TWI683735B - Abutment blade - Google Patents
Abutment blade Download PDFInfo
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- TWI683735B TWI683735B TW105113458A TW105113458A TWI683735B TW I683735 B TWI683735 B TW I683735B TW 105113458 A TW105113458 A TW 105113458A TW 105113458 A TW105113458 A TW 105113458A TW I683735 B TWI683735 B TW I683735B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/16—Bushings; Mountings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
本發明提供一種防止黏著劑溢出的附基台刀片。 The invention provides an abutment blade for preventing adhesive from overflowing.
本發明提供的是一種安裝在旋轉軸上做使用之切割用的附基台刀片,其具備在中央形成有開口部之圓盤狀的基台,和固定在基台的第1面側之環狀的刀片;基台上形成有從第1面突出之環狀的第1凸部,和比第1凸部在徑向更內側,並且從第1面突出之第2凸部,刀片則是透過黏著劑而黏著在基台的第2凸部。 The invention provides a blade for abutment mounted on a rotating shaft for use, which has a disc-shaped abutment with an opening formed in the center and a ring fixed on the first surface side of the abutment Shaped blade; a ring-shaped first convex portion protruding from the first surface and a second convex portion radially inward than the first convex portion and protruding from the first surface are formed on the base, the blade is Adhere to the second convex part of the abutment with adhesive.
Description
本發明涉及一種安裝在旋轉軸上做使用之切割用的附基台刀片。 The invention relates to an abutment blade for cutting which is installed on a rotating shaft for use.
形成有IC、LSI等之電子電路的半導體晶圓是,例如,沿著分割預定線(切割道)被切割而分割成複數個晶片。於此切割作業中使用的刀片已知的有,以鎳等之鍍層固著磨粒的電鑄輪轂型刀片(Hub Blade),和以樹脂等之結合材(黏結材)固結磨粒的環狀刀片等。 A semiconductor wafer on which electronic circuits such as ICs and LSIs are formed is, for example, diced along a planned dividing line (dicing line) and divided into a plurality of wafers. The blades used in this cutting operation are known as an electroformed hub blade (Hub Blade) in which abrasive particles are fixed by a nickel or other plating layer, and a ring in which abrasive particles are fixed by a bonding material (bonding material) such as resin Shaped blades, etc.
上述電鑄輪轂型刀片通常是由鋁等所構成之圓盤狀的基台與刀片一體地形成,並且透過對應於基台之專用安裝座而裝設於構成旋轉軸的心軸上。另一方面,未與基台形成一體化的環狀刀片則是在心軸上安裝成以2個治具夾住的狀態。 The above-mentioned electroformed hub-type blade is usually formed by a disc-shaped base made of aluminum or the like integrally with the blade, and is mounted on a mandrel constituting a rotating shaft through a dedicated mounting seat corresponding to the base. On the other hand, the ring blade that is not integrated with the base is mounted on the mandrel so that it is sandwiched between two jigs.
因此,例如,在將電鑄輪轂型刀片置換成環狀刀片等的情形中,必須將固定在心軸上的安裝座等一併置換,有作業性差的問題。相對於此,近年來,已有將環狀 刀片黏著於圓盤狀基台的附基台刀片被提出(例如,參照專利文獻1)。 Therefore, for example, in the case of replacing the electroformed hub-type blade with a ring-shaped blade, etc., it is necessary to replace the mounting seat fixed to the mandrel, etc., which has a problem of poor workability. In contrast, in recent years, An abutment blade with a blade attached to a disc-shaped abutment has been proposed (for example, refer to Patent Document 1).
【專利文獻1】特開2012-135833号 [Patent Literature 1] Japanese Patent Laid-Open No. 2012-135833
然而,在上述的附基台刀片中,因為基台與刀片是用黏著劑黏結在一起的,所以會有黏著劑溢出基台外側而附著在刀片上的情形。黏著劑如果從基台溢出,不僅外觀惡化,也會有對加工精度造成影響之虞,因此,黏著劑溢出的附基台刀片會立即被廢棄。像這樣地,在習知的附基台刀片中,存在著無法充分地提高成品率的問題。 However, in the above-mentioned blade with abutment, since the abutment and the blade are bonded together with an adhesive, the adhesive may overflow the outside of the abutment and adhere to the blade. If the adhesive overflows from the abutment, not only the appearance deteriorates, but also the processing accuracy may be affected. Therefore, the abutment blade with the adhesive overflowed will be immediately discarded. As described above, in the conventional abutment blade, there is a problem that the yield cannot be sufficiently improved.
本發明即是有鑑於相關的問題點而完成的,其目的在於提供一種防止黏著劑溢出的附基台刀片。 The present invention was completed in view of the related problems, and its object is to provide an abutment blade that prevents the adhesive from overflowing.
依據本發明,所提供的附基台刀片是一種安裝於旋轉軸上而使用之切割用的附基台刀片,其特徵在於具備:於中央形成有開口部之圓盤狀基台,和固定於該基台之第1面側的環狀刀片;該基台上形成有從該第1面突出之環狀的第1凸部,和比該第1凸部在徑向更內側從該第1面突出之第2凸部,且該刀片是透過黏著劑而黏著在該基台之該第2凸部。 According to the present invention, the provided abutment blade is a cutting abutment blade used for mounting on a rotating shaft, and is characterized by comprising: a disc-shaped abutment with an opening formed in the center, and a fixed A ring-shaped blade on the first surface side of the base; the ring-shaped first convex portion protruding from the first surface is formed on the base, and the first convex portion is radially inward of the first convex portion from the first The second convex portion protruding from the surface, and the blade is adhered to the second convex portion of the base through an adhesive.
本發明中,該刀片的外周緣比該基台的外周緣位在徑向更外側,且該刀片之內周緣的直徑宜與該基台之該開口部的直徑在同等以上。 In the present invention, the outer peripheral edge of the blade is located radially outward of the outer peripheral edge of the base, and the diameter of the inner peripheral edge of the blade is preferably equal to or larger than the diameter of the opening of the base.
此外,在本發明中,於該旋轉軸的端部設有刀片安裝座,該刀片安裝座具有圓盤狀的凸緣部,和從該凸緣部的中央突出的支持軸部;並且宜在使該基台之該開口部卡合至該刀片安裝座之該支持軸部的狀態下,將固定螺帽緊固於該支持軸部,藉此,該刀片被該基台之該第1凸部與形成於該刀片安裝座之該凸緣部的環狀凸部夾持住。 In addition, in the present invention, a blade mounting seat is provided at an end of the rotating shaft, and the blade mounting seat has a disc-shaped flange portion, and a support shaft portion protruding from the center of the flange portion; In a state where the opening of the base is engaged with the support shaft of the blade mount, the fixing nut is fastened to the support shaft, whereby the blade is projected by the first protrusion of the base The part is clamped with the annular convex part formed in the flange part of the blade mounting seat.
本發明之附基台刀片具有圓盤狀的基台,和固定於基台之第1面側的環狀刀片;基台上形成有從第1面突出之環狀的第1凸部,和比第1凸部在徑向更內側從第1面突出之第2凸部,而且因為刀片6是對著位在第1凸部內側之第2凸部形成黏著,所以不會有黏著劑超過第1凸部而溢到基台外側的情事。
The base-attached blade of the present invention has a disc-shaped base, and a ring-shaped blade fixed to the first surface side of the base; a ring-shaped first convex portion protruding from the first surface is formed on the base, and The second convex portion that protrudes from the first surface radially inward of the first convex portion, and because the
2‧‧‧附基台刀片 2‧‧‧Abutment blade
4‧‧‧基台 4‧‧‧Abutment
4a‧‧‧第1面 4a‧‧‧The first side
4b‧‧‧第2面 4b‧‧‧The second side
4c‧‧‧開口部 4c‧‧‧Opening
4d‧‧‧第1凸部 4d‧‧‧1st convex part
4e‧‧‧第2凸部 4e‧‧‧2nd convex part
4f‧‧‧前端面 4f‧‧‧Front face
4g‧‧‧前端面 4g‧‧‧Front face
4h‧‧‧外周緣 4h‧‧‧Outer rim
6‧‧‧刀片 6‧‧‧Blade
6a‧‧‧第1面 6a‧‧‧The first side
6b‧‧‧第2面 6b‧‧‧The second side
6c‧‧‧開口部 6c‧‧‧Opening
6d‧‧‧外周緣 6d‧‧‧Outer rim
12‧‧‧切割裝置 12‧‧‧Cutting device
14‧‧‧基台 14‧‧‧Abutment
16‧‧‧外罩 16‧‧‧Outer cover
18‧‧‧切割單元 18‧‧‧Cutting unit
20‧‧‧吸盤工作台 20‧‧‧Sucker table
22‧‧‧儲料盒升降台 22‧‧‧Storage box lifting table
24‧‧‧儲料盒 24‧‧‧Storage box
26‧‧‧監控器 26‧‧‧Monitor
32‧‧‧心軸(旋轉軸) 32‧‧‧Spindle (rotation axis)
34‧‧‧心軸套 34‧‧‧Sleeve
36‧‧‧墊圈 36‧‧‧washer
38‧‧‧螺栓 38‧‧‧bolt
40‧‧‧刀片安裝座 40‧‧‧Blade mounting seat
42‧‧‧凸緣部 42‧‧‧Flange
42a‧‧‧第1面 42a‧‧‧The first side
42b‧‧‧凸部 42b‧‧‧Convex
42c‧‧‧前端面 42c‧‧‧Front face
44‧‧‧凸起部(支持軸部) 44‧‧‧Bulge (support shaft)
44a‧‧‧外周面 44a‧‧‧Perimeter
46‧‧‧固定螺帽 46‧‧‧Fixed nut
46a‧‧‧開口部 46a‧‧‧Opening
11‧‧‧被加工物 11‧‧‧Worked
【圖1】模式性地顯示附基台刀片之構成例的分解斜視圖。 [Fig. 1] An exploded perspective view schematically showing a configuration example of a blade with an abutment.
【圖2】模式性地顯示附基台刀片之構成例的斷面圖。 [Fig. 2] A cross-sectional view schematically showing a configuration example of a blade with an abutment.
【圖3】模式性地顯示使用附基台刀片之切割裝置的構成例之斜視圖。 [Fig. 3] A perspective view schematically showing a configuration example of a cutting device using an abutment blade.
【圖4】模式性地顯示附基台刀片被安裝到切割單元的狀態之斜視圖。 [Fig. 4] A perspective view schematically showing a state in which a blade with an abutment is attached to a cutting unit.
【圖5】模式性地顯示安裝了附基台刀片的狀態之切割單元的部分斷面側面圖。 [Fig. 5] A partially sectional side view schematically showing the cutting unit with abutment blades installed.
參照所附圖示,就本發明之實施態樣進行說明。圖1是式性地顯示附基台刀片之構成例的分解斜視圖;圖2是模式性地顯示附基台刀片之構成例的斷面圖。 The embodiment of the present invention will be described with reference to the attached drawings. FIG. 1 is an exploded perspective view schematically showing a configuration example of an abutment blade; FIG. 2 is a cross-sectional view schematically showing a configuration example of an abutment blade.
如圖1及圖2所示,本實施態樣之附基台刀片2具有用鋁等構成的圓盤狀(圓環狀)的基台4。基台4有互相平行的第1面4a及第2面4b,在其中央則形成有將基台4從第1面4a貫通直到第2面4b的圓形開口部4c。
As shown in FIGS. 1 and 2, the base-attached
在基台4之外周緣4h附近的區域,設有從第1面4a突出之環狀的第1凸部4d。並且,比第1凸部4d在徑向更內側的區域上設有從第1面4a突出之環狀的第2凸部4e。第1凸部4d與第2凸部4e被配置成同心圓狀地環繞開口部4c。
An annular first
第1凸部4d的前端面4f及第2凸部4e的前端面4g,相對於第1面4a呈平行且平坦地形成。刀片6透過黏著劑等而黏著在第2凸部4e的前端面4g上。可以使用的黏著劑並無限制,但是最好使用例如,環氧樹脂系的黏著劑。另外,也可以將導電性的糊劑等當作黏著劑使用。另一方面,刀片6僅接觸到第1凸部4d的前端面4f,並未被黏著。
The
刀片6是在例如,金屬、陶瓷、樹脂等的結合材中,混合鑽石、CBN(立方氮化硼,Cubic Boron Nitride)等的磨粒,再形成圓盤狀(圓環狀)。
The
但是,構成刀片6的結合材和磨粒並無限制,結合材及磨粒是配合附基台刀片2的規格做選擇、變更的。
However, the bonding material and abrasive grains constituting the
刀片6有互相平行且平坦的第1面6a及第2面6b,在其中央則形成有將刀片6從第1面6a貫通直到第2面6b之圓形的開口部6c。在本實施態樣中,刀片6的第1面6a黏著於基台4之第2凸部4e,形成基台4之中心軸與刀片6之中心軸重疊的狀態。
The
而且,刀片6之外周緣6d的直徑比基台4之外周緣4h的直徑大。因此,如果將刀片6黏著到基台4,刀片6之外周緣6d就會位於比基台4之外周緣4h在徑向更外側的位置。也就是說,刀片6的外周部分會形成從基台4的外周緣4h在徑向往外突出的狀態。
Moreover, the diameter of the outer
另外,刀片6之開口部6c的直徑(內周緣的直徑),與基台4之開口部4c的直徑在同等以上。因此,對構成旋轉軸的心軸32(參照圖4、圖5等)安裝附基台刀片2時,心軸32與刀片6不會發生干擾。
The diameter of the
接著,將就使用上述之附基台刀片2的切割裝置進行說明。圖3是模式性地顯示使用附基台刀片2的切割裝置之構成例的斜視圖。如圖3所示,切割裝置12具有支持各構造之基台14。在基台14的上方設有覆蓋基台14的外罩16。
Next, the cutting device using the
在外罩16的內側形成有空間,收容著包含上述之附基台刀片2的切割單元18。切割單元18藉著切割單元移動機構(未圖示出)而在前後方向(Y軸方向,分度進給方
向)上移動。
A space is formed inside the
在切割單元18的下方設有保持被加工物11之吸盤工作台20。吸盤工作台20藉著吸盤工作台移動機構(未圖示出)而在左右方向(X軸方向,加工進給方向)上移動,並藉旋轉機構(未圖示出)而在平行於鉛直方向(Z軸方向)的旋轉軸周圍旋轉。
Below the cutting
被加工物11代表性的是矽等之半導體材料構成的圓盤狀的晶圓。此被加工物11的表面是以,例如,配列成格子狀的分割預定線(切割道)區劃成複數個區域,各區域上則形成有稱做IC、LSI等之電子電路。再者,對於被加工物11的材質、形狀等並無限制,例如,也可以將陶瓷、樹脂、金屬等的材料形成的基板當做被加工物11來使用。
The
在基台14前方的角部設置著儲料盒升降台22。在儲料盒升降台22的上面載置著能夠收容複數個被加工物11的儲料盒24。儲料盒升降台22裝配成能夠升降,以便將儲料盒24的高度(鉛直方向的位置)調整成可以適當地將被加工物11搬出、搬入。
At the corner in front of the
外罩6的前面6a上設有構成使用者介面的觸控面板式監控器26。此監控器26與上述之切割單元18、切割單元移動機構、吸盤工作台20、吸盤工作台移動機構、旋轉機構、儲料盒升降台22等,一起被連接到控制切割裝置2的各部分之控制單元(未圖示出)。
A
圖4是模式性地顯示附基台刀片2被安裝到切割
單元18的狀態之斜視圖;圖5則模式性地顯示安裝了附基台刀片2的狀態之切割單元18的部分斷面側面圖。如圖4及圖5所示,切割單元18具有繞Y軸旋轉的心軸(旋轉軸)32。
FIG. 4 schematically shows that the
此心軸32被收容在筒狀的心軸套34中。心軸32的前端部(一端部)露出心軸套34的外部,墊圈36、螺栓38等則透過刀片安裝座40而安裝在此心軸32的前端部。另一方面,心軸32的另一端側(基端側)連結至用來使心軸32旋轉的馬達(未圖示出)。
This
刀片安裝座40包含在徑向往外擴展的凸緣部42,和從凸緣部42之第1面42a的中央突出之凸起部(支持軸部)44。在第1面42a之外周緣附近的區域,設有從第1面42a突出之環狀的凸部42b。此凸部42b是對應於附基台刀片2之第1凸部4d的位置及形狀地形成。而且,凸部42b的前端面42c是相對於第1面42a呈平行且平坦地形成。
The
凸起部44形成圓筒狀,在其前端側的外周面44a設有螺紋。使這個凸起部44通過附基台刀片2的開口部4c及開口部6c(使其卡合),藉以將附基台刀片2安裝到刀片安裝座40。
The
在將附基台刀片2安裝(卡合)至刀片安裝座40的狀態下,使固定螺帽46緊固於凸起部44。固定螺帽46上形成有對應於凸起部44的直徑之圓形的開口部46a。在開口部46a的內周面則設有對應於凸起部44之外周面44a上所形成的螺紋的螺紋槽。
In a state where the
如果將固定螺帽46緊固於凸起部44,固定螺帽
46就會接觸附基台刀片2之第2面4b,附基台刀片2則被推向刀片安裝座40的凸緣部42。其結果,刀片6的第2面6b接觸到凸緣部42的前端面42c,刀片6被基台4之第1凸部4d與凸緣部42之凸部42b夾持、固定住。
If the fixing
如上所述,本實施態樣之附基台刀片2具有圓盤狀的基台4,和固定在基台4之第1面4a側的環狀刀片6;基台4上形成有從第1面4a突出之環狀的第1凸部4d,和比第1凸部4d在徑向更內側且從第1面4a突出之環狀的第2凸部4e;因為刀片6是對著位在第1凸部4d的內側之第2凸部4e被黏著,所以黏著劑不會有超出第1凸部4d而溢出達到基台4的外側之情事。
As described above, the base-attached
而且,在本實施態樣之附基台刀片2中,因為刀片6之開口部6c的直徑(內周緣的直徑),與基台4之開口部4c的直徑在同等以上,所以對構成旋轉軸之心軸32安裝附基台刀片2時,也不會有心軸32與刀片6產生干擾的情事。
Moreover, in the blade with
此外,在本實施態樣之附基台刀片2中,由於是利用基台4之第1凸部4d和刀片安裝座40(凸緣部42)的凸部42b來夾持、固定刀片6,因而可以抑制刀片6的振動等而高度地維持加工精度。
In addition, in the blade with
另外,本發明並不限定於上述實施態樣的記載,可以做各種變更再實施。例如,在上述實施態樣之附基台刀片2中,雖然對基台4設了供黏住刀片6的環狀的第2凸部4e,但是這個第2凸部4e可以未必是環狀的。第2凸部4e只要至少是形成在與夾持(固定)用的第1凸部4d分離的位置之凸部即可。
In addition, the present invention is not limited to the description of the above-mentioned embodiments, and can be implemented with various changes. For example, in the blade with
此外,上述實施態樣的構造、方法等,只要不脫離本發明之目的的範圍,可以做適當變更再實施。 In addition, as long as the structure, method, etc. of the above-described embodiments do not deviate from the scope of the object of the present invention, appropriate changes may be made and implemented.
2‧‧‧附基台刀片 2‧‧‧Abutment blade
4‧‧‧基台 4‧‧‧Abutment
4a‧‧‧第1面 4a‧‧‧The first side
4b‧‧‧第2面 4b‧‧‧The second side
4c‧‧‧開口部 4c‧‧‧Opening
4d‧‧‧第1凸部 4d‧‧‧1st convex part
4e‧‧‧第2凸部 4e‧‧‧2nd convex part
4f‧‧‧前端面 4f‧‧‧Front face
4g‧‧‧前端面 4g‧‧‧Front face
4h‧‧‧外周緣 4h‧‧‧Outer rim
6‧‧‧刀片 6‧‧‧Blade
6a‧‧‧第1面 6a‧‧‧The first side
6b‧‧‧第2面 6b‧‧‧The second side
6c‧‧‧開口部 6c‧‧‧Opening
6d‧‧‧外周緣 6d‧‧‧Outer rim
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JP2015-111433 | 2015-06-01 | ||
JP2015111433A JP6494429B2 (en) | 2015-06-01 | 2015-06-01 | Blade with base |
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TW201700248A TW201700248A (en) | 2017-01-01 |
TWI683735B true TWI683735B (en) | 2020-02-01 |
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TW105113458A TWI683735B (en) | 2015-06-01 | 2016-04-29 | Abutment blade |
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KR (1) | KR102439403B1 (en) |
CN (1) | CN106182476A (en) |
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JP6940295B2 (en) * | 2017-04-27 | 2021-09-22 | 株式会社東京精密 | Cutting blade, hub type blade and cutting blade blade manufacturing method |
JP6940297B2 (en) * | 2017-04-28 | 2021-09-22 | 株式会社東京精密 | Hub type blade mounting structure and board cutting device |
JP6612372B2 (en) * | 2018-01-30 | 2019-11-27 | Towa株式会社 | Flange replacement mechanism, cutting device, flange replacement method, and method of manufacturing a cut product |
TWI731325B (en) * | 2018-04-19 | 2021-06-21 | 日商東京精密股份有限公司 | Hub type blade and hub type blade manufacturing method |
JP7184460B2 (en) * | 2018-12-04 | 2022-12-06 | 株式会社ディスコ | blade with base |
JP7157674B2 (en) * | 2019-01-30 | 2022-10-20 | 株式会社ディスコ | Blade exchange unit |
ES2778550B2 (en) * | 2019-02-08 | 2020-12-17 | Boada Germans Sa | ROTARY BLADE ASSEMBLY APPLICABLE TO TILE CUTTING MACHINES |
JP2020171991A (en) * | 2019-04-11 | 2020-10-22 | 株式会社ディスコ | Blade with base |
JP2020171990A (en) * | 2019-04-11 | 2020-10-22 | 株式会社ディスコ | Blade with base |
JP7282460B2 (en) * | 2019-04-11 | 2023-05-29 | 株式会社ディスコ | blade with base |
JP7383332B2 (en) * | 2019-04-11 | 2023-11-20 | 株式会社ディスコ | blade with base |
JP2021065980A (en) * | 2019-10-24 | 2021-04-30 | 株式会社ディスコ | Blade with base and cutting device |
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KR20160141655A (en) | 2016-12-09 |
TW201700248A (en) | 2017-01-01 |
KR102439403B1 (en) | 2022-09-01 |
JP6494429B2 (en) | 2019-04-03 |
CN106182476A (en) | 2016-12-07 |
JP2016221637A (en) | 2016-12-28 |
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