IN2015DN03023A - - Google Patents

Info

Publication number
IN2015DN03023A
IN2015DN03023A IN3023DEN2015A IN2015DN03023A IN 2015DN03023 A IN2015DN03023 A IN 2015DN03023A IN 3023DEN2015 A IN3023DEN2015 A IN 3023DEN2015A IN 2015DN03023 A IN2015DN03023 A IN 2015DN03023A
Authority
IN
India
Prior art keywords
substrate
grind
major surface
grinding
abrasive
Prior art date
Application number
Inventor
Robert A ; Rizzuto
Ajay Krishnan
Christopher; Arcona
Anand; Tanikella
Original Assignee
Saint Gobain Ceramics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Ceramics filed Critical Saint Gobain Ceramics
Publication of IN2015DN03023A publication Critical patent/IN2015DN03023A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

A method of forming a substrate is performed by grinding a substrate using abrasives so that both major surfaces of the substrate achieve desired flatness, smoothness , or both. In an embodiment ,a coarser abrasive is used to grind one major surface , while a finer abrasive is simultaneously used to grind the other major surface. A single grinding step can used to produce a substrate having opposing surfaces of different surface roughnesses. This may help to eliminate a typical second downstream fine polishing step used in the prior art. Embodiments can be used with a wide variety of substrates, including sapphire, silicon carbide and gallium nitride single crystal structures grown by various techniques.
IN3023DEN2015 2012-09-28 2013-09-18 IN2015DN03023A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261707528P 2012-09-28 2012-09-28
PCT/US2013/060442 WO2014052130A1 (en) 2012-09-28 2013-09-18 Modified microgrinding process

Publications (1)

Publication Number Publication Date
IN2015DN03023A true IN2015DN03023A (en) 2015-10-02

Family

ID=50385635

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3023DEN2015 IN2015DN03023A (en) 2012-09-28 2013-09-18

Country Status (8)

Country Link
US (1) US20140094094A1 (en)
JP (1) JP6120974B2 (en)
KR (1) KR20150056633A (en)
CN (1) CN104813448A (en)
IN (1) IN2015DN03023A (en)
RU (1) RU2015114097A (en)
TW (1) TWI494981B (en)
WO (1) WO2014052130A1 (en)

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JP2019141974A (en) * 2018-02-22 2019-08-29 株式会社ミズホ Double side lapping machine and method for grinding thin fine ceramic using the same
CN109012918B (en) * 2018-10-12 2024-01-12 河南先导机械力化学研究院有限公司 Planetary ball mill
CN111098224B (en) * 2018-10-26 2022-08-26 东莞新科技术研究开发有限公司 Semiconductor substrate and surface polishing method thereof
US11342256B2 (en) 2019-01-24 2022-05-24 Applied Materials, Inc. Method of fine redistribution interconnect formation for advanced packaging applications
CN110018028B (en) * 2019-04-17 2023-01-13 宸鸿科技(厦门)有限公司 Preparation method of metallographic section sample of sapphire substrate electronic component
IT201900006740A1 (en) * 2019-05-10 2020-11-10 Applied Materials Inc SUBSTRATE STRUCTURING PROCEDURES
IT201900006736A1 (en) 2019-05-10 2020-11-10 Applied Materials Inc PACKAGE MANUFACTURING PROCEDURES
US11931855B2 (en) 2019-06-17 2024-03-19 Applied Materials, Inc. Planarization methods for packaging substrates
JP7236970B2 (en) * 2019-09-23 2023-03-10 日本特殊陶業株式会社 Ceramic heater and glow plug
US11862546B2 (en) 2019-11-27 2024-01-02 Applied Materials, Inc. Package core assembly and fabrication methods
CN110900342B (en) * 2019-11-29 2020-12-08 上海磐盟电子材料有限公司 Sheet grinding machine
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
US11400545B2 (en) 2020-05-11 2022-08-02 Applied Materials, Inc. Laser ablation for package fabrication
CN111761505B (en) * 2020-07-10 2021-07-27 浙江中晶科技股份有限公司 Silicon wafer double-side grinding equipment and production process thereof
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
US11521937B2 (en) 2020-11-16 2022-12-06 Applied Materials, Inc. Package structures with built-in EMI shielding
US11404318B2 (en) 2020-11-20 2022-08-02 Applied Materials, Inc. Methods of forming through-silicon vias in substrates for advanced packaging
JP7240013B2 (en) * 2021-03-19 2023-03-15 大昌精機株式会社 Vertical grinder
US11705365B2 (en) 2021-05-18 2023-07-18 Applied Materials, Inc. Methods of micro-via formation for advanced packaging
CN115070512B (en) * 2022-03-11 2024-04-26 北京爱瑞思光学仪器有限公司 Double-polishing process and device for germanium wafer and germanium wafer
CN114800109A (en) * 2022-06-27 2022-07-29 苏州博宏源机械制造有限公司 Double-side polishing machine and polishing method thereof

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Also Published As

Publication number Publication date
TW201413809A (en) 2014-04-01
WO2014052130A1 (en) 2014-04-03
TWI494981B (en) 2015-08-01
US20140094094A1 (en) 2014-04-03
JP2015531318A (en) 2015-11-02
KR20150056633A (en) 2015-05-26
CN104813448A (en) 2015-07-29
JP6120974B2 (en) 2017-04-26
RU2015114097A (en) 2016-11-20

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