SG10202013077PA - Base-equipped blade - Google Patents
Base-equipped bladeInfo
- Publication number
- SG10202013077PA SG10202013077PA SG10202013077PA SG10202013077PA SG10202013077PA SG 10202013077P A SG10202013077P A SG 10202013077PA SG 10202013077P A SG10202013077P A SG 10202013077PA SG 10202013077P A SG10202013077P A SG 10202013077PA SG 10202013077P A SG10202013077P A SG 10202013077PA
- Authority
- SG
- Singapore
- Prior art keywords
- base
- equipped blade
- blade
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
- B24B45/006—Quick mount and release means for disc-like wheels, e.g. on power tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020009239A JP7430447B2 (en) | 2020-01-23 | 2020-01-23 | blade with base |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202013077PA true SG10202013077PA (en) | 2021-08-30 |
Family
ID=76878352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202013077PA SG10202013077PA (en) | 2020-01-23 | 2020-12-28 | Base-equipped blade |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7430447B2 (en) |
KR (1) | KR20210095552A (en) |
CN (1) | CN113146868A (en) |
SG (1) | SG10202013077PA (en) |
TW (1) | TW202128357A (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5895317A (en) | 1996-12-18 | 1999-04-20 | Norton Company | Wheel hub for longer wheel life |
JP2008302435A (en) | 2007-06-05 | 2008-12-18 | Torisutaa:Kk | Cutting blade and blade manufacturing method |
JP5690581B2 (en) | 2010-12-27 | 2015-03-25 | 株式会社ディスコ | Cutting blade |
EP3536401A1 (en) | 2015-12-28 | 2019-09-11 | Toyota Jidosha Kabushiki Kaisha | Cluster supported catalyst and production method therefor |
-
2020
- 2020-01-23 JP JP2020009239A patent/JP7430447B2/en active Active
- 2020-12-15 KR KR1020200174928A patent/KR20210095552A/en active Search and Examination
- 2020-12-28 SG SG10202013077PA patent/SG10202013077PA/en unknown
-
2021
- 2021-01-14 CN CN202110048623.6A patent/CN113146868A/en active Pending
- 2021-01-21 TW TW110102288A patent/TW202128357A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2021115647A (en) | 2021-08-10 |
CN113146868A (en) | 2021-07-23 |
TW202128357A (en) | 2021-08-01 |
JP7430447B2 (en) | 2024-02-13 |
KR20210095552A (en) | 2021-08-02 |
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