JP2000153458A - Flush mounting method and device of grinding wheel surface plate in double-sided work machine - Google Patents

Flush mounting method and device of grinding wheel surface plate in double-sided work machine

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Publication number
JP2000153458A
JP2000153458A JP10327045A JP32704598A JP2000153458A JP 2000153458 A JP2000153458 A JP 2000153458A JP 10327045 A JP10327045 A JP 10327045A JP 32704598 A JP32704598 A JP 32704598A JP 2000153458 A JP2000153458 A JP 2000153458A
Authority
JP
Japan
Prior art keywords
grinding wheel
polishing
correcting
grindstone
surface plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10327045A
Other languages
Japanese (ja)
Inventor
Koji Takeuchi
浩司 竹内
Koujirou Kumagai
功次郎 熊谷
Michiaki Tazaki
美智明 田崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam-IPEC Co Ltd
Original Assignee
SpeedFam-IPEC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam-IPEC Co Ltd filed Critical SpeedFam-IPEC Co Ltd
Priority to JP10327045A priority Critical patent/JP2000153458A/en
Publication of JP2000153458A publication Critical patent/JP2000153458A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To immediately perform normal operation without performing running-in work and dummy operation after flush mounting by rotating a correcting grinding wheel by reversing the rotational direction after rotating the correcting grinding wheel in the prescribed direction for a specific time. SOLUTION: While bringing a correcting grinding wheel 7 or a correcting carrier into pressure contact with sandwiching between both upper/lower surface plates, rotating and revolving motion are imparted to the correcting grinding wheel 7 or the correcting carrier to correct/renew the surface of a pellet-like diamond grinding wheel 4. Rotation of the correcting grinding wheel 7 is controlled by driving the outer peripheral teeth provided in an outer peripheral part of a gripping plate 3 by a sun gear 8 and an internal gear 9 of a polishing work machine. Here, rotation of the whole motors for driving the sun gear 8, the internal gear 9, the upper surface plate 1 and the lower surface plate 2 can be simultaneously changed in either reciprocal direction without changing the rotational ratio. After polishing the grinding wheel surface by rotating the correcting grinding wheel 7 in the certain specific direction, the grinding wheel 7 is rotated in the inverse direction of the last time.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明が属する技術分野】本発明は、ガラスあるいはセ
ラミックス等の表面の研磨加工を行なうための砥石定盤
の研磨作用面の修正、所謂面出しを行なう方法およびそ
のための装置に係わるものである。更に詳しくは、面出
しに用いられる修正砥石による修正方法に関するもので
ある。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for correcting a polishing surface of a grindstone surface plate for polishing a surface of glass or ceramics, so-called surface polishing. More specifically, the present invention relates to a correction method using a correction whetstone used for surfacing.

【0002】[0002]

【従来の技術】近年、ガラス材料は、建材、容器、装飾
品、光学用レンズ等に使用される用途以外に、磁気ディ
スク基板、フォトマスク、コピーミラー、液晶ガラス等
電子部品関連の新用途への展開が著しく、特に磁気ディ
スク用のガラス基板の場合は、極端に高精密な仕上げ面
粗さと形状精度が要求されると同時に生産性の向上も要
求されている。
2. Description of the Related Art In recent years, glass materials have been used in new applications related to electronic components such as magnetic disk substrates, photomasks, copy mirrors, and liquid crystal glasses, in addition to applications used for building materials, containers, decorative articles, optical lenses, and the like. In particular, in the case of a glass substrate for a magnetic disk, extremely high precision finished surface roughness and shape accuracy are required, and at the same time, improvement in productivity is also required.

【0003】従来、ガラス基板等のガラス材料で、極め
て高い平面度や平行度が特に要求される板状の材料の高
精度の形状を得るための加工は、一般的なラッピング加
工による方法が従来より幅広く使用されているが、近年
は高い研削力を持った砥石、例えば、ダイヤモンドや窒
化硼素(CBN)などを砥粒とした砥石による研削加工
方法がその生産性の良さから着目され、比較的多く使用
されるようになって来ている。特に、ダイヤモンド砥粒
微粒子はガラスあるいはセラミックスに対する加工力が
強く、砥石表面に固定された無数の砥粒微粒子の先端が
工作物の表面を引掻いて、除去作用を進めて行くので、
寸法や形状を整える研削加工には極めて好適である。
Conventionally, in order to obtain a highly accurate shape of a glass material such as a glass substrate, which requires particularly high flatness and parallelism, a general lapping method is conventionally used. Although widely used, in recent years, a grinding method using a grindstone having a high grinding force, for example, a grindstone using diamond or boron nitride (CBN) as an abrasive, has been attracting attention due to its high productivity. It is increasingly being used. In particular, diamond abrasive particles have a strong processing power on glass or ceramics, and the tips of countless abrasive particles fixed on the surface of the grinding stone scratch the surface of the workpiece and promote the removal action,
It is very suitable for a grinding process for adjusting dimensions and shapes.

【0004】砥石により、板状のガラスやセラミックス
の研磨加工を行なうには例えばカップ型のダイヤモンド
砥石を用いて枚葉式で仕上げて行く方法もあるが、小口
径のディスク状のガラス基板を効率よく加工するには、
砥石の形状をペレット状のものとして、これを両面加工
機の上下定盤上に接着配列して砥石研磨作用面を形成
し、その間に複数枚のガラス基板を挾持して押圧回転し
つつ同時加工を行なう方法が一般的に採用されている
(例えば、特公平6−22790号公報、特開平6−5
5459号公報)。さらに、セグメント状の砥石を用い
ることもある。このペレット状のダイヤモンド砥石とし
ては、ダイヤモンド微細砥粒を特殊合金で固定したメタ
ルボンド砥石が使用されることが多いが、それ以外にレ
ジノイド系あるいはビトリファイド系の砥石も使用され
る。研削加工が完了したガラス基板はその後、酸化セリ
ウム砥粒によるポリッシング加工を行ない最終的に精密
な鏡面を得る。
In order to grind a plate-like glass or ceramics with a grindstone, for example, there is a method of performing single-wafer finishing using a cup-shaped diamond grindstone. However, a disk-shaped glass substrate having a small diameter is efficiently used. To process well,
The shape of the grindstone is pellet-shaped, and it is bonded and arranged on the upper and lower platens of a double-sided processing machine to form a grindstone polishing surface, and multiple glass substrates are sandwiched between them and simultaneously processed while pressing and rotating. (See, for example, Japanese Patent Publication No. Hei 6-22790,
No. 5449). Further, a segmented grinding wheel may be used. As the pellet-shaped diamond grindstone, a metal bond grindstone in which fine diamond grains are fixed with a special alloy is often used, but a resinoid or vitrified grindstone is also used. The glass substrate that has been subjected to the grinding process is thereafter subjected to a polishing process using cerium oxide abrasive grains to finally obtain a precise mirror surface.

【0005】上述した通り、最近のガラス基板の加工の
工程は、前工程である例えばダイヤモンドペレット砥石
を貼付した定盤による研磨工程と、後工程である酸化セ
リウムスラリーを用いたポリッシング工程とから構成さ
れており、それぞれの工程は更に2ないし3工程に分け
られているのが一般的である。この全工程で0.4ない
し0.5mm程度の厚みを除去した上で、5〜10Å程
度の面粗さ(Ra)を最終的に得る。
As described above, a recent process for processing a glass substrate includes a polishing process using a platen to which a diamond pellet grindstone is attached as a preceding process, and a polishing process using a cerium oxide slurry as a subsequent process. Each step is generally further divided into two or three steps. After removing a thickness of about 0.4 to 0.5 mm in all the steps, a surface roughness (Ra) of about 5 to 10 ° is finally obtained.

【0006】ダイヤモンドペレット状砥石を使用したガ
ラス等の工作物の加工の場合は、直径10〜20mm程
度の円柱状のダイヤモンドペレットを両面加工機の上下
両定盤に適当な密度でほぼ均等に貼付して形成した研削
磨作用面を用いて両面加工機で行なうものである。前記
上下両定盤間に工作物であるガラス基板をキャリア板を
介して複数枚挾持して、上定盤で加工圧をかけ、加工液
を供給しながら定盤およびガラス基板を回転させて研削
を行なう。加工液は砥粒等を含まない界面活性剤の水溶
液、あるいは微量の砥粒を含んだ界面活性剤の水溶液を
用いるのが普通である。
[0006] In the case of processing a workpiece such as glass using a diamond pellet-shaped grinding wheel, cylindrical diamond pellets having a diameter of about 10 to 20 mm are almost uniformly adhered to both upper and lower platens of a double-sided processing machine at an appropriate density. This is performed by a double-side processing machine using the grinding and polishing surface formed as described above. A plurality of glass substrates as workpieces are sandwiched between the upper and lower platens via a carrier plate, a processing pressure is applied by the upper platen, and the platen and the glass substrate are rotated while supplying a processing liquid to grind. Perform As the working liquid, an aqueous solution of a surfactant containing no abrasive grains or the like or an aqueous solution of a surfactant containing a small amount of abrasive grains is generally used.

【0007】ダイヤモンド砥石は研磨力も強く、またそ
の持続性も長いものであるが、長期間使用していると僅
かながら表面が磨滅しまた、ダイヤモンドペレット全体
の面で形成される定盤の研磨作用面の形状が偏って変
化、変形して加工後の工作物の形状精度に悪影響を与え
るようになる。従って、これ等砥石の磨滅や研磨作用面
の形状変化を是正するためにペレット状のダイヤモンド
砥石の面の修正を行なうことが一般的に行なわれてい
る。
[0007] A diamond grindstone has a strong polishing power and a long lasting property. However, the surface of the diamond grindstone is slightly worn out over a long period of use, and the polishing surface of the platen formed by the entire surface of the diamond pellets. The shape is unevenly changed and deformed, which adversely affects the shape accuracy of the processed workpiece. Therefore, it is common practice to modify the surface of a pellet-shaped diamond grindstone in order to correct the wear of these grindstones and the change in the shape of the polishing surface.

【0008】研磨作用面の修正は、一般的にはまず鋳物
製の修正キャリアを用い、これを上下砥石定盤間に載置
して、定盤および修正砥石を押圧回転しつつその表面に
砥粒スラリーを散布して磨滅し変形した作用面の形状の
修正を行なう。次いで修正砥石を用いてこれを上下定盤
間に載置して、定盤および修正砥石を押圧回転してダイ
ヤモンド砥石の表面の研磨を行なう。修正砥石として
は、例えばビトリファイド砥石やレジノイド砥石等比較
的剛性の高い砥石を用いることが多い。磨滅変形が著し
い場合はこのような2工程に亘る修正が必要であるが、
軽度の場合は修正砥石のみで行なうこともある。
In order to correct the polishing surface, generally, a correction carrier made of a casting is first used, and the correction carrier is placed between the upper and lower whetstone platens, and the surface and the correction whetstone are pressed and rotated to grind the surface. The shape of the working surface that has been worn and deformed by spraying the granular slurry is corrected. Next, the surface of the diamond grindstone is polished by pressing and rotating the platen and the modified grindstone by placing the modified grindstone between the upper and lower platens. As the modified grindstone, for example, a grindstone having relatively high rigidity such as a vitrified grindstone or a resinoid grindstone is often used. When the wear deformation is remarkable, such a two-step correction is necessary,
In the case of mild, it may be done only with the correction whetstone.

【0009】修正後のペレット状のダイヤモンド砥石
は、砥石表面の砥粒が更新され鋭利な砥粒先端が表面に
露出しているため、研磨力が非常に強く、そのため面出
し後の立ち上げは加工抵抗が高くキャリアの損耗も激し
く、仕上がり面も粗くなる。よって、立上り後はしばら
くの間、通常より強靭なキャリア板を使用して、ダミー
ワークを流していわゆる目潰しを行ない、機台の安定な
稼働が可能になってから正式な加工を行なうのが一般で
ある。目潰しに必要なダミーワークの枚数は甚だしきは
数千ないし数万枚におよぶこともあり、時間的にもエネ
ルギー的にもロスが極めて多かった。
The modified diamond grindstone has an extremely strong polishing force because the abrasive grains on the grindstone surface are renewed and the sharp abrasive tips are exposed on the surface. The processing resistance is high, the carrier is severely worn, and the finished surface is rough. For this reason, it is common practice to use a tougher carrier plate than usual for a while after the start-up, to carry out dummy work by so-called crushing, and to perform formal machining after the machine can be operated stably. It is. The number of dummy works required for crushing could be as large as thousands or tens of thousands, and loss in terms of time and energy was extremely large.

【0010】本発明者等は、上述の現象、すなわち面出
し後の立上りにおいて研磨加工抵抗が極めて高くなる現
象の解析を行なうため鋭意検討を行なった結果、次のこ
とを見出すに至ったものである。すなわち、修正砥石に
よる修正を前述のような方法で行なうと、加工に用いる
砥石の作用面上に露出したダイヤモンド砥粒は、修正砥
石の回転方向へ倣って傾斜しその方向に砥粒の目が立
ち、方向性を持つようになりそれが研削抵抗に強い影響
を与えることを見出したものである。
The present inventors have conducted intensive studies in order to analyze the above-mentioned phenomenon, that is, a phenomenon in which the polishing resistance is extremely high at the rise after surface exposure, and as a result, have found the following. is there. In other words, when the correction with the correction whetstone is performed in the above-described manner, the diamond abrasive grains exposed on the working surface of the whetstone used for the processing are inclined in the rotation direction of the correction whetstone, and the eyes of the abrasive grains in that direction. They have found that they have a directivity and that they have a strong influence on the grinding resistance.

【0011】[0011]

【発明が解決しようとする課題】本発明者等は、ダイヤ
モンドペレット定盤を用いたガラスの従来の加工方法に
おける前述の問題点とその原因となる上述の要因に鑑
み、鋭意研究を行なった結果、本発明方法と装置を完成
するに至ったものであり、その目的となす所は、面出し
後、馴らし作業やダミー運転を行なうことなく直ちに正
常運転が可能な砥石定盤の修正方法を提供することにあ
る。更に本発明の他の目的は砥石定盤の修正を行なう装
置を提供するにある。
DISCLOSURE OF THE INVENTION The present inventors have conducted intensive studies in view of the above-mentioned problems and the above-mentioned factors in the conventional processing method of glass using a diamond pellet surface plate. The present invention has completed the method and apparatus of the present invention, and an object of the present invention is to provide a method for correcting a grinding wheel surface plate that can be normally operated immediately without performing a running-in operation or a dummy operation after surfacing. Is to do. Still another object of the present invention is to provide an apparatus for performing a correction of a grinding wheel surface plate.

【0012】[0012]

【課題を解決するための手段】上述の目的は、回転可能
な上下両定盤に砥石を貼付けて研磨作用面を構成した両
面研磨加工機の上下両砥石定盤の間に、修正砥石を挾持
し圧接しながら、前記上下両砥石定盤および修正砥石を
回転させ、前記砥石で構成される上下両砥石定盤の研磨
作用面を修正する方法において、前記修正砥石を所定の
方向に一定時間回転した後、回転方向を逆にして回転を
行なうことを特徴とする前記砥石定盤の研磨作用面の修
正方法にて達成できる。本発明方法において、修正作業
における上下両定盤および修正砥石の回転の制御は、上
下両定盤および修正砥石を駆動する太陽車ギアとインタ
ーナルギアを駆動する全てのモーターの回転が、正逆い
ずれの方向にも自動切り替えを可能としたシステムを組
み込んだ装置を用いる。
SUMMARY OF THE INVENTION The object of the present invention is to hold a modified whetstone between upper and lower whetstone platens of a double-sided polishing machine in which a grindstone is attached to both rotatable upper and lower platens to form a polishing surface. In the method of rotating the upper and lower whetstone platen and the correction whetstone while pressing and pressing, and correcting the polishing action surfaces of the upper and lower whetstone platen formed by the whetstone, the correction whetstone is rotated in a predetermined direction for a predetermined time. After that, the rotation direction is reversed, and the rotation is performed. In the method of the present invention, the rotation of the upper and lower stool and the correction wheel in the correction operation is controlled by rotating both the upper and lower stool and the sun wheel gear for driving the correction wheel and all the motors for driving the internal gear, either forward or reverse. A device that incorporates a system that enables automatic switching in the direction is also used.

【0013】本発明おける肝要は、修正砥石を所定の方
向に一定時間回転(正転)した後、回転方向を逆にして
回転(逆転)を行なうことによって、加工に用いる砥石
定盤の研磨作用面上に露出した砥粒の一定方向への傾斜
を是正し、作用面上の砥粒が一方に偏って傾斜すること
なく、全砥粒がほぼ垂直に立つようにする点にある。す
なわち、面修正後の加工用砥石の作用面上の砥粒の状態
をこのように方向性のない状態にすることにより、加工
物をどちらの方向に回転して研磨加工を行なってもほぼ
同等の研磨抵抗値が得られるようにしたものである。
The essential point of the present invention is that after the correction grindstone is rotated in a predetermined direction for a predetermined time (forward rotation), the rotation direction is reversed (reverse rotation), and thereby the polishing action of the grinding wheel platen used for processing is performed. The object is to correct the inclination of the abrasive grains exposed on the surface in a certain direction, so that the abrasive grains on the working surface do not incline toward one side, and all the abrasive grains stand almost vertically. In other words, by setting the state of the abrasive grains on the working surface of the processing grindstone after the surface correction to such a state having no directivity, the polishing is performed by rotating the workpiece in either direction and performing substantially the same. The polishing resistance value of

【0014】[0014]

【発明の実施の形態】本発明において使用する研磨加工
機は、上下両面に回転可能な定盤を有し、工作物である
ガラス等を把持する把持板と、その把持板に遊星運動を
与える装置を有する所謂両面加工機と称するものであ
り、把持板に把持された板状のガラスを前記両定盤で挾
持し圧接しながら、前記両定盤および把持板の少なくと
も一つを回転し、加工を行なうものである。本発明にお
いてはこの上下両定盤のいずれにもペレット状の小型の
砥石を多数配列して、その砥石の頂部で実質研磨加工作
用面を形成するものである。図1に本発明において使用
する両面加工機の要部断面説明図を示す。工作物である
板状のガラス5は把持板3に把持された状態で、上定盤
1および下定盤2の上に配置されたペレット状砥石4に
押圧される。水系スラリーは上部定盤に設けられた供給
孔6より供給される。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A polishing machine used in the present invention has a rotatable surface plate on both upper and lower surfaces, a gripping plate for gripping a workpiece such as glass, and imparts a planetary motion to the gripping plate. It is a so-called double-sided processing machine having a device, while holding and pressing the plate-shaped glass gripped by the gripping plate between the both platens, rotating at least one of both the platen and the gripping plate, Processing is performed. In the present invention, a large number of small pellet-shaped grindstones are arranged on both of the upper and lower stools, and a substantial polishing working surface is formed at the top of the grindstones. FIG. 1 is an explanatory cross-sectional view of a main part of a double-side processing machine used in the present invention. The plate-shaped glass 5 as the workpiece is pressed by the pellet-shaped grindstone 4 arranged on the upper stool 1 and the lower stool 2 while being held by the holding plate 3. The aqueous slurry is supplied from a supply hole 6 provided in the upper platen.

【0015】本発明にいう研磨作用面の修正とは、図2
に示す如く修正砥石7あるいは修正キャリアを前述の上
下両定盤の間に挾持し圧接しながら、前記修正砥石7あ
るいは修正キャリアに自転および公転運動を与え、ペレ
ット状ダイヤモンド砥石の表面を修正し、更新してゆく
ものであり、修正砥石7の回転は把持板3の外周部に具
備された外周歯を、研磨加工機の太陽車8とインターナ
ルギア9で駆動することによりコントロールされる。す
なわち、太陽車8とインターナルギア9の動きを適宜変
更することで修正砥石あるいは修正キャリアの回転方向
および回転比を自在に制御することができる。本発明方
法の場合は、前記太陽車8とインターナルギア9および
上定盤1、下定盤2を駆動する全てのモータの回転が、
回転比を変えることなく正逆いずれの方向にも同時に変
更可能であることを特徴とする。
The modification of the polishing surface according to the present invention refers to FIG.
As shown in (1), while the correction whetstone 7 or the correction carrier is sandwiched between the upper and lower platens and pressed, the rotation and revolving motion are given to the correction whetstone 7 or the correction carrier to correct the surface of the pellet-shaped diamond whetstone. The rotation of the correction grindstone 7 is controlled by driving the outer peripheral teeth provided on the outer peripheral portion of the gripping plate 3 by the sun wheel 8 and the internal gear 9 of the polishing machine. That is, by appropriately changing the movement of the sun wheel 8 and the internal gear 9, the rotation direction and the rotation ratio of the correction wheel or the correction carrier can be freely controlled. In the case of the method of the present invention, the rotation of all the motors that drive the sun wheel 8, the internal gear 9, and the upper stool 1 and the lower stool 2,
It is characterized in that it can be simultaneously changed in both forward and reverse directions without changing the rotation ratio.

【0016】本発明にいう両面加工機の加工の対象物は
板状のガラス、例えば磁気ディスク用ガラス基板、フォ
トマスク、コピーミラー等であるが、その中でも特に磁
気ディスク用ガラス基板の加工を主たる目的としてい
る。ここでいう磁気ディスク用ガラス基板とは、ソーダ
ライムガラス(通称青板)、アルミシリケート系アモル
ファスガラス(通称白板)あるいは結晶化ガラスなどを
原材料とした中央に円形孔を有する薄板状円形環状のガ
ラス板を指す。
The object to be processed by the double-sided processing machine according to the present invention is a plate-like glass, for example, a glass substrate for a magnetic disk, a photomask, a copy mirror, and the like. The purpose is. The glass substrate for a magnetic disk referred to herein is a thin circular glass plate having a circular hole at the center and made of soda lime glass (commonly called a blue plate), aluminum silicate-based amorphous glass (commonly called a white plate) or crystallized glass. Refers to a board.

【0017】本発明にいう砥石を貼付けて研磨作用面を
構成した上下両定盤とは、通常の両面研磨加工機の定盤
面に、例えばセグメント状あるいはペレット状等の形状
で例えばダイヤモンド、アルミナ、炭化珪素あるいは窒
化硼素等の砥粒を固定した砥石を貼付けたものである
が、ガラス等の加工においては、特に高い研磨力をもつ
ダイヤモンド砥粒が多用される。また結合材としては金
属、樹脂、セラミックス等を用いたものが挙げられるが
特に好ましくは金属を結合材としたメタルボンド砥石が
多く使用される。また、形状としてはペレット状のもの
が好適である。すなわち、本発明においては高い研削力
と耐久性とを重視してメタルボンドのペレット状のダイ
ヤモンド砥石を複数箇貼付けて使用する。ここにいうペ
レット状砥石とは例えば円形、楕円形、菱形、矩形等の
断面形状を有する小型の柱状のものであり、これが定盤
面に接着固定されている。定盤状の配列形状としては、
加工にあたって工作物に対する接触のヌケや斑がないよ
うに配列されるものであって、この砥石の加工作用面の
占める総面積が、上下各定盤の有効作用面積の30〜7
0%の範囲にあることが好ましく、これ以下であると加
工のヌケや斑の発生が起こりやすく、またこれ以上密な
配列は幾何学的にも困難である。ペレット状の砥石の形
状については、扱い易さや貼り付け加工の容易さから見
て直径7ないし20mmの円柱状の形状とすることが好
ましい。
The upper and lower stools, which are formed by attaching a grindstone to form a polishing surface according to the present invention, are formed on the stool surface of an ordinary double-side polishing machine, for example, in the form of segments or pellets, for example, diamond, alumina, Although a grindstone to which abrasive grains such as silicon carbide or boron nitride are fixed is adhered, diamond abrasive grains having particularly high polishing power are often used in processing glass and the like. Examples of the binder include those using metals, resins, ceramics, and the like, and particularly preferably a metal bond grindstone using a metal as a binder is often used. The shape is preferably a pellet. That is, in the present invention, a plurality of metal-bonded pellet-shaped diamond grindstones are attached and used with emphasis on high grinding force and durability. The pellet-shaped whetstone mentioned here is a small column-shaped whetstone having a cross-sectional shape such as a circle, an ellipse, a rhombus, and a rectangle, which is adhered and fixed to a surface of a platen. As a plate-like array shape,
It is arranged so that there is no loss or unevenness of contact with the workpiece during processing, and the total area occupied by the working surface of the grinding wheel is 30 to 7 times the effective working area of each of the upper and lower platens.
It is preferably in the range of 0%. If it is less than 0%, it is easy to cause a drop or a spot in processing, and further dense arrangement is difficult geometrically. The shape of the pellet-shaped grindstone is preferably a columnar shape having a diameter of 7 to 20 mm from the viewpoint of easiness of handling and bonding.

【0018】また、本発明にいうペレット状ダイヤモン
ド砥石を構成するダイヤモンド砥粒としては、JISR
6001に定める研磨材の粒度の規定において1000
番よりも細かいものが用いられる。例えば、ガラスの材
質がソーダライムガラス(通称青板)の場合であれば3
000番程度の高番手が使用できるが、硬度の高い結晶
化ガラス等の場合は1000番〜2000番程度のもの
を使用した方がより優れた加工結果が期待できる。さら
に、この砥粒を固定する結合材としても、金属、樹脂、
セラミックス等様々なものを挙げることができるが特に
金属を結合材としたメタルボンド砥石が多用される。
The diamond abrasive grains constituting the pellet-shaped diamond grinding stone according to the present invention include JISR
1000 in the definition of the particle size of the abrasive defined in 6001
Finer than the turn is used. For example, if the glass material is soda lime glass (commonly known as blue plate), 3
A high count of about 000 can be used, but in the case of crystallized glass having a high hardness, a better processing result can be expected by using a glass of about 1,000 to 2,000. Furthermore, as a bonding material for fixing the abrasive grains, metals, resins,
Various materials such as ceramics can be mentioned, but a metal bond grindstone using a metal as a binder is often used.

【0019】本発明に用いる修正砥石としては、特に限
定を受けるものではないが、比較的剛性の強いもの、具
体的にはレジノイド系あるいはビトリファイド系の砥石
で砥粒として、JISR6001に定める研磨材の粒度
の規定において400番よりも細かい番手のアルミナ系
あるいは炭化珪素系のものを用いることが好ましい。ま
た修正キャリアとしては例えば鋳物製の鉄製ブロックを
用い、これにアルミナ系あるいは炭化珪素系の砥粒粒子
を水に分散したスラリー状の液を供給しながら用いる。
The modified grindstone used in the present invention is not particularly limited, but is relatively rigid, specifically a resinoid or vitrified grindstone, and is used as an abrasive in accordance with JISR6001. It is preferable to use an alumina-based or silicon-carbide-based finer finer than 400 in the definition of the particle size. As the correction carrier, for example, a cast iron block is used, and a slurry-like liquid in which alumina-based or silicon carbide-based abrasive grains are dispersed in water is supplied to the block.

【0020】本発明になる研磨作用面の修正方法の肝要
は、磨滅変形した作用面の形状の修正を修正キャリアの
作用で行なった後、修正砥石を用いてダイヤモンド砥石
の表面を研磨する工程において、更新され砥石表面に露
出した新しいダイヤモンド砥粒が、修正砥石の回転方向
を制御することによって、方向性を持たないようにする
ことにある。具体的には、前述した通り修正砥石をある
一定方向に回転(これを正転とする)させて砥石面の研
磨を行なったのち、その砥石を前とは逆の方向に回転
(逆転)させるのである。即ち、正転のみの修正作業に
より、砥石作用面上に露出したダイヤモンド砥粒の先端
は一定方向に傾斜するが、逆転することによりその傾き
が修正され、方向性のない目が形成される。よって、面
出し直後の立上り研磨においても研磨抵抗が異常に高く
ならず、正常な加工が可能となる。
The essential point of the method for correcting a polishing working surface according to the present invention is that in the step of correcting the shape of the worn and deformed working surface by the action of a correction carrier, and then polishing the surface of the diamond whetstone using the correction whetstone. Another object of the present invention is to prevent a new diamond abrasive grain updated and exposed on the surface of a grinding wheel from having a directionality by controlling a rotation direction of a correction grinding wheel. Specifically, as described above, after the grinding wheel surface is polished by rotating the correction grindstone in a certain direction (this is defined as normal rotation), the grindstone is rotated (reverse rotation) in a direction opposite to the previous direction. It is. That is, the tip of the diamond abrasive grain exposed on the grinding wheel working surface is inclined in a certain direction by the correction operation only in the normal rotation, but the inclination is corrected by the reverse rotation to form a non-directional eye. Therefore, the polishing resistance does not become abnormally high even in the rising polishing immediately after the surface is exposed, and normal processing can be performed.

【0021】[0021]

【実施例および比較例】以下実施例および比較例をもっ
て、本発明方法を具体的に説明するが、特にこれにより
限定を受けるものではない。本実施例において用いられ
る加工機はスピードファム社製12B−8型両面機であ
り、メタルボンド#1500のダイヤモンドペレット砥
石を上記両面加工機の上下定盤に各々接着配列して用い
る。この加工機を用いて2.5インチの青板ガラス製の
磁気ディスク基板のルーチンの加工を行なう。この加工
における加工圧力はゲージ圧で200kgとし、一回の
加工バッチにて一回に64枚のワークの加工を行なう。
約1月間の連続加工の後、形状の狂った定盤の作用基準
面の修正をまず鋳物製の修正キャリアにて行なった。目
的とする基準面を修正キャリアを用いてGC#2500
の砥粒を供給しつつ形成した。しかる後WA#800レ
ジノイド系修正砥石を用いて砥石作用面の面出しを下定
盤10.0rpm、上定盤−3.3rpmの回転条件で
行なった。この状態をA状態(本発明比較例)とする。
更に全てのモーターの回転方向を逆転させ、他の条件は
変えずに5分間の面出しを行なった。この状態をB状態
(本発明実施例)とする。
EXAMPLES and COMPARATIVE EXAMPLES The method of the present invention will be specifically described with reference to Examples and Comparative Examples, but the present invention is not particularly limited thereby. The processing machine used in the present embodiment is a 12B-8 type double-sided machine manufactured by Speed Fam Co., Ltd. In this method, a diamond pellet grindstone of Metal Bond # 1500 is used by bonding and arranging the upper and lower platens of the double-sided processing machine. Using this processing machine, routine processing of a 2.5-inch soda lime glass magnetic disk substrate is performed. The processing pressure in this processing is set to a gauge pressure of 200 kg, and 64 workpieces are processed at one time in one processing batch.
After approximately one month of continuous processing, the working reference surface of the platen having an irregular shape was first corrected using a correction carrier made of casting. GC # 2500 using a correction carrier for the target reference plane
While supplying the abrasive grains. Thereafter, using a WA # 800 resinoid-based modified grindstone, the working surface of the grindstone was exposed under the rotation conditions of a lower platen of 10.0 rpm and an upper platen of -3.3 rpm. This state is referred to as state A (Comparative Example of the present invention).
Furthermore, the rotation directions of all the motors were reversed, and the surface was exposed for 5 minutes without changing other conditions. This state is referred to as state B (Example of the present invention).

【0022】以上のような状態での、正方向および逆方
向でのワークの摩擦抵抗を測定した結果、表1に示す通
りの値が得られた。
The frictional resistance of the workpiece in the normal direction and the reverse direction in the above state was measured, and the results shown in Table 1 were obtained.

【0023】[0023]

【表1】 [Table 1]

【0024】A状態で正方向へ上述の青板ガラス製の磁
気ディスク基板を回転して加工を行なった場合、研磨抵
抗が高くキャリアが破損した。また、逆方向へ回転して
加工を行なった場合は、研磨抵抗は低いものの全く研磨
加工が進まなかった。また、B状態の場合は正逆いずれ
の場合も研磨抵抗に差がなく、実際の青板ガラス製の磁
気ディスク基板の加工を行なった所、第1回目のバッチ
から正常な加工が行なうことができ、Raで0.2μm
の加工面を得ることができた。
When the above-mentioned magnetic disk substrate made of soda lime glass was rotated in the positive direction in the state A to perform the processing, the polishing resistance was high and the carrier was damaged. Further, when the polishing was performed by rotating in the opposite direction, the polishing did not proceed at all, though the polishing resistance was low. In the case of state B, there is no difference in the polishing resistance in both the forward and reverse cases. When the actual processing of the magnetic disk substrate made of blue sheet glass was performed, normal processing can be performed from the first batch. 0.2 μm in Ra
The machined surface could be obtained.

【0025】[0025]

【発明の効果】従来の方法で修正を行なった砥石定盤の
研磨作用面が極端な方向性を持ち、実際の加工が行なえ
るまでには多量のダミーワークを流すことが必要である
のに対して、本発明方法にて修正した砥石作用面を持つ
ペレット状のダイヤモンド砥石を貼付した砥石定盤は方
向性を持たず、最初の第1バッチより通常の加工が可能
であり、時間的にも経済的にも極めて有利な方法である
ことが確認できた。
According to the present invention, the polishing surface of the grindstone surface plate modified by the conventional method has an extreme directionality, and it is necessary to flow a large amount of dummy work before the actual processing can be performed. On the other hand, a grinding wheel surface plate on which a pellet-shaped diamond grinding wheel having a grinding wheel working surface modified by the method of the present invention is attached has no directionality, and normal processing can be performed from the first first batch. It was also confirmed that the method was very economically advantageous.

【図面の簡単な説明】[Brief description of the drawings]

【図1】両面加工機にワークを装着した状態を示す要部
断面説明図である。
FIG. 1 is an explanatory sectional view of a main part showing a state in which a work is mounted on a double-sided processing machine.

【図2】両面加工機に修正砥石を装着した状態を示す要
部断面説明図である。
FIG. 2 is an explanatory sectional view of a main part showing a state in which a correction grindstone is mounted on a double-sided processing machine.

【符号の説明】[Explanation of symbols]

1 上定盤 2 下定盤 3 把持板 4
ペレット状砥石 5 ガラス被加工体 6 スラリー供給孔 7
修正砥石 8 太陽車 9 インターナルギア
1 upper surface plate 2 lower surface plate 3 gripping plate 4
Pellet-shaped whetstone 5 Glass workpiece 6 Slurry supply hole 7
Correction whetstone 8 Sun wheel 9 Internal gear

───────────────────────────────────────────────────── フロントページの続き (72)発明者 田崎 美智明 神奈川県綾瀬市早川2647 スピードファム 株式会社内 Fターム(参考) 3C047 AA18 AA21 BB01 EE02 3C058 AA04 AA16 AB01 AB04 BC01 CA06 CB01 DA09  ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Michiaki Tazaki 2647 Hayakawa, Ayase-shi, Kanagawa Prefecture Speed Fam Co., Ltd. F-term (reference) 3C047 AA18 AA21 BB01 EE02 3C058 AA04 AA16 AB01 AB04 BC01 CA06 CB01 DA09

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】回転可能な上下両定盤に砥石を貼付けて研
磨作用面を構成した両面研磨加工機の上下両砥石定盤の
間に、修正砥石を挾持し圧接しながら、前記上下両砥石
定盤および修正砥石を回転させ、前記砥石で構成される
上下両砥石定盤の研磨作用面を修正する方法において、
前記修正砥石を所定の方向に一定時間回転した後、回転
方向を逆にして回転を行なうことを特徴とする前記砥石
定盤の研磨作用面の修正方法。
1. A grinding wheel is attached to upper and lower rotatable surfaces of a double-sided polishing machine in which a grindstone is stuck to upper and lower rotatable surfaces of a rotatable polishing machine. In the method of rotating the surface plate and the correction whetstone, and correcting the polishing action surface of the upper and lower whetstone surface plate composed of the whetstone,
A method of repairing a polishing surface of the grinding wheel surface plate, wherein the grinding wheel is rotated in a predetermined direction for a predetermined time and then rotated in a reverse direction.
【請求項2】修正砥石がレジノイド系あるいはビトリフ
ァイド系の剛性砥石であることを特徴とする請求項第1
項記載の砥石定盤の研磨作用面の修正方法。
2. The method according to claim 1, wherein the modified grinding wheel is a rigid grinding wheel of resinoid or vitrified type.
The method for correcting the polishing surface of the grinding wheel surface plate described in the above item.
【請求項3】修正砥石が、砥粒としてJISR6001
に定める研磨材の粒度の規定において400番よりも細
かい番手のものであることを特徴とする請求項第1項お
よび第2項に記載の砥石定盤の研磨作用面の修正方法。
3. The modified grinding stone as abrasive grains according to JISR6001
3. The method according to claim 1, wherein the abrasive has a finer number than 400 in the definition of the particle size of the abrasive.
【請求項4】上下両定盤が、複数個のペレット状のダイ
ヤモンド砥石を貼付したものよりなることを特徴とする
請求項第1項ないし4項記載の砥石定盤の研磨作用面の
修正方法。
4. The method of claim 1, wherein each of the upper and lower platens is formed by attaching a plurality of pellet-shaped diamond whetstones. .
【請求項5】上下両定盤および修正砥石を駆動する太陽
車ギアとインターナルギアを駆動する全てのモーターの
回転が、正逆いずれの方向にも切り替えを可能としたも
のであることを特徴とする砥石定盤の研磨作用面修正用
装置。
5. The rotation of both motors for driving both the upper and lower stools and the sun wheel gear and the internal gear for driving the correction grindstone can be switched in both forward and reverse directions. For repairing the polishing surface of a grinding wheel surface plate.
JP10327045A 1998-11-17 1998-11-17 Flush mounting method and device of grinding wheel surface plate in double-sided work machine Pending JP2000153458A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10327045A JP2000153458A (en) 1998-11-17 1998-11-17 Flush mounting method and device of grinding wheel surface plate in double-sided work machine

Publications (1)

Publication Number Publication Date
JP2000153458A true JP2000153458A (en) 2000-06-06

Family

ID=18194703

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Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009154232A (en) * 2007-12-26 2009-07-16 Hoya Corp Method of manufacturing glass substrate for magnetic disk
JP2011014177A (en) * 2009-06-30 2011-01-20 Hoya Corp Method for manufacturing glass substrate for magnetic disk
CN102343551A (en) * 2010-07-28 2012-02-08 硅电子股份公司 Method and apparatus for trimming working layers of double-side grinding apparatus
JP2016129928A (en) * 2015-01-14 2016-07-21 ジルトロニック アクチエンゲゼルシャフトSiltronic AG Method of dressing polishing pad

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009154232A (en) * 2007-12-26 2009-07-16 Hoya Corp Method of manufacturing glass substrate for magnetic disk
JP2011014177A (en) * 2009-06-30 2011-01-20 Hoya Corp Method for manufacturing glass substrate for magnetic disk
CN102343551A (en) * 2010-07-28 2012-02-08 硅电子股份公司 Method and apparatus for trimming working layers of double-side grinding apparatus
JP2012030353A (en) * 2010-07-28 2012-02-16 Siltronic Ag Method for trimming two working layers, and trimming device
US8911281B2 (en) 2010-07-28 2014-12-16 Siltronic Ag Method for trimming the working layers of a double-side grinding apparatus
US8986070B2 (en) 2010-07-28 2015-03-24 Siltronic Ag Method for trimming the working layers of a double-side grinding apparatus
US9011209B2 (en) 2010-07-28 2015-04-21 Siltronic Ag Method and apparatus for trimming the working layers of a double-side grinding apparatus
JP2016129928A (en) * 2015-01-14 2016-07-21 ジルトロニック アクチエンゲゼルシャフトSiltronic AG Method of dressing polishing pad
KR101928221B1 (en) * 2015-01-14 2018-12-11 실트로닉 아게 Method for dressing polishing pads

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