JPH04261768A - Double-side lapping device - Google Patents
Double-side lapping deviceInfo
- Publication number
- JPH04261768A JPH04261768A JP3023269A JP2326991A JPH04261768A JP H04261768 A JPH04261768 A JP H04261768A JP 3023269 A JP3023269 A JP 3023269A JP 2326991 A JP2326991 A JP 2326991A JP H04261768 A JPH04261768 A JP H04261768A
- Authority
- JP
- Japan
- Prior art keywords
- surface plate
- workpiece
- grindstone
- grain size
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003746 surface roughness Effects 0.000 abstract description 26
- 238000003754 machining Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 12
- 238000003672 processing method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000010432 diamond Substances 0.000 description 4
- 238000005498 polishing Methods 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は樹脂、繊維強化樹脂、セ
ラミックなどの各材料からなる加工物の対向する二つの
面を研磨加工するラップ加工装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lapping device for polishing two opposing surfaces of a workpiece made of materials such as resin, fiber-reinforced resin, and ceramic.
【０００２】0002
【従来の技術】一般に部品の表面を研磨加工するために
使用されるラップ加工装置は、上位定盤と、下位定盤と
、上位定盤と下位定盤との間に設けられ加工物を保持す
る孔を有する保持部材とを備え、上位定盤と下位定盤と
保持部材とに相対的な回転運動を与えて定盤に設けた砥
石で加工物を研磨加工する装置である。ここで、上位定
盤の下面と下位定盤の上面に夫々砥石を設けて加工物の
対向する一対の面を同時に加工するものが両面ラップ加
工装置であり、一方の定盤のみに砥石面を設けて加工物
の対向する一対の面の一方のみを加工するものが片面ラ
ップ加工装置である。[Prior Art] Lapping equipment, which is generally used to polish the surface of parts, is installed between an upper surface plate, a lower surface plate, and between the upper and lower surface plates to hold the workpiece. This device is equipped with a holding member having a hole for polishing a workpiece with a grindstone provided on the surface plate by applying relative rotational motion to the upper surface plate, the lower surface plate, and the holding member. Here, a double-sided lapping machine is a machine that simultaneously processes a pair of opposing surfaces of a workpiece by installing a grindstone on the lower surface of the upper surface plate and on the upper surface of the lower surface plate. A single-sided lapping device is one that processes only one of a pair of opposing surfaces of a workpiece.
【０００３】ところで、最近一対の面を有する加工物に
おいて、各面が異なる表面粗さを要求されることがある
。例えば、電子装置に使用されるセラミック部品におい
て一方の面は高い精度の表面粗さが要求され、他方の面
は他の部品と接着材を用いて接着するために粗い表面粗
さが要求されることがある。このように表面粗さが異な
る一対の面を有する加工物の表面をラップ加工装置で加
工する場合には、次に述べる方法が提案されている。[0003] Nowadays, in workpieces having a pair of surfaces, each surface is sometimes required to have a different surface roughness. For example, in ceramic parts used in electronic devices, one side requires highly accurate surface roughness, and the other side requires rough surface roughness because it is bonded to other parts using an adhesive. Sometimes. When processing the surface of a workpiece having a pair of surfaces with different surface roughness using a lapping machine, the following method has been proposed.
【０００４】第一の加工方法は、両面ラップ加工装置で
加工物の一対の面を粗い表面粗さに加工し、次に片面ラ
ップ加工装置で高い精度を要求されている面をその表面
粗さで加工する方法である。第二の加工方法は、片面ラ
ップ加工装置で加工物の一方の面を加工し、次いで片面
ラップ加工装置で加工物の他方の面を加工する方法であ
る。[0004] The first processing method uses a double-sided lapping machine to machine a pair of surfaces of the workpiece to a rough surface roughness, and then a single-sided lap machine to process the surface requiring high accuracy to the surface roughness. This is a method of processing. The second processing method is a method in which one side of the workpiece is processed using a single-side lapping device, and then the other side of the workpiece is processed using a single-side lapping device.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、これら
の加工方法には次に述べる問題がある。[Problems to be Solved by the Invention] However, these processing methods have the following problems.
【０００６】第一の加工方法は、加工物の両面をラップ
加工した後、一方の面を加工するので、２回の加工工程
が必要である。第二の加工方法は、加工物の各面を個別
にラップ加工するために、同じく２回の加工工程が必要
である。[0006] In the first processing method, both sides of the workpiece are lapped and then one side is processed, so two processing steps are required. The second processing method also requires two processing steps to individually lap each side of the workpiece.
【０００７】また、第一および第二の加工方法は、いず
れも２回目の工程で加工物を片面ラップ加工装置で加工
するが、この時加工物の加工を必要しない面をラップ加
工装置の上位定盤または下位定盤の一方に接着し、加工
を必要とする面を他の定盤で加工する必要がある。この
時、加工物の定盤に接着した一方の面と、加工した他方
の面との間で平行度が低下することがある。すなわち、
上位定盤と下位定盤との平行度の誤差、加工物と定盤と
の間に介在する接着剤の厚みのばらつきなどが影響して
、加工物が定盤に垂直に位置せず、両方の加工面の平行
度が低下することがある。[0007] In both the first and second processing methods, the workpiece is processed using a single-sided lapping machine in the second step, but at this time, the side of the workpiece that does not require processing is placed on the upper side of the lapping machine. It is necessary to glue it to one of the surface plates or lower surface plates, and process the surface that requires processing on the other surface plate. At this time, parallelism may decrease between one surface of the workpiece adhered to the surface plate and the other processed surface. That is,
Due to the influence of errors in parallelism between the upper surface plate and lower surface plate, variations in the thickness of the adhesive between the workpiece and the surface plate, etc., the workpiece is not positioned perpendicular to the surface plate, and both The parallelism of the machined surface may decrease.
【０００８】本発明は前記事情に基づいてなされたもの
で、表面粗さが異なる一対の面を有する加工物の該面を
一回の加工工程でラップ加工できる両面ラップ加工装置
を提供することを目的とする。The present invention has been made based on the above-mentioned circumstances, and it is an object of the present invention to provide a double-sided lapping device capable of lapping a pair of surfaces of a workpiece having different surface roughness in a single processing step. purpose.
【０００９】[0009]
【課題を解決するための手段と作用】本発明の発明者は
、互いに対向して表面粗さが異なる一対の面を有する加
工物の該面をラップ加工する装置について研究を重ねて
きたが、この結果次のことがわかった。[Means and Effects for Solving the Problems] The inventor of the present invention has conducted repeated research on an apparatus for lapping a surface of a workpiece having a pair of opposing surfaces with different surface roughness. As a result, we found the following.
【００１０】従来の加工技術は、ラップ加工装置で加工
物を２回の加工工程で加工するために加工工程数が多く
、また２回目の加工工程で片面加工を行うために一対の
面の平行度が悪いという問題を踏まえて、両面ラップ加
工装置を用いて１回の加工工程で加工物の一対の面を加
工することについて研究を重ねた。[0010] Conventional machining techniques require a large number of machining steps because the workpiece is processed in two machining steps using a lapping machine, and one side of the workpiece is processed in parallel in the second machining step. In view of the problem of poor lapping, we have conducted repeated research into processing a pair of surfaces of a workpiece in one processing step using a double-sided lapping device.
【００１１】この結果、両面ラップ加工装置において、
上位定盤に粒度が細かい砥石を配置し、粒度が粗い砥石
を下位定盤に配置することにより、互いに対向して表面
粗さが異なる一対の面を有する加工物の該面を同時に加
工できることを見出した。As a result, in the double-sided lapping machine,
By arranging a grindstone with fine grain size on the upper surface plate and a grindstone with coarse grain size on the lower surface plate, it is possible to simultaneously process the surfaces of a workpiece that has a pair of opposing surfaces with different surface roughness. I found it.
【００１２】上位定盤に粒度が細かい砥石を配置し、粒
度が粗い砥石を下位定盤に配置する理由は、粒度の細か
い上位定盤の砥石から剥がれた砥粒や削りかすが流れ出
て下位定盤に達しても、表面粗さの粗い加工物の面には
影響をおよぼさないからである。[0012] The reason why a grindstone with a fine grain size is placed on the upper surface plate and a grindstone with a coarse grain size is placed on the lower surface plate is that the abrasive grains and shavings peeled off from the grindstone on the upper surface plate with a fine grain size flow out and reach the lower surface plate. This is because even if it reaches , it does not affect the surface of the workpiece with a rough surface.
【００１３】本発明の両面ラップ加工装置は、下面に砥
石を有する上位定盤と、上面に砥石を有する下位定盤と
、前記上位定盤と前記下位定盤との間に設けられ加工物
を保持する孔を有する保持部材とを備え、前記上位定盤
と前記下位定盤と前記保持部材との間で相対的な回転運
動を与えて前記加工物の対向する面を前記上位定盤の砥
石と前記下位定盤の砥石で研磨加工する装置において、
前記上位定盤の砥石の粒度が前記下位定盤の砥石の粒度
よりも細かいことを特徴とするものである。[0013] The double-sided lapping device of the present invention includes an upper surface plate having a grindstone on the lower surface, a lower surface plate having the grindstone on the upper surface, and a surface plate provided between the upper surface plate and the lower surface plate for lapping the workpiece. a holding member having a hole for holding the workpiece, and a relative rotational movement is applied between the upper surface plate, the lower surface plate, and the holding member so that the opposing surfaces of the workpiece are brought into contact with the grindstone of the upper surface plate. and a device for polishing with a grindstone on the lower surface plate,
The grindstone of the upper surface plate has a finer grain size than the grindstone of the lower surface plate.
【００１４】[0014]
【実施例】本発明の実施例を図面を参照して説明する。
本発明の両面ラップ加工装置の一実施例について図１お
よび図２を参照して説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the present invention will be described with reference to the drawings. An embodiment of the double-sided lapping apparatus of the present invention will be described with reference to FIGS. 1 and 2.
【００１５】図中１は上位定盤、２は下位定盤、これら
両方の定盤１、２は上下に相対して水平に配置されてい
る。上位定盤１は定盤型をなす定盤本体１ａ の下面部
に砥石１ｂ を埋設したものである。下位定盤２は定盤
型をなす定盤本体２ａ の上面部に砥石２ｂ を埋設し
たものである。上位定盤１に設けた砥石１ｂ は下位定
盤２に設けた砥石２ｂ に比較して粒度の細かいものを
用いる。上位定盤１に設けてある砥石１ｂ の粒度と下
位定盤２に設けた砥石２ｂ の粒度の大きさは、ラップ
加工する加工物の加工面の表面粗さに応じて設定する。In the figure, 1 is an upper surface plate, 2 is a lower surface plate, and both of these surface plates 1 and 2 are arranged horizontally facing each other vertically. The upper surface plate 1 has a grinding wheel 1b buried in the lower surface of a surface plate body 1a having a surface plate shape. The lower surface plate 2 has a grinding wheel 2b buried in the upper surface of a surface plate body 2a having a surface plate shape. The grindstone 1b provided on the upper surface plate 1 has a finer grain size than the grindstone 2b provided on the lower surface plate 2. The grain size of the grindstone 1b provided on the upper surface plate 1 and the grain size of the grindstone 2b provided on the lower surface plate 2 are set depending on the surface roughness of the processed surface of the workpiece to be lapped.
【００１６】上位定盤１は垂直な保持軸３に取り付けら
れ、下位定盤２は垂直な保持軸４に取付けられている。
これら保持軸３、４は図示しない回転装置により回転さ
れ、また上位定盤１を取付けた保持軸３は図示しない上
下移動装置により上下移動される。The upper surface plate 1 is attached to a vertical holding shaft 3, and the lower surface plate 2 is attached to a vertical holding shaft 4. These holding shafts 3 and 4 are rotated by a rotating device (not shown), and the holding shaft 3 to which the upper surface plate 1 is attached is moved up and down by a vertical moving device (not shown).
【００１７】また、上位定盤１と下位定盤２との間には
、これらと平行に円盤型をなす加工物の保持部材５が配
置されている。この保持部材５は加工物を保持する複数
の孔６が形状中心を中心として所定半径をもって描かれ
る２個の円に位置して等間隔存して形成されている。
これは定盤の広い範囲で加工物を保持して各定盤の砥石
を全面にわたり均一に摩耗させるためである。また外周
縁部には歯部５ａ が形成されている。保持部材５は図
示しない部材に回転自在に水平に支承されており、歯部
５ａ には駆動歯車７が噛合している。駆動歯車７は図
示しない回転装置による回転される。このように構成さ
れた両面ラップ加工装置の作用について説明する。加工
物Ｓは互いに対向する一対の面を有するものである。Further, between the upper surface plate 1 and the lower surface plate 2, a disk-shaped workpiece holding member 5 is arranged parallel to them. This holding member 5 is formed with a plurality of holes 6 for holding the workpiece, located on two circles drawn with a predetermined radius around the center of the shape, and spaced at equal intervals. This is to hold the workpiece over a wide area of the surface plate and wear the grindstone of each surface plate uniformly over the entire surface. Further, a tooth portion 5a is formed on the outer peripheral edge. The holding member 5 is rotatably supported horizontally by a member (not shown), and a driving gear 7 is meshed with the toothed portion 5a. The drive gear 7 is rotated by a rotating device (not shown). The operation of the double-sided lapping apparatus configured as described above will be explained. The workpiece S has a pair of surfaces facing each other.
【００１８】上位定盤１と下位定盤２との間の間隙を拡
大して、保持部材５の各孔６に加工物Ｓを挿入して下位
定盤２の砥石２ｂ に上面に載せる。加工物Ｓは小さい
表面粗さを必要とする面を上側にし、大きい表面粗さを
必要とする面を下側にする。保持軸３により上位定盤１
を下方に移動して上位定盤１の砥石１ａ の下面を加工
物Ｓの上面に接触させる。これにより加工物Ｓの小さい
表面粗さを必要とする面は上側定盤１の砥石１ｂ に接
触し、大きい表面粗さを必要とする面は下側定盤２の砥
石２ｂ に接触する。The gap between the upper surface plate 1 and the lower surface plate 2 is enlarged, and the workpiece S is inserted into each hole 6 of the holding member 5 and placed on the upper surface of the grindstone 2b of the lower surface plate 2. The surface of the workpiece S that requires a small surface roughness is on the top, and the surface that requires a large surface roughness is on the bottom. Upper surface plate 1 by holding shaft 3
is moved downward to bring the lower surface of the grinding wheel 1a of the upper surface plate 1 into contact with the upper surface of the workpiece S. As a result, the surface of the workpiece S that requires a small surface roughness comes into contact with the grindstone 1b of the upper surface plate 1, and the surface that requires a large surface roughness contacts the grindstone 2b of the lower surface plate 2.
【００１９】各回転装置により保持軸３、４を介して上
位定盤１と下位定盤２を互いに逆向きの方向に回転させ
る。回転装置により駆動歯車７を回転して保持部材５を
例えば上位定盤１と同じ方向に回転させる。また、それ
ぞれは回転数を異ならせて回転する。The upper surface plate 1 and the lower surface plate 2 are rotated in opposite directions by the respective rotating devices via the holding shafts 3 and 4. The drive gear 7 is rotated by the rotation device to rotate the holding member 5, for example, in the same direction as the upper surface plate 1. Moreover, each rotates at a different number of rotations.
【００２０】これにより加工物Ｓの上面は上位定盤１の
砥石１ｂ に研摩され、下面は下位定盤２の砥石２ｂ
に研摩される。上位定盤１の砥石１ｂの粒度は下位定盤
２の砥石２ｂ の粒度に比較して細かいので、加工物Ｓ
の上面は下面に比較して細かい表面粗さで研摩される。
このようにして１回のラップ加工で加工物Ｓの対向する
２個の面を表面粗さを異ならせて研摩加工をできる。ま
た、加工物の一対の目の平行度の制度に低下も発生しな
い。具体例について説明する。As a result, the upper surface of the workpiece S is ground by the grinding wheel 1b of the upper surface plate 1, and the lower surface is ground by the grinding wheel 2b of the lower surface plate 2.
Polished to Since the grain size of the grinding wheel 1b on the upper surface plate 1 is finer than that of the grinding wheel 2b on the lower surface plate 2, the workpiece S
The upper surface is polished to a finer surface roughness than the lower surface. In this way, two opposing surfaces of the workpiece S can be polished with different surface roughnesses in one lapping process. Further, the accuracy of the parallelism between the pair of eyes of the workpiece does not deteriorate. A specific example will be explained.
【００２１】縦３０ｍｍ×横３０ｍｍ×高さ５ ｍｍの
窒化けい素焼結体の角板を加工物として準備した。この
加工物の対向する一対の面を平行度１０ｕｍ、表面粗さ
が０．４ｕｍＲａ と０．１ｕｍＲａに仕上るために、
図１および図２に示す両面ラップ加工装置を使用して加
工物にラップ加工を施した。A square plate of silicon nitride sintered body measuring 30 mm long x 30 mm wide x 5 mm high was prepared as a workpiece. In order to finish the pair of opposing surfaces of this workpiece with a parallelism of 10um and a surface roughness of 0.4umRa and 0.1umRa,
The workpiece was lapped using the double-sided lapping apparatus shown in FIGS. 1 and 2.
【００２２】上位定盤には平行度２０ｕｍのダイヤモン
ドを埋込んだ砥石を使用し、下位定盤には １００ｕｍ
のダイヤモンドを埋込んだ砥石を使用した。保持部材に
は縦３５ｍｍ×横３５ｍｍ×厚さ３ｍｍ の孔を有する
ガラスエポキシ樹脂からなる物を使用し、加工物を保持
部材に孔に挿入した。加工条件としては、上位定盤を右
前回りに１００ｒｐｍ、下位定盤は左まわりに４５ｒｐ
ｍ 、保持部材が右回りに２５ｒｐｍ にそれぞれを回
転を設定した。また、比較例として加工物の両面を片面
ラップ加工装置でそれぞれ個別ラップ加工した。[0022] The upper surface plate uses a grindstone embedded with diamonds with a parallelism of 20 um, and the lower surface plate uses a grindstone with a parallelism of 100 um.
A whetstone embedded with diamonds was used. A holding member made of glass epoxy resin having a hole measuring 35 mm long x 35 mm wide x 3 mm thick was used, and the workpiece was inserted into the hole in the holding member. As for the processing conditions, the upper surface plate rotates clockwise at 100 rpm, and the lower surface plate rotates counterclockwise at 45 rpm.
m, the holding member was set to rotate clockwise at 25 rpm, respectively. In addition, as a comparative example, both sides of the workpiece were individually lapped using a single-sided lapping machine.
【００２３】そして、本発明例の加工物の表面粗さと比
較例の加工物の表面粗さを測定した。この結果、本発明
の両面ラップ加工装置で加工した加工物の２個の加工面
の表面粗さは０．３２ｕｍＲａと０．０７ｕｍＲａ、平
行度は７．７ｕｍ であった。これに対して比較例の加
工物の２個の加工面の表面粗さは０．２９ｕｍＲａと０
．０９ｕｍＲａ、平行度は１５．６ｕｍであった。比較
例の加工物の加工面は表面粗さは本発明例の加工物と大
体同じであったが、平行度は目標値を満足できなかった
。また、加工時間は比較例の加工物の加工では８時間か
かってしまったが、本発明例の加工物の加工では５時間
であって、本発明の場合は比較例の場合と比較して約３
時間短縮できた。本発明の他の実施例について図３およ
び図４について説明する。Then, the surface roughness of the workpiece of the present invention example and the workpiece of the comparative example were measured. As a result, the surface roughness of the two processed surfaces of the workpiece processed with the double-sided lapping apparatus of the present invention was 0.32 umRa and 0.07 umRa, and the parallelism was 7.7 um. On the other hand, the surface roughness of the two machined surfaces of the comparative example workpiece was 0.29umRa and 0.
．． The parallelism was 15.6 um. The surface roughness of the machined surface of the workpiece of the comparative example was almost the same as that of the workpiece of the invention example, but the parallelism could not satisfy the target value. In addition, it took 8 hours to process the workpiece of the comparative example, but it took 5 hours to process the workpiece of the invention example. 3
I was able to save time. Another embodiment of the present invention will be described with reference to FIGS. 3 and 4.
【００２４】この実施例では、下位定盤２は保持軸４に
保持されず、台１２に載置されている。上位定盤１と下
位定盤２との間に、その形状中心を中心として描かれる
円に位置して複数の保持部材８が配置されている。これ
らの保持部材８は円リング形をなすもので、同心円上に
位置して加工物Ｓを保持する複数の孔８ａ が形成され
、外周縁部に歯部８ｂ が形成されている。各保持部材
８で囲まれた下位定盤２の中心には歯車９が配置され、
この歯車９は各保持部材８の外周縁部の歯部８ｂ に噛
合している。歯車９は下位定盤２および台１２に上下方
向に形成した孔を通して設けた保持軸１０に保持されて
いる。
保持軸１０は図示しない回転装置に回転されている。各
保持部材８に周囲を囲んで図示しない円形のリング歯車
１１が設けられ、このリング歯車１１に内周部に形成さ
れた歯部には各保持部材８の外周部の歯部が噛合されて
いる。これにより各保持部材８は歯車９とリング歯車１
１に保持されている。In this embodiment, the lower surface plate 2 is not held by the holding shaft 4, but is placed on a stand 12. A plurality of holding members 8 are arranged between the upper surface plate 1 and the lower surface plate 2 in a circle drawn around the center of the shape thereof. These holding members 8 are ring-shaped, and have a plurality of concentric holes 8a for holding the workpiece S, and teeth 8b on the outer periphery. A gear 9 is arranged at the center of the lower surface plate 2 surrounded by each holding member 8,
This gear 9 meshes with teeth 8b on the outer peripheral edge of each holding member 8. The gear 9 is held by a holding shaft 10 provided through holes formed in the lower surface plate 2 and the stand 12 in the vertical direction. The holding shaft 10 is rotated by a rotating device (not shown). A circular ring gear 11 (not shown) is provided surrounding each holding member 8, and teeth formed on the inner periphery of the ring gear 11 mesh with teeth on the outer periphery of each holding member 8. There is. As a result, each holding member 8 has a gear 9 and a ring gear 1.
It is held at 1.
【００２５】各保持部材８の各孔８ａ には夫々加工物
Ｓを保持する。回転装置により保持軸１０を介して歯車
９を回転すると、各保持部材８がリング歯車１１に支持
されて歯車９の周囲を自転しながら公転する。すなわち
、各保持部材８に保持された加工物Ｓは自転しながら公
転して、その上面および下面が上位定盤１の砥石１ｂお
よび下位定盤２の砥石２ｂにより研摩加工される。具体
的な例について説明する。A workpiece S is held in each hole 8a of each holding member 8, respectively. When the gear 9 is rotated by the rotation device via the holding shaft 10, each holding member 8 is supported by the ring gear 11 and revolves around the gear 9 while rotating. That is, the workpiece S held by each holding member 8 revolves while rotating, and its upper and lower surfaces are polished by the grindstone 1b of the upper surface plate 1 and the grindstone 2b of the lower surface plate 2. A specific example will be explained.
【００２６】加工物として窒化けい素焼結体からなる丸
板（直径５０ｍｍ×厚さ １０ｍｍ ）を用意した。前
述した実施例の加工物と同じ大きさの表面粗さを得るこ
とを目標にして、本発明の両面ラップ加工装置を使用し
て加工物の両面をラップ加工した。上位定盤には平行度
２０ｕｍのダイヤモンドを埋込んだ砥石を使用し、下位
定盤には １００ｕｍのダイヤモンドを埋込んだ砥石を
した。保持部材は直径５５ｍｍ、厚さ６ｍｍ の孔を有
するアルミニウム合金からなるものを使用した。加工物
は保持部材の孔に挿入して加工を行った。加工条件とし
ては、上位定盤および下位定盤を固定し、保持部材を２
００ｒｐｍで自転させながら各定盤の中心に対して６０
ｒｐｍ で公転させた。加工終了後、加工物の加工面を
測定すると、表面粗さはｏ．２６ｕｍＲａとｏ．００９
ｕｍＲａ、平行度は５．８ｕｍＲａ であり、前述の実
施例の加工物の場合とほぼ同じであった。なお、本発明
は前述した実施例に限定されずに、種々変形して実施す
ることができる。A round plate (diameter 50 mm x thickness 10 mm) made of a silicon nitride sintered body was prepared as a workpiece. Both sides of the workpiece were lapped using the double-sided lapping apparatus of the present invention, with the goal of obtaining the same level of surface roughness as the workpiece of the previous example. The upper surface plate used a grindstone with diamonds embedded in it with a parallelism of 20um, and the lower surface plate used a grindstone with diamonds embedded in 100um. The holding member was made of aluminum alloy and had a hole of 55 mm in diameter and 6 mm in thickness. The workpiece was inserted into the hole of the holding member and processed. The processing conditions are that the upper surface plate and lower surface plate are fixed, and the holding members are
60 to the center of each surface plate while rotating at 00 rpm.
It revolved at rpm. After finishing the machining, when the machined surface of the workpiece is measured, the surface roughness is o. 26umRa and o. 009
The umRa and parallelism were 5.8 umRa, which was almost the same as that of the workpiece of the previous example. Note that the present invention is not limited to the embodiments described above, and can be implemented with various modifications.
【００２７】[0027]
【発明の効果】以上説明したように本発明によれば、表
面粗さが異なる一対の面を有する加工物の該面を一回の
加工工程でラップ加工でき、しかも加工物の一対の面の
平行度の精度が良好で精度の高いラップ加工を行える両
面ラップ加工装置を提供することができる。As explained above, according to the present invention, the surfaces of a workpiece having a pair of surfaces with different surface roughness can be lapped in one processing step, and the surfaces of the workpiece can be lapped in a single processing step. It is possible to provide a double-sided lapping device that has good parallelism accuracy and can perform highly accurate lapping.
【図１】本発明の一実施例の両面ラップ加工装置を示す
断面図。FIG. 1 is a sectional view showing a double-sided lapping apparatus according to an embodiment of the present invention.
【図２】本発明の一実施例の両面ラップ加工装置におい
て上位定盤を除いて示す平面図。FIG. 2 is a plan view of the double-sided lapping apparatus according to the embodiment of the present invention, with the upper surface plate removed.
【図３】本発明の他実施例の両面ラップ加工装置を示す
断面図。FIG. 3 is a sectional view showing a double-sided lapping apparatus according to another embodiment of the present invention.
【図４】本発明の他実施例の両面ラップ加工装置におい
て上位定盤を除いて示す平面図。FIG. 4 is a plan view of a double-sided lapping apparatus according to another embodiment of the present invention, with the upper surface plate removed.
１…上位定盤、１ｂ …砥石、２…下位定盤、２ｂ …
砥石、５…保持部材、Ｓ…加工物。1...Upper surface plate, 1b...Whetstone, 2...Lower surface plate, 2b...
Grindstone, 5... Holding member, S... Workpiece.
Claims (1)
に砥石を有する下位定盤と、前記上位定盤と前記下位定
盤との間に設けられ加工物を保持する孔を有する保持部
材とを備え、前記上位定盤と前記下位定盤と前記保持部
材との間で相対的な回転運動を与えて前記加工物の対向
する面を前記上位定盤の砥石と前記下位定盤の砥石で研
磨加工する装置において、前記上位定盤の砥石の粒度が
前記下位定盤の砥石の粒度よりも細かいことを特徴とす
る両面ラップ加工装置。1. An upper surface plate having a grindstone on the lower surface, a lower surface plate having the grindstone on the upper surface, and a holding member provided between the upper surface plate and the lower surface plate and having a hole for holding a workpiece. A relative rotational movement is applied between the upper surface plate, the lower surface plate, and the holding member to rotate opposing surfaces of the workpiece between the grindstone of the upper surface plate and the grindstone of the lower surface plate. A double-sided lapping device characterized in that the grain size of the grindstone on the upper surface plate is finer than the grain size of the grindstone on the lower surface plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3023269A JPH04261768A (en) | 1991-02-18 | 1991-02-18 | Double-side lapping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3023269A JPH04261768A (en) | 1991-02-18 | 1991-02-18 | Double-side lapping device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04261768A true JPH04261768A (en) | 1992-09-17 |
Family
ID=12105886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3023269A Pending JPH04261768A (en) | 1991-02-18 | 1991-02-18 | Double-side lapping device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04261768A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002173361A (en) * | 2000-12-07 | 2002-06-21 | Toshiba Corp | Ceramic board, thin film printed circuit board and method of manufacturing ceramic board |
| CN104813448A (en) * | 2012-09-28 | 2015-07-29 | 圣戈本陶瓷及塑料股份有限公司 | Modified microgrinding process |
| CN111230630A (en) * | 2020-03-14 | 2020-06-05 | 李广超 | Flat steel double-sided sander |
| CN116922259A (en) * | 2023-09-13 | 2023-10-24 | 杭州泓芯微半导体有限公司 | Ultra-precise double-sided automatic grinding machine |
-
1991
- 1991-02-18 JP JP3023269A patent/JPH04261768A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002173361A (en) * | 2000-12-07 | 2002-06-21 | Toshiba Corp | Ceramic board, thin film printed circuit board and method of manufacturing ceramic board |
| CN104813448A (en) * | 2012-09-28 | 2015-07-29 | 圣戈本陶瓷及塑料股份有限公司 | Modified microgrinding process |
| JP2015531318A (en) * | 2012-09-28 | 2015-11-02 | サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド | Modified micro grinding process |
| CN111230630A (en) * | 2020-03-14 | 2020-06-05 | 李广超 | Flat steel double-sided sander |
| CN111230630B (en) * | 2020-03-14 | 2022-04-22 | 李广超 | Flat steel double-sided sander |
| CN116922259A (en) * | 2023-09-13 | 2023-10-24 | 杭州泓芯微半导体有限公司 | Ultra-precise double-sided automatic grinding machine |
| CN116922259B (en) * | 2023-09-13 | 2023-12-15 | 杭州泓芯微半导体有限公司 | Ultra-precise double-sided automatic grinding machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5791976A (en) | Surface machining method and apparatus | |
| JPH09270401A (en) | Polishing method of semiconductor wafer | |
| JP3909619B2 (en) | Apparatus and method for mirror processing of magnetic disk substrate | |
| TW201706077A (en) | Cutting blade and installation structure for the cutting blade capable of machining an inner diameter with a high accuracy and extending the lifetime of a blade mount | |
| JP3613345B2 (en) | Polishing apparatus and carrier for polishing apparatus | |
| JPH04261768A (en) | Double-side lapping device | |
| JP2014104522A (en) | Single-side processing method of wafer and production method of wafer | |
| JP2007290050A (en) | Polishing method, and plane polishing device | |
| JP2006035369A (en) | Surface polishing machine | |
| JP2608757B2 (en) | Quartz crystal crystal wafer | |
| JP4169432B2 (en) | Workpiece holder, polishing apparatus, and polishing method | |
| JPH012861A (en) | polishing equipment | |
| JPH03104567A (en) | Grinding wheel and grinding method | |
| JPS6125976Y2 (en) | ||
| JP2000153458A (en) | Flush mounting method and device of grinding wheel surface plate in double-sided work machine | |
| JPS63300857A (en) | Polisher | |
| JPS62251081A (en) | Grinding device and element | |
| JP2011161560A (en) | End face machining method and end face machining device of circular plate material | |
| JP2004306232A (en) | Polishing method and polishing device of workpiece to be polished | |
| JP4352909B2 (en) | Polishing apparatus, carrier for polishing apparatus and polishing method | |
| JP3315793B2 (en) | Substrate polishing method | |
| JP2003205455A (en) | Chuck device and chuck method | |
| TW202239518A (en) | Method of grinding workpiece | |
| JPH05162066A (en) | Position detecting device of floating abrasive grain type polishing machine | |
| JPH0321021A (en) | Method and apparatus for chamfering semiconductor substrate |