias in substrates for advanced packaging
JP7240013B2 (ja) * 2021-03-19 2023-03-15 大昌精機株式会社 立型研削盤
US11705365B2 (en) 2021-05-18 2023-07-18 Applied Materials, Inc. Methods of micro-via formation for advanced packaging
US12183684B2 (en) 2021-10-26 2024-12-31 Applied Materials, Inc. Semiconductor device packaging methods
CN115070512B (zh) * 2022-03-11 2024-04-26 北京爱瑞思光学仪器有限公司 一种锗晶片的双抛工艺、装置及锗晶片
CN114800109A (zh) * 2022-06-27 2022-07-29 苏州博宏源机械制造有限公司 双面抛光机及其抛光方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4593495A (en) * 1983-11-25 1986-06-10 Toshiba Machine Co., Ltd. Polishing machine
US4974370A (en) * 1988-12-07 1990-12-04 General Signal Corp. Lapping and polishing machine
DE3929484A1 (de) * 1989-09-05 1991-03-14 Wacker Chemitronic Verfahren zum zweiseitigen chemomechanischen polieren von halbleiterscheiben, sowie vorrichtung zu seiner durchfuehrung und dadurch erhaeltliche halbleiterscheiben
JPH04261768A (ja) * 1991-02-18 1992-09-17 Toshiba Corp 両面ラップ加工装置
JPH0592363A (ja) * 1991-02-20 1993-04-16 Hitachi Ltd 基板の両面同時研磨加工方法と加工装置及びそれを用いた磁気デイスク基板の研磨加工方法と磁気デイスクの製造方法並びに磁気デイスク
US6099394A (en) * 1998-02-10 2000-08-08 Rodel Holdings, Inc. Polishing system having a multi-phase polishing substrate and methods relating thereto
US5389579A (en) * 1993-04-05 1995-02-14 Motorola, Inc. Method for single sided polishing of a semiconductor wafer
US5595529A (en) * 1994-03-28 1997-01-21 Speedfam Corporation Dual column abrading machine
US5643405A (en) * 1995-07-31 1997-07-01 Motorola, Inc. Method for polishing a semiconductor substrate
JPH10166259A (ja) * 1996-12-12 1998-06-23 Okamoto Kosaku Kikai Seisakusho:Kk サファイア基板研削研磨方法および装置
US5873772A (en) * 1997-04-10 1999-02-23 Komatsu Electronic Metals Co., Ltd. Method for polishing the top and bottom of a semiconductor wafer simultaneously
JP2984263B1 (ja) * 1998-10-23 1999-11-29 システム精工株式会社 研磨方法および研磨装置
US6746309B2 (en) * 1999-05-27 2004-06-08 Sanyo Electric Co., Ltd. Method of fabricating a semiconductor device
JP3791302B2 (ja) * 2000-05-31 2006-06-28 株式会社Ｓｕｍｃｏ 両面研磨装置を用いた半導体ウェーハの研磨方法
JP2003145412A (ja) * 2001-08-27 2003-05-20 Nippon Sheet Glass Co Ltd 情報記録媒体用ガラス基板の研磨方法及び情報記録媒体用ガラス基板
EP1489649A1 (en) * 2002-03-28 2004-12-22 Shin-Etsu Handotai Co., Ltd Double side polishing device for wafer and double side polishing method
JP3935757B2 (ja) * 2002-03-28 2007-06-27 信越半導体株式会社 ウエーハの両面研磨装置及び両面研磨方法
JP2004200526A (ja) * 2002-12-20 2004-07-15 Hitachi Cable Ltd 半導体ウェハ研削装置及び研削方法
US20040176017A1 (en) * 2003-02-25 2004-09-09 Aleksander Zelenski Apparatus and methods for abrading a work piece
KR100550491B1 (ko) * 2003-05-06 2006-02-09 스미토모덴키고교가부시키가이샤 질화물 반도체 기판 및 질화물 반도체 기판의 가공 방법
JP4198607B2 (ja) * 2004-01-13 2008-12-17 Ｈｏｙａ株式会社 磁気ディスク用ガラス基板の製造方法及び磁気ディスクの製造方法
DE102004005702A1 (de) * 2004-02-05 2005-09-01 Siltronic Ag Halbleiterscheibe, Vorrichtung und Verfahren zur Herstellung der Halbleiterscheibe
JP4818613B2 (ja) * 2005-01-19 2011-11-16 アイオン株式会社 両面平面研磨装置
JP4751115B2 (ja) * 2005-07-19 2011-08-17 株式会社岡本工作機械製作所 角形状基板の両面研削装置および両面研削方法
JP2009289925A (ja) * 2008-05-28 2009-12-10 Sumco Corp 半導体ウェーハの研削方法、研削用定盤および研削装置
JP2010264537A (ja) * 2009-05-14 2010-11-25 Disco Abrasive Syst Ltd キャリアプレート
EP2439768B1 (en) * 2009-06-04 2022-02-09 SUMCO Corporation Fixed-abrasive-grain machining apparatus, fixed-abrasive-grain machining method, and semiconductor-wafer manufacturing method
DE102009025242B4 (de) * 2009-06-17 2013-05-23 Siltronic Ag Verfahren zum beidseitigen chemischen Schleifen einer Halbleiterscheibe
DE102009030292B4 (de) * 2009-06-24 2011-12-01 Siltronic Ag Verfahren zum beidseitigen Polieren einer Halbleiterscheibe
DE102010013520B4 (de) * 2010-03-31 2013-02-07 Siltronic Ag Verfahren zur beidseitigen Politur einer Halbleiterscheibe

Also Published As

Publication number Publication date
CN104813448A (zh) 2015-07-29
JP6120974B2 (ja) 2017-04-26
US20140094094A1 (en) 2014-04-03
KR20150056633A (ko) 2015-05-26
JP2015531318A (ja) 2015-11-02
TWI494981B (zh) 2015-08-01
TW201413809A (zh) 2014-04-01
RU2015114097A (ru) 2016-11-20
WO2014052130A1 (en) 2014-04-03

Similar Documents

Publication Publication Date Title
IN2015DN03023A (enrdf_load_stackoverflow)
MY170361A (en) Sapphire polishing slurry and sapphire polishing method
MY181618A (en) Colloidal silica polishing composition and method for manufacturing synthetic quartz glass substrates using the same
MY165019A (en) Method of manufacturing a glass substrate for a magnetic disk and method of manufacturing a magnetic disk
MY170357A (en) Polishing composition and polishing method using the same
Lee et al. Application of electrolytic in-process dressing (ELID) grinding and chemical mechanical polishing (CMP) process for emerging hard–brittle materials used in light-emitting diodes
JP2010283371A5 (enrdf_load_stackoverflow)
MY153077A (en) Method to selectively polish silicon carbide films
JP2011025322A5 (enrdf_load_stackoverflow)
MY195662A (en) Method for Manufacturing Magnetic-Disk Substrate, and Polishing Pad
WO2013178535A3 (en) Free-standing non-planar polycrystalline synthetic diamond components and method of fabrication
PH12012000019A1 (en) Method of manufacturing a glass substrate for a magnetic disk and method of manufacturing a magnetic disk
MY156911A (en) Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafers
MY172434A (en) Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same
WO2010120778A3 (en) Chemical mechanical fabrication (cmf) for forming tilted surface features
PH12020551265A1 (en) Fixed abrasive three-dimensional lapping and polishing plate and methods of making and using the same
TW200625413A (en) Epitaxial wafer and method for manufacturing epitaxial wafer
MY173574A (en) Method for manufacturing glass substrate and method for manufacturing magnetic disk
SG165292A1 (en) Method of manufacturing a substrate for a magnetic disk
MY168569A (en) Method of manufacturing a substrate, method of manufacturing a magnetic disk glass substrate and method of manufacturing a magnetic disk
MY199153A (en) Method for producing substrate and polishing composition
JP2016204187A5 (enrdf_load_stackoverflow)
MY169421A (en) Method for manufacturing magnetic-disk glass substrate
TWM500653U (zh) 硏磨系統及硏磨墊的組合
PH12011000429A1 (en) Dresser for polishing pad, method for manufacturing the dresser, glass substrate, method for manufacturing the glass substrate, glass substrate for magnetic recording medium, and method for manufacturing the glass substrate for magnetic recording medium