TW202128357A - Blade with base in which a base and a blade are firmly coupled with each other - Google Patents
Blade with base in which a base and a blade are firmly coupled with each other Download PDFInfo
- Publication number
- TW202128357A TW202128357A TW110102288A TW110102288A TW202128357A TW 202128357 A TW202128357 A TW 202128357A TW 110102288 A TW110102288 A TW 110102288A TW 110102288 A TW110102288 A TW 110102288A TW 202128357 A TW202128357 A TW 202128357A
- Authority
- TW
- Taiwan
- Prior art keywords
- blade
- base
- adhesive
- outer peripheral
- convex portion
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
- B24B45/006—Quick mount and release means for disc-like wheels, e.g. on power tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Dicing (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
本發明關於使用於切削被加工物之附帶基台之刀片。The present invention relates to inserts with abutments used for cutting workpieces.
藉由將形成有多個IC(Integrated Circuit,積體電路)、LSI(Large Scale Integration,大型積體電路)等元件之半導體晶圓進行分割,而製造分別具備元件之多個元件晶片。並且,利用由樹脂而成之密封材(封膜樹脂)被覆安裝於基板上之多個元件晶片,將所形成之封裝基板進行分割,藉此製造分別具備已被封膜樹脂覆蓋之元件晶片之多個封裝元件。元件晶片或封裝元件被裝配於以行動電話或個人電腦為代表之各種電子設備。By dividing a semiconductor wafer on which a plurality of IC (Integrated Circuit), LSI (Large Scale Integration) and other elements are formed, a plurality of element chips each equipped with elements are manufactured. In addition, a sealing material (sealing resin) made of resin is used to coat a plurality of element chips mounted on the substrate, and the formed package substrate is divided to produce each of the element chips covered by the sealing film resin. Multiple package components. Component chips or packaged components are assembled in various electronic devices represented by mobile phones or personal computers.
在半導體晶圓或封裝基板的分割中,能使用切削裝置。切削裝置具備:保持台,其保持被加工物;及切削單元,其以環狀的刀片切削被加工物。藉由使刀片旋轉並切入被保持台保持之被加工物,而切削、分割被加工物。In the division of semiconductor wafers or package substrates, a cutting device can be used. The cutting device includes a holding table that holds the workpiece, and a cutting unit that cuts the workpiece with a ring-shaped blade. By rotating the blade to cut into the workpiece held by the holding table, the workpiece is cut and divided.
作為切削被加工物所使用之刀片,能使用輪轂型刀片或墊圈型刀片,所述輪轂型刀片具備藉由鍍鎳等而固定由金剛石等而成之磨粒的切削刀刃,所述墊圈型刀片係由環狀的切削刀刃所組成,所述環狀的切削刀刃係藉由由金屬、陶瓷、樹脂等而成之黏合材固定磨粒而成。在切削被加工物時,係因應被加工物的材質等而適宜選擇適當的刀片。As the blade used for cutting the workpiece, a hub-type blade or a washer-type blade can be used. The hub-type blade is provided with a cutting edge for fixing abrasive grains made of diamond or the like by nickel plating or the like. The washer-type blade It is composed of a ring-shaped cutting blade, which is formed by fixing abrasive grains with a bonding material made of metal, ceramic, resin, etc. When cutting a workpiece, an appropriate insert should be appropriately selected according to the material of the workpiece, etc.
輪轂型刀片係圓盤狀的基台與沿著基台的外周緣所形成的切削刀刃成為一體所構成,並被裝設於刀片安裝件,所述刀片安裝件固定於切削單元所具備之旋轉軸(主軸)的前端部。並且,墊圈型刀片係藉由刀片安裝件所具備之凸緣部(固定凸緣)、及與固定凸緣一起夾住刀片之裝卸凸緣,而被裝設於旋轉軸的前端部。The hub-shaped blade is composed of a disc-shaped base and a cutting edge formed along the outer periphery of the base as one body, and is mounted on a blade mount that is fixed to the rotation of the cutting unit The front end of the shaft (spindle). In addition, the washer-type blade is attached to the tip of the rotating shaft by the flange portion (fixed flange) provided by the blade mount and the attachment and detachment flange that clamps the blade together with the fixed flange.
如上述,輪轂型刀片與墊圈型刀片對於旋轉軸的裝設方法不同,固定於旋轉軸之刀片安裝件的形狀、尺寸等也會因刀片的種類而異。因此,例如在將裝設於旋轉軸的前端部之輪轂型刀片交換成墊圈型刀片時,也需要交換刀片安裝件,刀片的交換作業變得繁雜。As mentioned above, the hub-type blade and the washer-type blade have different installation methods for the rotating shaft, and the shape and size of the blade mount fixed to the rotating shaft will also vary depending on the type of blade. Therefore, for example, when exchanging a hub-type blade mounted on the front end of the rotating shaft with a washer-type blade, the blade mount must also be exchanged, and the blade replacement operation becomes complicated.
因此,近年來提出一種在圓盤狀的基台上接著墊圈型刀片之附帶基台之刀片(例如,參考專利文獻1)。若使用此附帶基台之刀片,則墊圈型刀片能裝設於輪轂型刀片用的刀片安裝件,可使刀片的交換作業簡易化。 [習知技術文獻] [專利文獻]Therefore, in recent years, a base-attached blade in which a washer-type blade is attached to a disk-shaped base has been proposed (for example, refer to Patent Document 1). If this blade with a base is used, the washer-type blade can be attached to the blade mount for the hub-type blade, which simplifies the replacement of the blade. [Literature Technical Literature] [Patent Literature]
[專利文獻1]日本特開2012-135833號公報[Patent Document 1] JP 2012-135833 A
[發明所欲解決的課題] 上述的附帶基台之刀片係藉由使個別形成之基台與刀片一體化而製造。具體而言,在基台的一側的面塗布接著劑後,使基台的一側的面與刀片的一側的面相向,並藉由接著劑而使基台與刀片互相貼合。藉此,將基台與刀片接合並一體化。[The problem to be solved by the invention] The above-mentioned blade with abutment is manufactured by integrating a separately formed abutment and the blade. Specifically, after the adhesive is applied to the one side surface of the base, the one side surface of the base is opposed to the one side surface of the blade, and the base and the blade are attached to each other by the adhesive. Thereby, the base and the blade are joined and integrated.
在經過上述的步驟所得之附帶基台之刀片中,雖僅將刀片貼附於基台的一側的面,但在此狀態下會有基台與刀片的接合的強度不充分之情形。尤其,在基台固定厚的刀片之情形中,常難以僅藉由塗布於基台的一側的面之接著劑而使基台與刀片緊固地一體化。In the blade with abutment obtained through the above steps, although the blade is only attached to one surface of the abutment, in this state, the strength of the joint between the abutment and the blade may be insufficient. In particular, when a thick blade is fixed to the base, it is often difficult to integrate the base and the blade tightly only by an adhesive applied to one side of the base.
本發明係鑑於此問題而完成者,其目的在於提供緊固地結合基台與刀片之附帶基台之刀片。The present invention was made in view of this problem, and its object is to provide a blade with a base that firmly connects the base and the blade.
[解決課題的技術手段] 根據本發明的一態樣,提供一種附帶基台之刀片,其具有:圓盤狀的基台、及在中央具備開口部之環狀的刀片,該基台具有從該基台的正面突出之環狀的凸部,該刀片具有從在該開口部露出之側面朝向外周緣側形成的凹部,在該凸部嵌入該開口部之狀態下,該基台與該刀片透過附著於該基台的該正面之第一接著劑而貼合,並藉由填充於該凹部且滲透至該凸部與該側面的間隙之第二接著劑而接合。[Technical means to solve the problem] According to one aspect of the present invention, there is provided a blade with a base, which has: a disc-shaped base, and a ring-shaped blade with an opening in the center, the base having a blade protruding from the front of the base A ring-shaped convex portion, the blade has a concave portion formed from the side exposed at the opening toward the outer periphery side, and in a state where the convex portion is fitted into the opening, the base and the blade pass through the base attached to the base. The first adhesive on the front surface is attached and joined by a second adhesive filled in the concave portion and penetrating into the gap between the convex portion and the side surface.
此外,較佳為在該基台的該正面側之中未形成該凸部之區域,形成有填充該第一接著劑的槽。並且,較佳為該第一接著劑的材料與該第二接著劑的材料相同、或該第二接著劑的黏度低於該第一接著劑。In addition, it is preferable that a groove filled with the first adhesive is formed in a region where the convex portion is not formed in the front side of the base. Furthermore, it is preferable that the material of the first adhesive is the same as the material of the second adhesive, or the viscosity of the second adhesive is lower than that of the first adhesive.
[發明功效] 在本發明的一態樣之附帶基台之刀片中,基台與刀片透過附著於基台的正面之第一接著劑而貼合,並藉由填充於刀片的凹部且滲透至基台的凸部與刀片的側面之間隙之第二接著劑而接合。藉此,能獲得緊固地結合基台與刀片之附帶基台之刀片。[Efficacy of invention] In the blade with abutment in one aspect of the present invention, the abutment and the blade are attached through the first adhesive attached to the front surface of the abutment, and are filled into the concave portion of the blade and penetrate into the convexity of the abutment. The part and the side surface of the blade are joined by a second adhesive in the gap. Thereby, the blade with the abutment which firmly connects the abutment and the blade can be obtained.
以下,參考隨附圖式說明本發明的實施方式。首先,針對本實施方式之附帶基台之刀片的構成例進行說明。圖1為表示附帶基台之刀片2之分解立體圖。Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. First, a configuration example of the blade with a base of this embodiment will be described. Fig. 1 is an exploded perspective view showing a
附帶基台之刀片2具備:圓盤狀的基台4與環狀的刀片6。基台4例如是由鋁合金等金屬而成,並具備互相大致平行之第一面(正面)4a及第二面(背面)4b、與外周緣(外周面)4c。並且,在基台4的中央設置有將基台4從第一面4a貫通至第二面4b之圓柱狀的開口部4d。The
在基台4的第一面4a側,係以包圍開口部4d之方式設置有從第一面4a往刀片6側突出之環狀的凸部4e。凸部4e係沿著開口部4d的輪廓且被形成為預定的寬度,並具備與第一面4a大致垂直之外周面4f。On the
刀片6是以由金屬、陶瓷、樹脂等而成之黏合材固定由金剛石、立方晶氮化硼(cBN:cubic Boron Nitride)等而成之磨粒,藉此被形成為環狀。此外,可因應附帶基台之刀片2的規格等而適宜選擇刀片6所含之磨粒或黏合材的材質。The
刀片6具備互相大致平行之第一面(正面)6a及第二面(背面)6b、以及與第一面6a及第二面6b連接之外周緣(外周面)6c。並且,在刀片6的中央設置有將刀片6從第一面6a貫通至第二面6b之圓柱狀的開口部6d。開口部6d劃定在開口部6d露出之刀片6的側面(內周面)6e。The
並且,刀片6具有多個凹部6f,所述凹部6f係從刀片6的側面6e朝向外周緣6c側形成。多個凹部6f係以從刀片6的第一面6a到達第二面6b之方式形成,並沿著側面6e的圓周方向大致等間隔地配置。圖1中表示在刀片6形成有八個凹部6f的例子。In addition, the
結合基台4與刀片6,藉此獲得基台4與刀片6已一體化之附帶基台之刀片2。圖2係表示結合基台4與刀片6的態樣之剖面圖。The
結合基台4與刀片6時,首先,使第一接著劑(貼合用接著劑)附著於基台4的第一面4a。具體而言,使第一接著劑附著於基台4第一面4a之中位於比凸部4e更靠基台4的半徑方向外側之區域。例如,可在第一面4a黏貼薄片狀的接著劑(接著薄片),也可在第一面4a塗布環氧樹脂系的接著劑等。此外,也可使第一接著劑附著於刀片6。When joining the
其後,使基台4的第一面4a與刀片6的第一面6a相向,透過第一接著劑使基台4與刀片6貼合。藉此,將基台4與刀片6接合。Thereafter, the
於此,基台4的凸部4e具有與刀片6的開口部6d對應之形狀。具體而言,凸部4e係以下述方式形成:凸部4e的外周面4f的直徑與刀片6的側面6e的直徑大致相等,且外周面4f的形狀與側面6e的形狀大致一致。然後,基台4與刀片6係以基台4的凸部4e嵌入刀片6的開口部6d之方式而貼合。藉此,基台4與刀片6被配置成互相同心圓狀,並進行基台4與刀片6的對位。Here, the
此外,為了使凸部4e順利地插入刀片6的開口部6d,凸部4e的外周面4f的直徑被設定成稍微小於刀片6的側面6e的直徑。但是,為了基台4與刀片6的高精度之對位,較佳為凸部4e的外周面4f的直徑與刀片6的側面6e的直徑之差為100μm以下。In addition, in order to smoothly insert the
圖3係表示已結合基台4與刀片6之附帶基台之刀片2之剖面圖。在基台4的凸部4e嵌入刀片6的開口部6d之狀態下,將基台4與刀片6接合並一體化,藉此獲得附帶基台之刀片2。此外,刀片6的外周緣6c的直徑大於基台4的外周緣4c的直徑。因此,若使基台4與刀片6接合,則刀片6的外周緣6c會被配置於比基台4的外周緣4c更靠基台4的半徑方向外側,並成為從外周緣4c突出之狀態。FIG. 3 is a cross-sectional view of the
此外,凸部4e的高度(從第一面4a的突出量)較佳為刀片6的厚度以下。在此情形,即使將凸部4e插入刀片6的開口部6d,凸部4e也不會從刀片6的第二面6b側突出。藉此,在固定於旋轉軸40之刀片安裝件44(參考圖7)裝設附帶基台之刀片2時,可防止凸部4e與刀片安裝件44接觸而妨礙附帶基台之刀片2的裝設之狀況。In addition, the height of the
接下來,在黏貼於基台4之刀片6的凹部6f填充第二接著劑(填充用接著劑)。圖4係表示已在刀片6的凹部6f填充第二接著劑8之附帶基台之刀片2之剖面圖。作為第二接著劑8,例如可使用丙烯酸樹脂系或環氧樹脂系的接著劑。Next, a second adhesive (adhesive for filling) is filled in the
此外,第二接著劑8的材料與貼合基台4與刀片6所使用之第一接著劑的材料可相同,也可不同。在第一接著劑與第二接著劑的材料不同之情形中,作為第二接著劑8,較佳為使用黏度低於第一接著劑且流動性高於第一接著劑之接著劑。In addition, the material of the second adhesive 8 and the material of the first adhesive used for bonding the
於此,在基台4的凸部4e與刀片6的側面6e之間,例如形成有50μm以下之微小間隙。然後,若在凹部6f填充第二接著劑8,則第二接著劑8會藉由毛細現象而在凸部4e的外周面4f與刀片6的側面6e之間隙流動,且第二接著劑8滲透至該間隙。其結果,藉由填充於外周面4f與側面6e的間隙之第二接著劑8而接合外周面4f與側面6e。Here, a minute gap of 50 μm or less is formed between the
若第二接著劑8滲透至凸部4e與側面6e之間隙,則不僅藉由第一接著劑接合基台4的第一面4a與刀片6的第一面6a,且進一步藉由第二接著劑8接合凸部4e與側面6e。藉此,緊固地接合基台4與刀片6。If the second adhesive 8 penetrates into the gap between the
尤其,在刀片6為厚之情形中,因應刀片6的厚度而增加基台4的凸部4e的高度(突出量),藉此可擴大外周面4f與側面6e的接合區域。藉此,更緊固地接合基台4與刀片6。例如,凸部4e的高度被設定成與刀片6的厚度大致相同。In particular, in the case where the
填充第二接著劑8之凹部6f的數目、位置(間隔)、形狀、大小等,係被設定成填充於凹部6f之第二接著劑8會藉由毛細現象而滲透至凸部4e與側面6e的間隙的全部區域。但是,若凹部6f過大,則有對刀片6的強度造成影響之虞。因此,凹部6f的深度較佳為刀片6的寬度(外周緣6c與側面6e的距離)的1/4以下。The number, position (interval), shape, size, etc. of the
如上述,在本實施方式之附帶基台之刀片2,基台4與刀片6係透過附著於基台4的第一面4a之第一接著劑而貼合,並藉由填充於刀片6的凹部6f且滲透至基台4的凸部4e與刀片6的側面6e之間隙之第二接著劑而接合。藉此,能獲得緊固地結合基台4與刀片6之附帶基台之刀片2。As described above, in the
此外,上述說明在透過第一接著劑貼合基台4與刀片6後,在刀片6的凹部6f填充第二接著劑8之情形,但基台4與刀片6的接合方法並不限定於此。例如,貼合基台4與刀片6時,也可在刀片6的凹部6f填充接著劑。In addition, in the above description, after the
具體而言,使基台4與刀片6貼合時,在基台4的第一面4a之中與刀片6的凹部6f重疊之區域(第一區域),塗布比第一面4a之其他區域(第二區域)多的第一接著劑。若在此狀態下貼合基台4與刀片6,則塗布於第一區域之第一接著劑會被填充於刀片6的凹部6f。然後,填充於凹部6f之第一接著劑會藉由毛細現象而在凸部4e的外周面4f與刀片6的側面6e之間隙流動,且第一接著劑會滲透至該間隙。Specifically, when the
在使用上述方法之情形,第一接著劑的一部分相當於圖4所示之第二接著劑8。因此,第一接著劑的材料與第二接著劑8的材料成為相同。此外,因第一接著劑容易滲透至凸部4e的外周面4f與刀片6的側面6e之間隙,故較佳為使用流動性高之接著劑(例如,丙烯酸樹脂系或環氧樹脂系接著劑)作為第一接著劑。並且,塗布於基台4的第一面4a的第一區域之第一接著劑的量,係以將第一接著劑填充於刀片6的凹部6f之方式而適宜調整。In the case of using the above method, a part of the first adhesive is equivalent to the second adhesive 8 shown in FIG. 4. Therefore, the material of the first adhesive and the material of the second adhesive 8 are the same. In addition, since the first adhesive easily penetrates into the gap between the outer
並且,上述說明使基台4與刀片6貼合時,在被形成為平面狀之基台4的第一面4a塗布第一接著劑的例子。但是,也可在基台4上形成填充第一接著劑之槽。圖5係表示將已形成槽4g之基台4與刀片6加以結合之附帶基台之刀片2之剖面圖。In addition, in the above description, when the
在圖5中,在基台4的第一面4a側形成有環狀的槽4g。例如,槽4g係以包圍凸部4e之方式從第一面4a朝向第二面4b側形成。槽4g的外周緣(槽4g的寬度方向中之一端部)未到達基台4的外周緣4c,槽4g的內周緣(槽4g的寬度方向中之另一端部)到達凸部4e的外周面4f。In FIG. 5, an
此外,槽4g的具體之形狀並無限制。例如,在基台4上,可沿著基台4的圓周方向連續地形成一條帶狀的槽4g,也可沿著基台4的圓周方向大致等間隔地形成多個槽4g。In addition, the specific shape of the
使基台4與刀片6貼合時(參考圖5),在槽4g中填充第一接著劑(貼合用接著劑)10。第一接著劑10的量係配合槽4g的體積而進行調整,填充於槽4g之第一接著劑10的表面被定位在與基台4的第一面4a大致相同之平面上。When bonding the
於此,在槽4g之中與刀片6的凹部6f重疊之區域,以從基台4的第一面4a突出之方式塗布第一接著劑10。塗布於此區域之第一接著劑10的量,係調整成從基台4的第一面4a突出之第一接著劑10的體積成為刀片6的凹部6f的體積以上。Here, the
在此狀態下,若使基台4的第一面4a側與刀片6的第一面6a側貼合,則透過第一接著劑10接合基台4與刀片60,且從基台4的第一面4a突出之第一接著劑10被填充至刀片6的凹部6f。然後,填充於凹部6f之第一接著劑10會藉由毛細現象而在凸部4e的外周面4f與刀片6的側面6e之間隙流動,且第一接著劑10滲透至該間隙。In this state, if the
如上述,若在槽4g的內部填充第一接著劑10,則相較於在未形成槽4g之基台4的第一面4a塗布第一接著劑10之情形,第一接著劑10與基台4的接觸面積增大。藉此,可增強第一接著劑10對於基台4之接著力。並且,藉由將第一接著劑10填充於槽4g,在使基台4與刀片6貼合時,可防止第一接著劑10被壓扁擴散而溢出至基台4的外周緣4c的外側。As described above, if the
但是,形成槽4g之區域可適宜變更。例如槽4g可被形成為槽4g的內邊緣不與刀片6的凹部6f重疊。在此情形中,在槽4g填充第一接著劑10並使基台4與刀片6貼合後,可另外在刀片6之凹部6f填充第二接著劑8。However, the area where the
上述的附帶基台之刀片2被裝設於切削裝置並切削被加工物。以下,針對使用附帶基台之刀片2切削被加工物之切削裝置的構成例進行說明。圖6係表示切削被加工物11之切削裝置20之立體圖。The above-mentioned
作為藉由切削裝置20所切削之被加工物11的例子,可列舉形成有多個IC、LSI等元件之半導體晶圓、或CSP(Chip Size Package,晶片級封裝)基板、QFN(Quad Flat Non-leaded Package,四方無引線構裝)基板等封裝基板。但是,被加工物11的種類、材質、形狀、構造、大小等並無限制。例如,被加工物11可為由玻璃、藍寶石、陶瓷、樹脂、金屬等所形成之圓盤狀或長方體狀的基板等。Examples of the
切削裝置20具備基台22,所述基台22支撐構成切削裝置20之各構成要素,且在基台22的上方設置有覆蓋基台22的上表面側之蓋24。在蓋24的內部形成有進行被加工物11的加工之空間(處理空間),此空間中配置有裝設附帶基台之刀片2的切削單元26。切削單元26與移動機構(未圖示)連接,此移動機構使切削單元26沿著Y軸方向(分度進給方向、前後方向)及Z軸方向(垂直方向、上下方向)移動。The cutting
在切削單元26的下方設置有保持被加工物11之保持台(卡盤台)28。保持台28的上表面構成保持被加工物11之保持面,此保持面透過形成於保持台28的內部之吸引路徑(未圖示)而與噴射器等吸引源(未圖示)連接。在被加工物11配置於保持台28的保持面上之狀態下,若使吸引源之負壓作用於保持面,則藉由保持台28吸引保持被加工物11。A holding table (chuck table) 28 that holds the
保持台28與移動機構(未圖示)連接,此移動機構使保持台28沿著X軸方向(加工進給方向、左右方向)移動。並且,保持台28與旋轉機構(未圖示)連接,此旋轉機構使保持台28繞著與Z軸方向大致平行之旋轉軸旋轉。The holding table 28 is connected to a moving mechanism (not shown), and this moving mechanism moves the holding table 28 in the X-axis direction (processing feed direction, left-right direction). In addition, the holding table 28 is connected to a rotating mechanism (not shown), and this rotating mechanism rotates the holding table 28 about a rotation axis substantially parallel to the Z-axis direction.
在基台22的前方之角部設置有卡匣升降機30。在卡匣升降機30的上表面載置有能容納多個被加工物11之卡匣32。卡匣升降機30被構成為能升降,並以適當地從卡匣32搬出被加工物11或將被加工物11搬入卡匣32之方式,調整卡匣32的高度(Z軸方向中之位置)。並且,在蓋24的前表面24a側設置有成為使用者介面之觸控面板式的監視器34。A
構成切削裝置20之各構成要素(切削單元26、與切削單元26連接之移動機構、保持台28、與保持台28連接之移動機構及旋轉機構、卡匣升降機30、監視器34等)係與控制單元(未圖示)連接。控制單元係藉由電腦等所構成,並控制切削裝置20的構成要素的動作。The various constituent elements (cutting
圖7係表示切削單元26之立體圖。切削單元26具備沿著Y軸方向配置之圓筒狀的旋轉軸(主軸)40。旋轉軸40被容納於圓筒狀的外殼42。旋轉軸40的前端部(一端部)露出於外殼42的外部,且旋轉軸40的前端部固定有刀片安裝件44。並且,旋轉軸40的基端部(另一端側)與使旋轉軸40旋轉之馬達等旋轉驅動源(未圖示)連結。FIG. 7 is a perspective view of the cutting
刀片安裝件44具備:圓盤狀的凸緣部46、及從凸緣部46的正面46a的中央突出之圓筒狀的支撐軸48。在凸緣部46的外周部之正面46a側設置有從正面46a突出之環狀的凸部46b。凸部46b在其前端具備前端面46c,前端面46c被形成為與正面46a大致平行。The
支撐軸48的前端部的外周面形成有螺絲部48a,此螺絲部48a與環狀的固定螺帽50鎖緊。在固定螺帽50的中央形成有在厚度方向貫通固定螺帽50之圓柱狀的開口部50a。開口部50a被形成為與支撐軸48大致同徑,在開口部50a設置有與支撐軸48的螺絲部48a對應之螺絲槽。A
若將支撐軸48插入附帶基台之刀片2的基台4的開口部4d,則附帶基台之刀片2被裝設於刀片安裝件44。在此狀態下,若將固定螺帽50鎖緊於支撐軸48之螺絲部48a,則可藉由基台4的第一面4a(參考圖1等)與凸緣部46的凸部46b的前端面46c夾持刀片6。如此一來,可將附帶基台之刀片2固定於旋轉軸40的前端部。If the
在附帶基台之刀片2裝設於切削單元26之狀態下,若藉由旋轉驅動源使旋轉軸40旋轉,則附帶基台之刀片2會以旋轉軸40的軸心為中心進行旋轉。然後,使旋轉之附帶基台之刀片2的刀片6切入藉由保持台28(參考圖6)所保持之被加工物11,藉此切削被加工物11。In the state where the base-attached
此外,上述實施方式之構造、方法等可在不超出本發明的目的之範圍內適宜變更並加以實施。In addition, the structure, method, etc. of the above-mentioned embodiments can be appropriately changed and implemented within a range that does not deviate from the purpose of the present invention.
2:附帶基台之刀片
4:基台
4a:第一面(正面)
4b:第二面(背面)
4c:外周緣(外周面)
4d:開口部
4e:凸部
4f:外周面
4g:槽
6:刀片
6a:第一面(正面)
6b:第二面(背面)
6c:外周緣(外周面)
6d:開口部
6e:側面(內周面)
6f:凹部
8:第二接著劑
10:第一接著劑(貼合用接著劑)
20:切削裝置
22:基台
24:蓋
24a:前表面
26:切削單元
28:保持台(卡盤台)
30:卡匣升降機
32:卡匣
34:監視器
40:旋轉軸(主軸)
42:外殼
44:刀片安裝件
46:凸緣部
46a:正面
46b:凸部
46c:前端面
48:支撐軸
48a:螺絲部
50:固定螺帽
50a:開口部
11:被加工物2: Blade with abutment
4:
圖1係表示附帶基台之刀片之分解剖面圖。 圖2係表示結合基台與刀片的態樣之剖面圖。 圖3係表示已結合基台與刀片之附帶基台之刀片之剖面圖。 圖4係表示已在刀片的凹部填充接著劑之附帶基台之刀片之剖面圖。 圖5係表示將已形成槽之基台與刀片加以結合之附帶基台之刀片之剖面圖。 圖6係表示切削裝置之立體圖。 圖7係表示切削單元之立體圖。Figure 1 shows an exploded cross-sectional view of the blade with a base. Fig. 2 is a cross-sectional view showing how the base and the blade are combined. Fig. 3 is a cross-sectional view of the blade with abutment that has been combined with the abutment and the blade. Fig. 4 is a cross-sectional view of a blade with a base that has been filled with adhesive in the recess of the blade. Fig. 5 is a cross-sectional view of a blade with a base that combines a base with a groove formed with the blade. Fig. 6 is a perspective view of the cutting device. Fig. 7 is a perspective view of the cutting unit.
2:附帶基台之刀片2: Blade with abutment
4:基台4: Abutment
4a:第一面(正面)4a: First side (front side)
4b:第二面(背面)4b: Second side (back side)
4c:外周緣(外周面)4c: Outer peripheral edge (outer peripheral surface)
4d:開口部4d: opening
4e:凸部4e: convex
4f:外周面4f: outer peripheral surface
6:刀片6: Blade
6a:第一面(正面)6a: First side (front side)
6b:第二面(背面)6b: Second side (back side)
6c:外周緣(外周面)6c: Outer peripheral edge (outer peripheral surface)
6d:開口部6d: opening
6e:側面(內周面)6e: Side (inner peripheral surface)
6f:凹部6f: recess
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020009239A JP7430447B2 (en) | 2020-01-23 | 2020-01-23 | blade with base |
JP2020-009239 | 2020-01-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202128357A true TW202128357A (en) | 2021-08-01 |
Family
ID=76878352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110102288A TW202128357A (en) | 2020-01-23 | 2021-01-21 | Blade with base in which a base and a blade are firmly coupled with each other |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7430447B2 (en) |
KR (1) | KR20210095552A (en) |
CN (1) | CN113146868A (en) |
SG (1) | SG10202013077PA (en) |
TW (1) | TW202128357A (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5895317A (en) | 1996-12-18 | 1999-04-20 | Norton Company | Wheel hub for longer wheel life |
JP2008302435A (en) | 2007-06-05 | 2008-12-18 | Torisutaa:Kk | Cutting blade and blade manufacturing method |
JP5690581B2 (en) | 2010-12-27 | 2015-03-25 | 株式会社ディスコ | Cutting blade |
US11219884B2 (en) | 2015-12-28 | 2022-01-11 | Toyota Jidosha Kabushiki Kaisha | Cluster supported catalyst and production method therefor |
-
2020
- 2020-01-23 JP JP2020009239A patent/JP7430447B2/en active Active
- 2020-12-15 KR KR1020200174928A patent/KR20210095552A/en active Search and Examination
- 2020-12-28 SG SG10202013077PA patent/SG10202013077PA/en unknown
-
2021
- 2021-01-14 CN CN202110048623.6A patent/CN113146868A/en active Pending
- 2021-01-21 TW TW110102288A patent/TW202128357A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP7430447B2 (en) | 2024-02-13 |
KR20210095552A (en) | 2021-08-02 |
SG10202013077PA (en) | 2021-08-30 |
JP2021115647A (en) | 2021-08-10 |
CN113146868A (en) | 2021-07-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI683735B (en) | Abutment blade | |
TW201841267A (en) | Method of manufacturing semiconductor package | |
JP6971093B2 (en) | Multi-blade, processing method | |
KR20170000770A (en) | Cutting blade and mounting structure for cutting blade | |
TW202128357A (en) | Blade with base in which a base and a blade are firmly coupled with each other | |
TWI827831B (en) | With abutment blade | |
TWI805872B (en) | Wafer processing method | |
JP7282460B2 (en) | blade with base | |
JP2020171990A (en) | Blade with base | |
JP2020171991A (en) | Blade with base | |
TW202224891A (en) | Cutting blade for enhancing bonding strength of base and blade | |
JP7383333B2 (en) | blade with base | |
JP7184460B2 (en) | blade with base | |
JP2024017800A (en) | Processing method for work-piece | |
TW202322201A (en) | Chip manufacturing method | |
TW202213550A (en) | Manufacturing method of package substrate | |
TW202232589A (en) | Blade fixture and blade mounter | |
JP2024035879A (en) | How to cut the workpiece | |
KR20230082567A (en) | Method for manufacturing blade with base | |
JP2021145071A (en) | Processing method of wafer | |
JP2022032303A (en) | Method for processing substrate | |
JP2022000318A (en) | Cutting blade and cutting blade dressing method | |
JP2021065980A (en) | Blade with base and cutting device |