JP2016204187A5 - - Google Patents
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- Publication number
- JP2016204187A5 JP2016204187A5 JP2015085606A JP2015085606A JP2016204187A5 JP 2016204187 A5 JP2016204187 A5 JP 2016204187A5 JP 2015085606 A JP2015085606 A JP 2015085606A JP 2015085606 A JP2015085606 A JP 2015085606A JP 2016204187 A5 JP2016204187 A5 JP 2016204187A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- abrasive grains
- epitaxial wafer
- manufacturing
- slurry containing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 21
- 239000006061 abrasive grain Substances 0.000 claims 7
- 238000004519 manufacturing process Methods 0.000 claims 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 4
- 239000004744 fabric Substances 0.000 claims 4
- 229910052710 silicon Inorganic materials 0.000 claims 4
- 239000010703 silicon Substances 0.000 claims 4
- 239000002002 slurry Substances 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 3
- 239000007864 aqueous solution Substances 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- 229920005830 Polyurethane Foam Polymers 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000011496 polyurethane foam Substances 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015085606A JP6234957B2 (ja) | 2015-04-20 | 2015-04-20 | エピタキシャルウェーハの製造方法 |
| PCT/JP2016/001183 WO2016170721A1 (ja) | 2015-04-20 | 2016-03-04 | エピタキシャルウェーハの製造方法 |
| TW105106854A TW201708632A (zh) | 2015-04-20 | 2016-03-07 | 磊晶晶圓的製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015085606A JP6234957B2 (ja) | 2015-04-20 | 2015-04-20 | エピタキシャルウェーハの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016204187A JP2016204187A (ja) | 2016-12-08 |
| JP2016204187A5 true JP2016204187A5 (enrdf_load_stackoverflow) | 2017-03-02 |
| JP6234957B2 JP6234957B2 (ja) | 2017-11-22 |
Family
ID=57143054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015085606A Active JP6234957B2 (ja) | 2015-04-20 | 2015-04-20 | エピタキシャルウェーハの製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6234957B2 (enrdf_load_stackoverflow) |
| TW (1) | TW201708632A (enrdf_load_stackoverflow) |
| WO (1) | WO2016170721A1 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6635088B2 (ja) * | 2017-04-24 | 2020-01-22 | 信越半導体株式会社 | シリコンウエーハの研磨方法 |
| DE102017210423A1 (de) | 2017-06-21 | 2018-12-27 | Siltronic Ag | Verfahren, Steuerungssystem und Anlage zum Bearbeiten einer Halbleiterscheibe sowie Halbleiterscheibe |
| WO2019043890A1 (ja) * | 2017-08-31 | 2019-03-07 | 株式会社Sumco | 半導体ウェーハの製造方法 |
| CN112703581A (zh) | 2018-09-25 | 2021-04-23 | 日产化学株式会社 | 使载体的磨损减轻的硅片的研磨方法及用于其的研磨液 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004195571A (ja) * | 2002-12-17 | 2004-07-15 | Noritake Co Ltd | 両面研磨機用ワークキャリア及びその製造方法 |
| JP2010021487A (ja) * | 2008-07-14 | 2010-01-28 | Sumco Corp | 半導体ウェーハおよびその製造方法 |
| JP5401683B2 (ja) * | 2008-08-01 | 2014-01-29 | 株式会社Ｓｕｍｃｏ | 両面鏡面半導体ウェーハおよびその製造方法 |
| JP5644401B2 (ja) * | 2010-11-15 | 2014-12-24 | 株式会社Sumco | エピタキシャルウェーハの製造方法およびエピタキシャルウェーハ |
| JP5768554B2 (ja) * | 2011-07-21 | 2015-08-26 | 旭硝子株式会社 | 磁気記録媒体用ガラス基板の製造方法および磁気記録媒体用ガラス基板 |
| KR20140098761A (ko) * | 2011-11-16 | 2014-08-08 | 닛산 가가쿠 고교 가부시키 가이샤 | 반도체 웨이퍼용 연마액 조성물 |
-
2015
- 2015-04-20 JP JP2015085606A patent/JP6234957B2/ja active Active
-
2016
- 2016-03-04 WO PCT/JP2016/001183 patent/WO2016170721A1/ja active Application Filing
- 2016-03-07 TW TW105106854A patent/TW201708632A/zh unknown
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