TW201706077A - Cutting blade and installation structure for the cutting blade capable of machining an inner diameter with a high accuracy and extending the lifetime of a blade mount - Google Patents
Cutting blade and installation structure for the cutting blade capable of machining an inner diameter with a high accuracy and extending the lifetime of a blade mount Download PDFInfo
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- TW201706077A TW201706077A TW105114748A TW105114748A TW201706077A TW 201706077 A TW201706077 A TW 201706077A TW 105114748 A TW105114748 A TW 105114748A TW 105114748 A TW105114748 A TW 105114748A TW 201706077 A TW201706077 A TW 201706077A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/02—Circular saw blades
- B23D61/025—Details of saw blade body
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
Description
本發明是有關安裝於切削裝置的主軸使用的切削刃及該切削刃的安裝構造。 The present invention relates to a cutting edge used for a spindle attached to a cutting device and a mounting structure of the cutting edge.
以形成在將IC、LSI等的設備形成格子狀的複數分割預定線所區劃的表面各區域之矽晶圓等的半導體晶圓是在研磨背面加工成預定的厚度之後，藉切削裝置分割成各個設備晶片，將分割後的設備晶片廣泛利用在行動電話、個人電腦等的各種電子機器。 A semiconductor wafer formed on a surface of each of the surfaces of the surface divided by a plurality of predetermined dividing lines in which a device such as an IC or an LSI is formed in a lattice shape is processed into a predetermined thickness on the polishing back surface, and then divided into individual pieces by a cutting device. The device wafer is widely used in various electronic devices such as mobile phones and personal computers.
藉切削裝置將半導體晶圓分割成各個設備晶片的分割步驟是在切削裝置的主軸安裝切削刃，藉切削加工將半導體晶圓分割成各個設備晶片。 The dividing step of dividing the semiconductor wafer into individual device wafers by the cutting device is to mount a cutting edge on the main axis of the cutting device, and divide the semiconductor wafer into individual device wafers by cutting.
切削加工所使用的切削刃具有以鍍鎳將鑽石磨粒等硬化的電鑄輪轂刀刃，或以樹脂黏結劑、金屬黏結劑、陶瓷黏結劑將鑽石磨粒等硬化的樹脂刀刃、金屬刀刃、陶瓷刀刃等的各種種類，該等切削刃可對應被加工物的特性適當選擇加以使用。 The cutting edge used for cutting has an electroformed wheel blade that hardens diamond abrasive grains by nickel plating, or a resin blade, metal blade, or ceramic that hardens diamond abrasive grains with a resin binder, a metal binder, or a ceramic binder. Various types of cutting edges and the like can be appropriately selected and used depending on the characteristics of the workpiece.
在此，與電鑄輪轂刀刃不同，包括樹脂刀 刃、金屬刀刃、陶瓷刀刃的所謂無基台的環狀刃(墊圈刀刃)是首先混合種種的黏結材的粉末或鑽石磨粒等成形為墊圈形，將成形品燒結、鍛燒，隨後分別藉外圓磨床將內徑與外形加工成預定尺寸所製作(例如，參閱日本特開平8-127023號、日本特開2002-66933號、日本特開2002-192469號公報)。 Here, unlike the electroformed wheel blade, including the resin knife The so-called abutment-free annular blade (washer blade) of the blade, the metal blade, and the ceramic blade is formed by mixing powders of various kinds of cement materials or diamond abrasive grains into a washer shape, and then sintering and calcining the molded product, and then borrowing them separately. The cylindrical grinding machine is manufactured by processing the inner diameter and the outer shape into a predetermined size (for example, see Japanese Patent Laid-Open No. Hei 8-127023, JP-A-2002-66933, and JP-A-2002-192469).
如上述製作的墊圈刀刃是安裝在固定於切削裝置的主軸前端部之刀架的輪轂部，並將拆裝凸緣插入輪轂部，以刀架的固定凸緣與拆裝凸緣夾入墊圈刀刃的狀態，藉著將固定螺帽栓鎖在形成於刀架的輪轂部的外螺紋緊固而安裝於主軸的前端部。 The washer blade manufactured as described above is mounted on the hub portion of the tool holder fixed to the front end portion of the spindle of the cutting device, and the detachable flange is inserted into the hub portion, and the washer blade is inserted into the fixing flange of the tool holder and the detachable flange. The state is attached to the front end portion of the main shaft by fastening the fixing nut to the external thread formed on the hub portion of the holder.
墊圈刀刃雖是安裝在刀架的輪轂部，但是墊圈刀刃的內徑尺寸與刀架的輪轂部的尺寸的差較大時，會使得墊圈刀刃顫動，對切削加工的被加工物的加工品質造成不良影響。為此，墊圈刀刃的內徑尺寸有高精度加工的必要。 Although the washer blade is attached to the hub portion of the tool holder, the difference between the inner diameter of the washer blade and the size of the hub portion of the tool holder causes the washer blade to vibrate, resulting in the processing quality of the workpiece being machined. Bad effects. For this reason, the inner diameter of the gasket blade is necessary for high-precision machining.
[專利文獻1]日本特開平8-127023號公報 [Patent Document 1] Japanese Patent Laid-Open No. Hei 8-127023
[專利文獻2]日本特開2002-66933號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2002-66933
[專利文獻3]日本特開2002-192469號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2002-192469
但是，磨粒從墊圈刀刃的內周圍突出，內周圍的高精度加工困難。所使用磨粒的磨粒徑越大則會有墊圈刀刃的內周圍之高精度加工變得越困難的問題。 However, the abrasive grains protrude from the inner periphery of the gasket blade, and high-precision machining of the inner periphery is difficult. The larger the abrasive grain size of the abrasive grains used, the more difficult the high-precision machining of the inner periphery of the gasket blade becomes more difficult.
又，墊圈刀刃的內周圍面有磨粒突出，因此對安裝墊圈刀刃的刀架的輪轂部造成損傷，也會有使得刀架的壽命縮短的問題。 Further, since the inner peripheral surface of the gasket blade protrudes from the abrasive grains, the hub portion of the holder to which the gasket blade is attached is damaged, and the life of the holder is also shortened.
本發明是有鑒於以上的點所研創而成，其目的在於提供一種可高精度加工內徑，並可增長刀架的壽命的切削刃。 The present invention has been made in view of the above points, and an object thereof is to provide a cutting edge which can machine an inner diameter with high precision and which can increase the life of the tool holder.
根據申請專利範圍第1項記載的發明，係提供一種切削刃，係安裝於切削裝置的主軸使用的切削刃，其特徵為，具備：環狀刃，及黏著於該環狀刃的至少一側面，中央形成有安裝孔的環形的薄板，該薄板的外徑是形成比該環狀刃的外徑小但比內徑大，該薄板的該安裝孔是形成與該環狀刃的內徑相等或比內徑小的尺寸。 According to the invention of the first aspect of the invention, there is provided a cutting edge for use in a cutting edge for use in a spindle of a cutting device, comprising: an annular blade; and an adhesion to at least one side of the annular blade An annular thin plate having a mounting hole formed in the center, the outer diameter of the thin plate being formed smaller than the outer diameter of the annular blade but larger than the inner diameter, and the mounting hole of the thin plate is formed to be equal to the inner diameter of the annular blade Or a smaller size than the inner diameter.
根據申請專利範圍第2項記載的發明，係於申請專利範圍第1項記載的切削刃的安裝構造中，提供一種切削刃的安裝構造，其特徵為，具備：刀架，包括固定於切削裝置的主軸前端部的外圍具有外螺紋的輪轂部及與該輪轂部一體形成的固定凸緣；上述切削刃，將該薄板的 該安裝孔安裝於該刀架的該輪轂部；拆裝凸緣，以和該刀架的該固定凸緣夾著該切削刃的方式插入該刀架的該輪轂部內；及固定螺帽，栓鎖於形成在該刀架的該輪轂部的該外螺紋以該固定凸緣與該拆裝凸緣夾著該切削刃並固定。 According to the invention of the second aspect of the invention, in the mounting structure of the cutting edge according to the first aspect of the invention, there is provided a mounting structure for a cutting edge, characterized in that the tool holder includes a tool holder and is fixed to the cutting device a peripheral portion of the front end portion of the main shaft having an externally threaded hub portion and a fixing flange integrally formed with the hub portion; the cutting edge, the thin plate The mounting hole is mounted on the hub portion of the tool holder; the dismounting flange is inserted into the hub portion of the tool holder so as to sandwich the cutting edge with the fixing flange of the tool holder; and the fixing nut and the bolt The external thread that is locked to the hub portion of the tool holder is fixed to the cutting edge by the fixing flange and the dismounting flange.
本發明的切削刃是由環狀刃，及在與環狀刃的至少一側面黏著的中央具有安裝孔的環形的薄板所構成，因此可高精度進行區劃切削刃的內徑之環形薄板的安裝孔的加工。 The cutting edge of the present invention is composed of an annular blade and an annular thin plate having a mounting hole in the center adhered to at least one side surface of the annular blade, so that the annular sheet of the inner diameter of the cutting edge can be mounted with high precision. Processing of the hole.
又，切削刃的內徑是由環形的薄板形成，不致有磨粒的突出。因此，不會損傷刀架的輪轂部，可增長刀架的壽命。 Further, the inner diameter of the cutting edge is formed by a ring-shaped thin plate so as not to protrude from the abrasive grains. Therefore, the life of the tool holder can be increased without damaging the hub portion of the tool holder.
2‧‧‧切削刃 2‧‧‧ cutting edge
4‧‧‧環狀刃(墊圈刀刃) 4‧‧‧Ring edge (washer blade)
4a‧‧‧墊圈刀刃的內周圍 4a‧‧‧The inner circumference of the washer blade
4b‧‧‧墊圈刀刃的外圍 4b‧‧‧The periphery of the washer blade
6‧‧‧環形的薄板 6‧‧‧Circular sheet
6a‧‧‧薄板的內周圍 6a‧‧‧The inner circumference of the sheet
6b‧‧‧薄板的外圍 6b‧‧‧The periphery of the sheet
18‧‧‧切削單元 18‧‧‧Cutting unit
24‧‧‧主軸 24‧‧‧ Spindle
26‧‧‧刀架 26‧‧‧Tool holder
28‧‧‧輪轂部 28‧‧·Wheel hub
30‧‧‧固定凸緣 30‧‧‧Fixed flange
32‧‧‧外螺紋 32‧‧‧External thread
36‧‧‧拆裝凸緣 36‧‧‧Disassembly flange
38‧‧‧固定螺帽 38‧‧‧Fixed nuts
第1(A)圖為本發明實施形態相關之切削刃的透視圖，第1(B)圖為其縱剖視圖。 Fig. 1(A) is a perspective view showing a cutting edge according to an embodiment of the present invention, and Fig. 1(B) is a longitudinal sectional view thereof.
第2圖為切削裝置的外觀透視圖。 Figure 2 is a perspective view showing the appearance of the cutting device.
第3圖是表示切削刃對主軸之安裝構造的分解透視圖。 Fig. 3 is an exploded perspective view showing the mounting structure of the cutting edge to the main shaft.
第4圖是在切削刃的前端部安裝切削刃的狀態的部份剖面側視圖。 Fig. 4 is a partial cross-sectional side view showing a state in which a cutting edge is attached to a tip end portion of a cutting edge.
以下，參閱圖示詳細說明本發明的實施形態。參閱第1(A)圖是表示本發明實施形態相關之切削刃2的透視圖。第1(B)圖為切削刃2的縱剖視圖。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to Fig. 1(A), there is shown a perspective view of a cutting edge 2 according to an embodiment of the present invention. Fig. 1(B) is a longitudinal sectional view of the cutting edge 2.
切削刃2是在整體為磨粒構成的環狀刃(以下，有稱墊圈刀刃)4的一側面黏著環形的薄板6所構成。墊圈刀刃4是在樹脂、金屬、玻璃質等的結合材混合鑽石、CBN(Cubic Boron Nitride)等的磨粒成形為墊圈形，進行成形品燒結、鍛燒，分別藉外圓磨床將其內周圍4a與外圍4b加工製作成預定尺寸。但是，對構成墊圈刀刃4的結合材或磨粒不加以限制，可對應切削之被加工物的種類適當選擇。 The cutting edge 2 is composed of a thin plate 6 which is adhered to one side of an annular blade (hereinafter referred to as a washer blade) 4 which is integrally formed of abrasive grains. The gasket blade 4 is formed by mixing a diamond such as a resin, a metal, or a glass material, and a abrasive grain such as CBN (Cubic Boron Nitride) into a gasket shape, and sintering and calcining the molded product, respectively, by means of a cylindrical grinding machine. 4a and the periphery 4b are processed to a predetermined size. However, the bonding material or the abrasive grains constituting the gasket blade 4 are not limited, and may be appropriately selected in accordance with the type of the workpiece to be cut.
環形的薄板6是以從SUS等的金屬形成，限定薄板6的外圍6b的外徑是形成比限定墊圈刀刃4的外圍4b的外徑小但比限定內周圍4a的內徑大，環形的薄板6的安裝孔(開口部)6a是形成與墊圈刀刃4的內徑相等或比內徑小的尺寸。本實施形態中，安裝孔6a的直徑是形成比限定墊圈刀刃4的內周圍4a的內徑小。 The annular thin plate 6 is formed of a metal such as SUS, and the outer diameter of the outer periphery 6b defining the thin plate 6 is formed to be smaller than the outer diameter of the outer periphery 4b defining the gasket blade 4 but larger than the inner diameter defining the inner periphery 4a, and the annular thin plate The mounting hole (opening) 6a of 6 is formed to have a size equal to or smaller than the inner diameter of the washer blade 4. In the present embodiment, the diameter of the attachment hole 6a is smaller than the inner diameter of the inner periphery 4a defining the gasket blade 4.
環形的薄板6雖是以金屬形成為佳，但不限於此，例如也可以硬質樹脂等形成。切削刃2是構成在墊圈刀刃4的一側面黏著環形的薄板6使得墊圈刀刃4的中心軸與環形的薄板6的中心軸重疊。可使用的黏著劑雖不加以限制，但例如可以使用環氧樹脂系的黏著劑。 The annular thin plate 6 is preferably formed of a metal, but is not limited thereto. For example, it may be formed of a hard resin or the like. The cutting edge 2 is a thin plate 6 which is formed to be bonded to one side of the gasket blade 4 so that the central axis of the gasket blade 4 overlaps with the central axis of the annular thin plate 6. Although the adhesive which can be used is not limited, for example, an epoxy resin adhesive can be used.
本實施形態的切削刃2雖是在墊圈刀刃4的 一側面黏著環形的薄板6所構成，但也可以在墊圈刀刃4的兩側面使中心軸彼此一致地黏著兩片環形的薄板6。 The cutting edge 2 of the present embodiment is at the washer blade 4 One side is bonded to the annular thin plate 6, but it is also possible to adhere the two annular thin plates 6 to each other on the both side faces of the washer blade 4 so that the central axes coincide with each other.
接著，參閱第2圖，針對使用上述切削刃2的切削裝置12說明。切削裝置12具備支撐切削裝置12之各構造部份的底座14。在底座14的上方，設有包覆底座的外裝蓋16。 Next, referring to Fig. 2, a description will be given of a cutting device 12 using the above-described cutting edge 2. The cutting device 12 is provided with a base 14 that supports each structural portion of the cutting device 12. An outer cover 16 covering the base is provided above the base 14.
在外裝蓋16的內側形成有空間，收容包括上述切削刃2的切削單元18。切削單元18是藉未圖示的切削單元移動機構在Y軸方向(分度傳動方向)移動。 A space is formed inside the exterior cover 16, and the cutting unit 18 including the cutting edge 2 is accommodated. The cutting unit 18 is moved in the Y-axis direction (index driving direction) by a cutting unit moving mechanism (not shown).
在切削單元18的下方設有保持晶圓等的被加工物的夾具台20。夾具台20是藉未圖示的夾具台移動機構在X軸方向(加工傳動方向)移動，藉著旋轉機構在與垂直方向(Z軸方向)平行的轉軸周圍旋轉。 A jig table 20 that holds a workpiece such as a wafer is provided below the cutting unit 18. The jig table 20 is moved in the X-axis direction (machining drive direction) by a jig table moving mechanism (not shown), and is rotated around a rotating shaft parallel to the vertical direction (Z-axis direction) by a rotating mechanism.
被加工物11代表性的有由矽等的半導體材料所構成圓盤狀的晶圓。該被加工物11的表面是例如藉排列成格子狀的分割預定線(直線)區劃成複數個區域，在各區域形成有IC、LSI等的設備。並且，被加工物11的材質，形狀不加以限制，例如陶瓷、樹脂、金屬等的材料構成的基板也可以使用作為被加工物11。 The workpiece 11 is typically a disk-shaped wafer composed of a semiconductor material such as tantalum. The surface of the workpiece 11 is divided into a plurality of regions by a predetermined dividing line (straight line) arranged in a lattice shape, and devices such as ICs and LSIs are formed in each region. Further, the material of the workpiece 11 is not limited in shape, and a substrate made of a material such as ceramic, resin, or metal may be used as the workpiece 11.
在底座14前方的角部設置有卡匣升降器22。在卡匣升降器22的上面載放有可收容複數被加工物11的卡匣23。卡匣升降器22是構成可升降，調整卡匣23的高度以適當進行被加工物11的搬出、搬入。 A cassette lifter 22 is provided at a corner in front of the base 14. A cassette 23 that can accommodate a plurality of workpieces 11 is placed on the upper surface of the cassette lifter 22. The cassette lifter 22 is configured to be movable up and down, and adjusts the height of the cassette 23 to appropriately carry out and carry in the workpiece 11.
外裝蓋16的前面16a設有成為使用介面的觸 控面板式的監視器25。該監視器25是將上述的切削刃18、切削單元移動機構、夾具台20、夾具台移動機構、旋轉機構、卡匣升降器22等一起連接在控制切削裝置2的各部的控制器。 The front face 16a of the exterior cover 16 is provided with a touch to be used as an interface Control panel type monitor 25. The monitor 25 is a controller that connects the above-described cutting edge 18, cutting unit moving mechanism, jig table 20, jig table moving mechanism, rotating mechanism, cassette lifter 22, and the like to each unit of the cutting device 2.
參閱第3圖時，表示顯示將切削刃2安裝在固定於主軸24前端之刀架26的樣子的分解透視圖。切削單元18包括可自由旋轉收容於主軸套19中的主軸24，在主軸24的前端部安裝刀架26並以螺帽34固定。 Referring to Fig. 3, an exploded perspective view showing the state in which the cutting edge 2 is attached to the holder 26 fixed to the front end of the main shaft 24 is shown. The cutting unit 18 includes a spindle 24 that is rotatably housed in the spindle housing 19, and the blade holder 26 is attached to the front end portion of the spindle 24 and fixed by a nut 34.
刀架26是由輪轂部(支撐軸)28及與輪轂部28一體形成的固定凸緣30所構成，在輪轂部28的外圍形成有外螺紋32。在固定凸緣30的外圍部形成有抵接切削刃2並支撐的環狀的支撐面30a。 The tool holder 26 is composed of a hub portion (support shaft) 28 and a fixing flange 30 integrally formed with the hub portion 28, and a male screw 32 is formed on the outer periphery of the hub portion 28. An annular support surface 30a that abuts against the cutting edge 2 and is supported is formed on a peripheral portion of the fixing flange 30.
在刀架26的輪轂部28插入切削刃2的安裝孔6a，並將拆裝凸緣36插入輪轂部28，將固定螺帽38栓鎖於形成在刀架26的輪轂部28的外螺紋32後緊固，藉此將切削刃2如第4圖表示，以固定凸緣30的支撐面30a和拆裝凸緣36的抵接面36b從兩側夾持安裝於主軸24的前端部。 The mounting hole 6a of the cutting edge 2 is inserted into the hub portion 28 of the holder 26, and the detachable flange 36 is inserted into the hub portion 28, and the fixing nut 38 is latched to the external thread 32 formed in the hub portion 28 of the holder 26. After the fastening, the cutting edge 2 is shown in Fig. 4, and the support surface 30a of the fixing flange 30 and the abutting surface 36b of the detachable flange 36 are sandwiched and attached to the front end portion of the main shaft 24 from both sides.
將切削刃2安裝在主軸24的前端部之後，例如以高速旋轉的切削刃2切削保持於刀架20的修整板，藉此將墊圈刀刃4的外圍4b整形成正圓為佳。 After the cutting edge 2 is attached to the front end portion of the main shaft 24, for example, the cutting edge 2 that rotates at a high speed is cut and held by the dressing plate of the tool holder 20, whereby the outer periphery 4b of the washer blade 4 is preferably formed into a perfect circle.
根據上述實施形態的切削刃2時，由於是將構成環形的薄板6的安裝孔6a嵌合在刀架26的輪轂部30，因此在切削刃2安裝於刀架26時可高精度形成安裝 孔6a的內徑。又，切削刃2的安裝孔6a是形成在環形的薄板6，因此從安裝孔不會有磨粒的突出。 According to the cutting edge 2 of the above-described embodiment, since the attachment hole 6a of the annular thin plate 6 is fitted to the hub portion 30 of the holder 26, the cutting edge 2 can be mounted with high precision when attached to the holder 26. The inner diameter of the hole 6a. Further, since the mounting hole 6a of the cutting edge 2 is formed in the annular thin plate 6, there is no protrusion of the abrasive grains from the mounting hole.
2‧‧‧切削刃 2‧‧‧ cutting edge
4‧‧‧環狀刃(墊圈刀刃) 4‧‧‧Ring edge (washer blade)
4a‧‧‧墊圈刀刃的內周圍 4a‧‧‧The inner circumference of the washer blade
4b‧‧‧墊圈刀刃的外圍 4b‧‧‧The periphery of the washer blade
6‧‧‧環形的薄板 6‧‧‧Circular sheet
6a‧‧‧薄板的內周圍 6a‧‧‧The inner circumference of the sheet
6b‧‧‧薄板的外圍 6b‧‧‧The periphery of the sheet
Claims (2)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015126617A JP2017007057A (en) | 2015-06-24 | 2015-06-24 | Cutting blade and mounting structure of cutting blade |
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| Publication Number | Publication Date |
|---|---|
| TW201706077A true TW201706077A (en) | 2017-02-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW105114748A TW201706077A (en) | 2015-06-24 | 2016-05-12 | Cutting blade and installation structure for the cutting blade capable of machining an inner diameter with a high accuracy and extending the lifetime of a blade mount |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2017007057A (en) |
| KR (1) | KR20170000770A (en) |
| CN (1) | CN106273005A (en) |
| TW (1) | TW201706077A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI731325B (en) * | 2018-04-19 | 2021-06-21 | 日商東京精密股份有限公司 | Hub type blade and hub type blade manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6965805B2 (en) * | 2018-03-29 | 2021-11-10 | ブラザー工業株式会社 | Liquid discharge head |
| JP2020171990A (en) * | 2019-04-11 | 2020-10-22 | 株式会社ディスコ | Blade with base |
| CN112466785B (en) * | 2020-11-23 | 2022-09-02 | 江西世星科技有限公司 | Integrated circuit V-shaped groove grooving machine |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6042461A (en) * | 1998-11-10 | 2000-03-28 | Matweld, Inc. | Mounting assembly |
| JP2002066933A (en) | 2000-08-28 | 2002-03-05 | Okamoto Machine Tool Works Ltd | Grinding wheel for grooving, method of manufacturing the same and method of grinding workpiece |
| JP2002192469A (en) | 2000-12-27 | 2002-07-10 | Allied Material Corp | Super abrasive grain sharp-edged cutting grinding wheel |
| JP2008302435A (en) * | 2007-06-05 | 2008-12-18 | Torisutaa:Kk | Cutting blade and blade manufacturing method |
| JP5199777B2 (en) * | 2008-08-04 | 2013-05-15 | 株式会社ディスコ | Cutting equipment |
| JP5388053B2 (en) * | 2008-12-10 | 2014-01-15 | 株式会社ツールバンク | Dicing blade |
| JP5645692B2 (en) * | 2011-02-08 | 2014-12-24 | 株式会社ディスコ | Processing method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI731325B (en) * | 2018-04-19 | 2021-06-21 | 日商東京精密股份有限公司 | Hub type blade and hub type blade manufacturing method |
| TWI745262B (en) * | 2018-04-19 | 2021-11-01 | 日商東京精密股份有限公司 | Hub type blade |
| TWI745263B (en) * | 2018-04-19 | 2021-11-01 | 日商東京精密股份有限公司 | Hub type blade |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017007057A (en) | 2017-01-12 |
| CN106273005A (en) | 2017-01-04 |
| KR20170000770A (en) | 2017-01-03 |
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