IN2012DN00988A - - Google Patents

Info

Publication number
IN2012DN00988A
IN2012DN00988A IN988DEN2012A IN2012DN00988A IN 2012DN00988 A IN2012DN00988 A IN 2012DN00988A IN 988DEN2012 A IN988DEN2012 A IN 988DEN2012A IN 2012DN00988 A IN2012DN00988 A IN 2012DN00988A
Authority
IN
India
Application number
Other languages
English (en)
Inventor
Le Toquin Ronan
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Publication of IN2012DN00988A publication Critical patent/IN2012DN00988A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
IN988DEN2012 2009-07-06 2012-02-03 IN2012DN00988A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/498,253 US8415692B2 (en) 2009-07-06 2009-07-06 LED packages with scattering particle regions
PCT/US2010/001852 WO2011005300A1 (en) 2009-07-06 2010-06-28 Led packages with scattering particle regions

Publications (1)

Publication Number Publication Date
IN2012DN00988A true IN2012DN00988A (zh) 2015-04-10

Family

ID=43014543

Family Applications (1)

Application Number Title Priority Date Filing Date
IN988DEN2012 IN2012DN00988A (zh) 2009-07-06 2012-02-03

Country Status (8)

Country Link
US (1) US8415692B2 (zh)
EP (1) EP2452374B1 (zh)
JP (1) JP5676599B2 (zh)
KR (1) KR20120097477A (zh)
CN (1) CN102473822B (zh)
IN (1) IN2012DN00988A (zh)
TW (1) TW201130169A (zh)
WO (1) WO2011005300A1 (zh)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8946987B2 (en) * 2007-11-07 2015-02-03 Industrial Technology Research Institute Light emitting device and fabricating method thereof
JP2010231938A (ja) * 2009-03-26 2010-10-14 Panasonic Electric Works Co Ltd Ｌｅｄ照明装置
BRPI1007686B1 (pt) 2009-05-19 2019-11-05 Koninl Philips Electronics Nv sistema de iluminação
KR20110080318A (ko) * 2010-01-05 2011-07-13 엘지이노텍 주식회사 발광 소자 패키지
US8632196B2 (en) 2010-03-03 2014-01-21 Cree, Inc. LED lamp incorporating remote phosphor and diffuser with heat dissipation features
US8562161B2 (en) 2010-03-03 2013-10-22 Cree, Inc. LED based pedestal-type lighting structure
CN102237469A (zh) * 2010-04-29 2011-11-09 展晶科技(深圳)有限公司 发光二极管的封装结构
US10451251B2 (en) 2010-08-02 2019-10-22 Ideal Industries Lighting, LLC Solid state lamp with light directing optics and diffuser
US9048396B2 (en) 2012-06-11 2015-06-02 Cree, Inc. LED package with encapsulant having planar surfaces
US11251164B2 (en) 2011-02-16 2022-02-15 Creeled, Inc. Multi-layer conversion material for down conversion in solid state lighting
US8742654B2 (en) * 2011-02-25 2014-06-03 Cree, Inc. Solid state light emitting devices including nonhomogeneous luminophoric particle size layers
CN102683542B (zh) * 2011-03-15 2014-12-10 展晶科技(深圳)有限公司 Led封装结构
US10147853B2 (en) 2011-03-18 2018-12-04 Cree, Inc. Encapsulant with index matched thixotropic agent
TWI433361B (zh) * 2011-04-06 2014-04-01 Lustrous Green Technology Of Lighting 用於增加均光效果的發光二極體封裝結構
US9029887B2 (en) 2011-04-22 2015-05-12 Micron Technology, Inc. Solid state lighting devices having improved color uniformity and associated methods
TWI505515B (zh) * 2011-08-19 2015-10-21 Epistar Corp 發光裝置及其製造方法
WO2013056009A1 (en) 2011-10-13 2013-04-18 Intematix Corporation Photoluminescence wavelength conversion components for solid-state light emitting devices and lamps
EP4044264B1 (en) * 2011-10-24 2024-01-03 Seoul Semiconductor Co., Ltd. White light source and white light source system using white light source
CN102437276A (zh) * 2011-11-25 2012-05-02 四川新力光源有限公司 一种led器件及其制作方法
US8733969B2 (en) 2012-01-22 2014-05-27 Ecolivegreen Corp. Gradient diffusion globe LED light and fixture for the same
US8801228B2 (en) * 2012-03-15 2014-08-12 Tsmc Solid State Lighting Ltd. Changing LED light output distribution through coating configuration
JP5661671B2 (ja) * 2012-03-26 2015-01-28 株式会社東芝 半導体発光素子
TWI518948B (zh) * 2012-06-08 2016-01-21 Unity Opto Technology Co Ltd To enhance the luminous angle of the small size of the LED package to improve the structure
US20130329429A1 (en) * 2012-06-11 2013-12-12 Cree, Inc. Emitter package with integrated mixing chamber
US9887327B2 (en) 2012-06-11 2018-02-06 Cree, Inc. LED package with encapsulant having curved and planar surfaces
US10424702B2 (en) 2012-06-11 2019-09-24 Cree, Inc. Compact LED package with reflectivity layer
US10468565B2 (en) 2012-06-11 2019-11-05 Cree, Inc. LED package with multiple element light source and encapsulant having curved and/or planar surfaces
CN103515518A (zh) * 2012-06-29 2014-01-15 展晶科技(深圳)有限公司 发光二极管的封装方法
US8765500B2 (en) * 2012-08-24 2014-07-01 Tsmc Solid State Lighting Ltd. Method and apparatus for fabricating phosphor-coated LED dies
JP2014049625A (ja) * 2012-08-31 2014-03-17 Panasonic Corp Ｌｅｄモジュール
US20140159084A1 (en) * 2012-12-12 2014-06-12 Cree, Inc. Led dome with improved color spatial uniformity
JP5819335B2 (ja) * 2013-02-18 2015-11-24 株式会社東芝 半導体発光装置およびその製造方法
US8933478B2 (en) 2013-02-19 2015-01-13 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
US8754435B1 (en) 2013-02-19 2014-06-17 Cooledge Lighting Inc. Engineered-phosphor LED package and related methods
DE102013103416A1 (de) * 2013-04-05 2014-10-23 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierende Baugruppe und Verfahren zum Herstellen einer elektromagnetische Strahlung emittierenden Baugruppe
DE102013207460A1 (de) * 2013-04-24 2014-10-30 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
JP6500342B2 (ja) * 2013-04-27 2019-04-17 日亜化学工業株式会社 半導体レーザ装置の製造方法並びにサブマウントの製造方法
FR3006546B1 (fr) * 2013-05-28 2019-03-29 Sgame Module de diode electroluminescente lumiere blanche
US9461024B2 (en) 2013-08-01 2016-10-04 Cree, Inc. Light emitter devices and methods for light emitting diode (LED) chips
JP2015092529A (ja) * 2013-10-01 2015-05-14 ソニー株式会社 発光装置、発光ユニット、表示装置、電子機器、および発光素子
KR102098848B1 (ko) * 2013-10-30 2020-04-08 엘지이노텍 주식회사 발광소자 패키지
DE102013222702A1 (de) * 2013-11-08 2015-05-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement, optoelektronische Anordnung, Verfahren zum Herstellen eines optischen Elements und Verfahren zum Herstellen eines optoelektronischen Bauelements
KR102122536B1 (ko) * 2013-12-27 2020-06-29 엘지디스플레이 주식회사 이종 물질 렌즈를 구비한 액정 표시장치용 직하형 백 라이트 유닛
EP3097588B1 (en) * 2014-01-21 2021-02-24 Lumileds LLC Hybrid chip-on-board led module with patterned encapsulation and method for producing the same
US9360188B2 (en) 2014-02-20 2016-06-07 Cree, Inc. Remote phosphor element filled with transparent material and method for forming multisection optical elements
JP6292033B2 (ja) * 2014-05-29 2018-03-14 日亜化学工業株式会社 発光装置
US20170117445A1 (en) * 2014-06-12 2017-04-27 Hyosung Corporation Led package comprising rare earth metal oxide particles
KR101600695B1 (ko) * 2014-08-12 2016-03-22 주식회사 효성 방열 특성이 우수한 희토류 금속 산화물 입자를 포함하는 led 패키지
KR102424178B1 (ko) * 2014-09-02 2022-07-25 루미리즈 홀딩 비.브이. 광원
JP2016070938A (ja) * 2014-09-30 2016-05-09 敏治 吉川 非接触式３ｄスキャナー用の表面反射材
US10453825B2 (en) * 2014-11-11 2019-10-22 Cree, Inc. Light emitting diode (LED) components and methods
WO2016135006A1 (en) * 2015-02-23 2016-09-01 Koninklijke Philips N.V. Light source assembly with improved color uniformity
JP6372394B2 (ja) * 2015-02-27 2018-08-15 豊田合成株式会社 発光装置
US10217914B2 (en) * 2015-05-27 2019-02-26 Samsung Electronics Co., Ltd. Semiconductor light emitting device
DE102015116710A1 (de) * 2015-10-01 2017-04-06 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
USD793618S1 (en) 2015-12-24 2017-08-01 Semicon Light Co., Ltd. Mold for packaging semiconductor light emitting device
USD795492S1 (en) 2015-12-24 2017-08-22 Semicon Light Co., Ltd. Mold for packaging semiconductor light emitting device
USD793002S1 (en) 2015-12-24 2017-07-25 Semicon Light Co., Ltd. Mold for packaging semiconductor light emitting device
USD793001S1 (en) 2015-12-24 2017-07-25 Semicon Light Co., Ltd. Mold for packaging semiconductor light emitting device
TWI588984B (zh) 2016-03-14 2017-06-21 群創光電股份有限公司 顯示裝置
KR20170124682A (ko) * 2016-05-02 2017-11-13 삼성디스플레이 주식회사 표시 장치
US10883045B2 (en) 2016-05-02 2021-01-05 Current Lighting Solutions, Llc Phosphor materials including fluidization materials for light sources
DE102016208068A1 (de) * 2016-05-11 2017-11-16 Zumtobel Lighting Gmbh Linsen-Element zur Beeinflussung eines von einer Phosphor-LED abgegebenen Lichts, sowie Anordnung zur Lichtabgabe mit einem solchen Linsen-Element
USD830200S1 (en) 2016-05-11 2018-10-09 Semicon Light Co., Ltd. Housing for packaging semiconductor light emitting device
US10263151B2 (en) 2017-08-18 2019-04-16 Globalfoundries Inc. Light emitting diodes
US10396121B2 (en) 2017-08-18 2019-08-27 Globalfoundries Inc. FinFETs for light emitting diode displays
US20190355876A1 (en) * 2018-05-18 2019-11-21 Dominant Opto Technologies Sdn Bhd Light emitting diode (led) package
KR102117627B1 (ko) * 2018-10-30 2020-06-01 주식회사 인터원 확산렌즈가 적용된 알지비 풀 컬러 엘이디 모듈
CN114420828A (zh) * 2018-12-27 2022-04-29 隆达电子股份有限公司 发光装置
CN113795708A (zh) * 2019-05-09 2021-12-14 昕诺飞控股有限公司 使用截断球透镜的基于激光的照明的改善热管理
CN111190307A (zh) * 2019-12-13 2020-05-22 深圳市隆利科技股份有限公司 直下式背光装置及显示设备
CN111244248B (zh) * 2020-01-17 2021-09-10 盐城东山精密制造有限公司 一种增大出光角度的led封装器件及显示应用
US20230072941A1 (en) * 2020-02-20 2023-03-09 Nichia Corporation Light-emitting device and method for manufacturing same
WO2021243463A1 (en) * 2020-06-03 2021-12-09 Vuereal Inc. Color conversion solid state device
US11367810B2 (en) 2020-08-14 2022-06-21 Creeled, Inc. Light-altering particle arrangements for light-emitting devices
JP2024537703A (ja) 2021-09-21 2024-10-16 シグニファイ ホールディング ビー ヴィ 複数の光源に基づく良好な均一性を備える高強度白色光源
US20240266482A1 (en) * 2023-02-02 2024-08-08 Creeled, Inc. Material arrangements in cover structures for light-emitting diodes
WO2024213406A1 (en) * 2023-04-14 2024-10-17 Ams-Osram Ag Radiation emitting assembly and optical sensor device

Family Cites Families (194)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3760237A (en) 1972-06-21 1973-09-18 Gen Electric Solid state lamp assembly having conical light director
US4152044A (en) 1977-06-17 1979-05-01 International Telephone And Telegraph Corporation Galium aluminum arsenide graded index waveguide
FR2436505A1 (fr) 1978-09-12 1980-04-11 Radiotechnique Compelec Dispositif optoelectronique a emetteur et recepteur couples
US4511425A (en) 1983-06-13 1985-04-16 Dennison Manufacturing Company Heated pad decorator
US4675575A (en) 1984-07-13 1987-06-23 E & G Enterprises Light-emitting diode assemblies and systems therefore
FR2586844B1 (fr) 1985-08-27 1988-04-29 Sofrela Sa Dispositif de signalisation utilisant des diodes electroluminescentes.
JPS63156367A (ja) 1986-12-20 1988-06-29 Fujitsu Ltd レベル・シフト・ダイオ−ド
JPH07120807B2 (ja) 1986-12-20 1995-12-20 富士通株式会社 定電流半導体装置
US4866005A (en) 1987-10-26 1989-09-12 North Carolina State University Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide
ES2150409T3 (es) 1989-05-31 2000-12-01 Osram Opto Semiconductors Gmbh Procedimiento para montar un opto-componente que se puede montar sobre una superficie.
US4946547A (en) 1989-10-13 1990-08-07 Cree Research, Inc. Method of preparing silicon carbide surfaces for crystal growth
JPH03206672A (ja) 1990-01-08 1991-09-10 Seiwa Denki Kk 発光ダイオード素子およびその製造方法
US5167556A (en) 1990-07-03 1992-12-01 Siemens Aktiengesellschaft Method for manufacturing a light emitting diode display means
US5130761A (en) 1990-07-17 1992-07-14 Kabushiki Kaisha Toshiba Led array with reflector and printed circuit board
US5034783A (en) 1990-07-27 1991-07-23 At&T Bell Laboratories Semiconductor device including cascadable polarization independent heterostructure
US5200022A (en) 1990-10-03 1993-04-06 Cree Research, Inc. Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
US5351106A (en) 1991-07-01 1994-09-27 Amergraph Corporation Exposure system
KR100209457B1 (ko) 1992-07-24 1999-07-15 토마스 디스테파노 반도체 접속 부품과 그 제조 방법 및 반도체 칩 접속 방법
DE4228895C2 (de) 1992-08-29 2002-09-19 Bosch Gmbh Robert Kraftfahrzeug-Beleuchtungseinrichtung mit mehreren Halbleiterlichtquellen
US5790298A (en) 1994-05-03 1998-08-04 Gentex Corporation Method of forming optically transparent seal and seal formed by said method
DE4446566A1 (de) 1994-12-24 1996-06-27 Telefunken Microelectron Mehrpoliges, oberflächenmontierbares, elektronisches Bauelement
US5670798A (en) 1995-03-29 1997-09-23 North Carolina State University Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact non-nitride buffer layer and methods of fabricating same
DE69615792T2 (de) 1995-05-10 2002-05-23 Koninklijke Philips Electronics N.V., Eindhoven Miniatur-halbleiteranordnung für oberflächenmontage
DE19549818B4 (de) 1995-09-29 2010-03-18 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiter-Bauelement
DE19621124A1 (de) 1996-05-24 1997-11-27 Siemens Ag Optoelektronischer Wandler und dessen Herstellungsverfahren
JPH09321343A (ja) 1996-05-31 1997-12-12 Dowa Mining Co Ltd 光通信用の部品装置
DE19638667C2 (de) 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
TW383508B (en) 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
JPH10209569A (ja) 1997-01-16 1998-08-07 Hewlett Packard Co <Hp> ｐ型窒化物半導体装置とその製造方法
FR2759188B1 (fr) 1997-01-31 1999-04-30 Thery Hindrick Dispositif de signalisation lumineuse, notamment pour regulation du trafic routier
US5813753A (en) 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
US6784463B2 (en) 1997-06-03 2004-08-31 Lumileds Lighting U.S., Llc III-Phospide and III-Arsenide flip chip light-emitting devices
WO1999007023A1 (de) 1997-07-29 1999-02-11 Osram Opto Semiconductors Gmbh & Co. Ohg Optoelektronisches bauelement
US6183100B1 (en) 1997-10-17 2001-02-06 Truck-Lite Co., Inc. Light emitting diode 360° warning lamp
DE19755734A1 (de) 1997-12-15 1999-06-24 Siemens Ag Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes
DE19829197C2 (de) 1998-06-30 2002-06-20 Siemens Ag Strahlungsaussendendes und/oder -empfangendes Bauelement
US5959316A (en) 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US6274924B1 (en) 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
JP3334864B2 (ja) 1998-11-19 2002-10-15 松下電器産業株式会社 電子装置
US6429583B1 (en) * 1998-11-30 2002-08-06 General Electric Company Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors
JP4279388B2 (ja) 1999-01-29 2009-06-17 日亜化学工業株式会社 光半導体装置及びその形成方法
US6259608B1 (en) 1999-04-05 2001-07-10 Delphi Technologies, Inc. Conductor pattern for surface mount devices and method therefor
US6389051B1 (en) 1999-04-09 2002-05-14 Xerox Corporation Structure and method for asymmetric waveguide nitride laser diode
CA2314679A1 (en) 1999-07-28 2001-01-28 William Kelly Improvements in and relating to ring lighting
US6710373B2 (en) 1999-09-27 2004-03-23 Shih-Yi Wang Means for mounting photoelectric sensing elements, light emitting diodes, or the like
US6296367B1 (en) 1999-10-15 2001-10-02 Armament Systems And Procedures, Inc. Rechargeable flashlight with step-up voltage converter and recharger therefor
US6482711B1 (en) 1999-10-28 2002-11-19 Hrl Laboratories, Llc InPSb/InAs BJT device and method of making
DE19964252A1 (de) 1999-12-30 2002-06-06 Osram Opto Semiconductors Gmbh Oberflächenmontierbares Bauelement für eine LED-Weißlichtquelle
DE10002521A1 (de) 2000-01-21 2001-08-09 Infineon Technologies Ag Elektrooptisches Datenübertragungsmodul
KR100748815B1 (ko) 2000-02-09 2007-08-13 니폰 라이츠 가부시키가이샤 광원 장치
US6224216B1 (en) 2000-02-18 2001-05-01 Infocus Corporation System and method employing LED light sources for a projection display
US6517218B2 (en) 2000-03-31 2003-02-11 Relume Corporation LED integrated heat sink
US6331944B1 (en) 2000-04-13 2001-12-18 International Business Machines Corporation Magnetic random access memory using a series tunnel element select mechanism
US6653765B1 (en) 2000-04-17 2003-11-25 General Electric Company Uniform angular light distribution from LEDs
WO2001082386A1 (fr) 2000-04-24 2001-11-01 Rohm Co., Ltd. Dispositif semi-conducteur electroluminescent a emission laterale et son procede de production
EP1206802B1 (de) 2000-05-29 2008-03-19 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Weiss emittierende beleuchtungseinheit auf led-basis
JP2002057376A (ja) 2000-05-31 2002-02-22 Matsushita Electric Ind Co Ltd Ｌｅｄランプ
US6526082B1 (en) 2000-06-02 2003-02-25 Lumileds Lighting U.S., Llc P-contact for GaN-based semiconductors utilizing a reverse-biased tunnel junction
US6331915B1 (en) 2000-06-13 2001-12-18 Kenneth J. Myers Lighting element including light emitting diodes, microprism sheet, reflector, and diffusing agent
US6330111B1 (en) 2000-06-13 2001-12-11 Kenneth J. Myers, Edward Greenberg Lighting elements including light emitting diodes, microprism sheet, reflector, and diffusing agent
US6737801B2 (en) 2000-06-28 2004-05-18 The Fox Group, Inc. Integrated color LED chip
JP2002050797A (ja) 2000-07-31 2002-02-15 Toshiba Corp 半導体励起蛍光体発光装置およびその製造方法
DE10041328B4 (de) 2000-08-23 2018-04-05 Osram Opto Semiconductors Gmbh Verpackungseinheit für Halbleiterchips
EP1187226B1 (en) 2000-09-01 2012-12-26 Citizen Electronics Co., Ltd. Surface-mount type light emitting diode and method of manufacturing same
JP3839236B2 (ja) 2000-09-18 2006-11-01 株式会社小糸製作所 車両用灯具
JP2002151928A (ja) 2000-11-08 2002-05-24 Toshiba Corp アンテナ、及びアンテナを内蔵する電子機器
AT410266B (de) 2000-12-28 2003-03-25 Tridonic Optoelectronics Gmbh Lichtquelle mit einem lichtemittierenden element
US20020084745A1 (en) * 2000-12-29 2002-07-04 Airma Optoelectronics Corporation Light emitting diode with light conversion by dielectric phosphor powder
US6940704B2 (en) 2001-01-24 2005-09-06 Gelcore, Llc Semiconductor light emitting device
MY131962A (en) 2001-01-24 2007-09-28 Nichia Corp Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
US6746889B1 (en) 2001-03-27 2004-06-08 Emcore Corporation Optoelectronic device with improved light extraction
CA2442985C (en) 2001-03-30 2016-05-31 The Regents Of The University Of California Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
IE20020300A1 (en) 2001-04-23 2003-03-19 Plasma Ireland Ltd An Illuminator
US6686676B2 (en) 2001-04-30 2004-02-03 General Electric Company UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same
US20020163001A1 (en) 2001-05-04 2002-11-07 Shaddock David Mulford Surface mount light emitting device package and fabrication method
JP2002344029A (ja) 2001-05-17 2002-11-29 Rohm Co Ltd 発光ダイオードの色調調整方法
JP2002374007A (ja) 2001-06-15 2002-12-26 Toyoda Gosei Co Ltd 発光装置
TW543128B (en) 2001-07-12 2003-07-21 Highlink Technology Corp Surface mounted and flip chip type LED package
US20030015708A1 (en) 2001-07-23 2003-01-23 Primit Parikh Gallium nitride based diodes with low forward voltage and low reverse current operation
CN2498694Y (zh) 2001-08-14 2002-07-03 北京利亚德电子科技有限公司 一种带倾角的led像素模块
TW511303B (en) 2001-08-21 2002-11-21 Wen-Jr He A light mixing layer and method
US6812481B2 (en) 2001-09-03 2004-11-02 Toyoda Gosei Co., Ltd. LED device and manufacturing method thereof
US6833564B2 (en) 2001-11-02 2004-12-21 Lumileds Lighting U.S., Llc Indium gallium nitride separate confinement heterostructure light emitting devices
DE10241989A1 (de) 2001-11-30 2003-06-18 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
TW200305283A (en) 2001-12-06 2003-10-16 Hrl Lab Llc High power-low noise microwave GaN heterojunction field effet transistor
JP4009097B2 (ja) 2001-12-07 2007-11-14 日立電線株式会社 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム
KR100439402B1 (ko) 2001-12-24 2004-07-09 삼성전기주식회사 발광다이오드 패키지
US6480389B1 (en) 2002-01-04 2002-11-12 Opto Tech Corporation Heat dissipation structure for solid-state light emitting device package
JP3973082B2 (ja) 2002-01-31 2007-09-05 シチズン電子株式会社 両面発光ｌｅｄパッケージ
US6878975B2 (en) 2002-02-08 2005-04-12 Agilent Technologies, Inc. Polarization field enhanced tunnel structures
US6924514B2 (en) 2002-02-19 2005-08-02 Nichia Corporation Light-emitting device and process for producing thereof
JP3939177B2 (ja) 2002-03-20 2007-07-04 シャープ株式会社 発光装置の製造方法
US7262434B2 (en) 2002-03-28 2007-08-28 Rohm Co., Ltd. Semiconductor device with a silicon carbide substrate and ohmic metal layer
DE50309259D1 (de) 2002-05-06 2008-04-10 Osram Opto Semiconductors Gmbh Wellenlängenkonvertierende reaktionsharzmasse und leuchtdiodenbauelement
TWI226357B (en) 2002-05-06 2005-01-11 Osram Opto Semiconductors Gmbh Wavelength-converting reaction-resin, its production method, light-radiating optical component and light-radiating semiconductor-body
US6870311B2 (en) 2002-06-07 2005-03-22 Lumileds Lighting U.S., Llc Light-emitting devices utilizing nanoparticles
WO2004001862A1 (ja) 2002-06-19 2003-12-31 Sanken Electric Co., Ltd. 半導体発光装置及びその製法並びに半導体発光装置用リフレクタ
TW546799B (en) 2002-06-26 2003-08-11 Lingsen Precision Ind Ltd Packaged formation method of LED and product structure
DE10229067B4 (de) 2002-06-28 2007-08-16 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
JP2004047748A (ja) 2002-07-12 2004-02-12 Stanley Electric Co Ltd 発光ダイオード
US7224000B2 (en) 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
US7244965B2 (en) 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
US7264378B2 (en) 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
DE10243247A1 (de) 2002-09-17 2004-04-01 Osram Opto Semiconductors Gmbh Leadframe-basiertes Bauelement-Gehäuse, Leadframe-Band, oberflächenmontierbares elektronisches Bauelement und Verfahren zur Herstellung
US6686609B1 (en) 2002-10-01 2004-02-03 Ultrastar Limited Package structure of surface mounting led and method of manufacturing the same
DE10255932A1 (de) 2002-11-29 2004-06-17 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US7692206B2 (en) 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
KR100495215B1 (ko) 2002-12-27 2005-06-14 삼성전기주식회사 수직구조 갈륨나이트라이드 발광다이오드 및 그 제조방법
JP4603368B2 (ja) 2003-02-28 2010-12-22 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 構造化された金属被覆を施されたパッケージボディを有するオプトエレクトロニクス素子、この種の素子を製作する方法、およびプラスチックを含むボディに、構造化された金属被覆を施す方法
JP4377600B2 (ja) 2003-03-24 2009-12-02 株式会社東芝 ３族窒化物半導体の積層構造、その製造方法、及び３族窒化物半導体装置
JP4504662B2 (ja) 2003-04-09 2010-07-14 シチズン電子株式会社 Ｌｅｄランプ
JP4274843B2 (ja) 2003-04-21 2009-06-10 シャープ株式会社 Ｌｅｄデバイスおよびそれを用いた携帯電話機器、デジタルカメラおよびｌｃｄ表示装置
US7087936B2 (en) 2003-04-30 2006-08-08 Cree, Inc. Methods of forming light-emitting devices having an antireflective layer that has a graded index of refraction
EP1620903B1 (en) 2003-04-30 2017-08-16 Cree, Inc. High-power solid state light emitter package
US7005679B2 (en) 2003-05-01 2006-02-28 Cree, Inc. Multiple component solid state white light
US7021797B2 (en) 2003-05-13 2006-04-04 Light Prescriptions Innovators, Llc Optical device for repositioning and redistributing an LED's light
JP2004356506A (ja) 2003-05-30 2004-12-16 Stanley Electric Co Ltd ガラス封止型発光ダイオード
JP4120813B2 (ja) 2003-06-12 2008-07-16 セイコーエプソン株式会社 光学部品およびその製造方法
TWI312582B (en) 2003-07-24 2009-07-21 Epistar Corporatio Led device, flip-chip led package and light reflecting structure
JP4360858B2 (ja) 2003-07-29 2009-11-11 シチズン電子株式会社 表面実装型ｌｅｄ及びそれを用いた発光装置
US6876008B2 (en) 2003-07-31 2005-04-05 Lumileds Lighting U.S., Llc Mount for semiconductor light emitting device
JP2005064047A (ja) 2003-08-13 2005-03-10 Citizen Electronics Co Ltd 発光ダイオード
US6995402B2 (en) 2003-10-03 2006-02-07 Lumileds Lighting, U.S., Llc Integrated reflector cup for a light emitting device mount
US20050077535A1 (en) 2003-10-08 2005-04-14 Joinscan Electronics Co., Ltd LED and its manufacturing process
CN2646873Y (zh) 2003-10-16 2004-10-06 上海三思科技发展有限公司 表面贴装式、光轴倾斜的发光二极管
TWI291770B (en) * 2003-11-14 2007-12-21 Hon Hai Prec Ind Co Ltd Surface light source device and light emitting diode
JP2006032885A (ja) 2003-11-18 2006-02-02 Sharp Corp 光源装置およびそれを用いた光通信装置
US6932497B1 (en) 2003-12-17 2005-08-23 Jean-San Huang Signal light and rear-view mirror arrangement
US7102152B2 (en) 2004-10-14 2006-09-05 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Device and method for emitting output light using quantum dots and non-quantum fluorescent material
JP4442216B2 (ja) 2003-12-19 2010-03-31 豊田合成株式会社 Ｌｅｄランプ装置
US7321161B2 (en) 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature
US7170111B2 (en) 2004-02-05 2007-01-30 Cree, Inc. Nitride heterojunction transistors having charge-transfer induced energy barriers and methods of fabricating the same
US7675231B2 (en) 2004-02-13 2010-03-09 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emitting diode display device comprising a high temperature resistant overlay
JP4363215B2 (ja) 2004-02-19 2009-11-11 日亜化学工業株式会社 アルカリ土類金属アルミン酸塩蛍光体及びそれを用いた発光装置
TWI286393B (en) 2004-03-24 2007-09-01 Toshiba Lighting & Technology Lighting apparatus
US7868343B2 (en) 2004-04-06 2011-01-11 Cree, Inc. Light-emitting devices having multiple encapsulation layers with at least one of the encapsulation layers including nanoparticles and methods of forming the same
US7514867B2 (en) 2004-04-19 2009-04-07 Panasonic Corporation LED lamp provided with optical diffusion layer having increased thickness and method of manufacturing thereof
TWM258416U (en) 2004-06-04 2005-03-01 Lite On Technology Corp Power LED package module
JP4547569B2 (ja) 2004-08-31 2010-09-22 スタンレー電気株式会社 表面実装型ｌｅｄ
JP5192811B2 (ja) 2004-09-10 2013-05-08 ソウル セミコンダクター カンパニー リミテッド 多重モールド樹脂を有する発光ダイオードパッケージ
US7217583B2 (en) 2004-09-21 2007-05-15 Cree, Inc. Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension
US7488084B2 (en) 2004-10-29 2009-02-10 Pentair Water Pool And Spa, Inc. Selectable beam lens for underwater light
DE102004053116A1 (de) 2004-11-03 2006-05-04 Tridonic Optoelectronics Gmbh Leuchtdioden-Anordnung mit Farbkonversions-Material
JP2006140281A (ja) 2004-11-11 2006-06-01 Stanley Electric Co Ltd パワーｌｅｄ及びその製造方法
US7419839B2 (en) 2004-11-12 2008-09-02 Philips Lumileds Lighting Company, Llc Bonding an optical element to a light emitting device
GB2420221B (en) 2004-11-12 2009-09-09 Unity Opto Technology Co Ltd Solid-state semiconductor light emitting device
US7119422B2 (en) 2004-11-15 2006-10-10 Unity Opto Technology Co., Ltd. Solid-state semiconductor light emitting device
US8541797B2 (en) 2004-11-18 2013-09-24 Koninklijke Philips N.V. Illuminator and method for producing such illuminator
WO2006065007A1 (en) 2004-12-16 2006-06-22 Seoul Semiconductor Co., Ltd. Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method
US7285802B2 (en) 2004-12-21 2007-10-23 3M Innovative Properties Company Illumination assembly and method of making same
CN100389503C (zh) 2005-01-07 2008-05-21 北京大学 分立晶粒垂直结构的led芯片制备方法
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
JP5140922B2 (ja) 2005-01-17 2013-02-13 オムロン株式会社 発光光源及び発光光源アレイ
TWI255566B (en) 2005-03-04 2006-05-21 Jemitek Electronics Corp Led
US7994702B2 (en) 2005-04-27 2011-08-09 Prysm, Inc. Scanning beams displays based on light-emitting screens having phosphors
KR100682874B1 (ko) 2005-05-02 2007-02-15 삼성전기주식회사 백색 ｌｅｄ
JP2006324331A (ja) 2005-05-17 2006-11-30 Sony Corp 発光ダイオードおよびその製造方法ならびに集積型発光ダイオードおよびその製造方法ならびに窒化物系ｉｉｉ−ｖ族化合物半導体の成長方法ならびに窒化物系ｉｉｉ−ｖ族化合物半導体成長用基板ならびに発光ダイオードバックライトならびに発光ダイオード照明装置ならびに発光ダイオードディスプレイならびに電子機器
US7491626B2 (en) 2005-06-20 2009-02-17 Sensor Electronic Technology, Inc. Layer growth using metal film and/or islands
JP2009502024A (ja) 2005-06-27 2009-01-22 ラミナ ライティング インコーポレーテッド 発光ダイオードパッケージ及びその製造方法
KR100757196B1 (ko) 2005-08-01 2007-09-07 서울반도체 주식회사 실리콘 렌즈를 구비하는 발광소자
US7265911B2 (en) 2005-08-22 2007-09-04 Eastman Kodak Company Zoom lens system having variable power element
JP4724618B2 (ja) 2005-11-11 2011-07-13 株式会社 日立ディスプレイズ 照明装置及びそれを用いた液晶表示装置
JP4857735B2 (ja) 2005-11-28 2012-01-18 日亜化学工業株式会社 発光装置
JP2009087538A (ja) 2006-01-20 2009-04-23 Sharp Corp 光源ユニット、及びそれを用いた照明装置、及びそれを用いた表示装置
US20070170449A1 (en) 2006-01-24 2007-07-26 Munisamy Anandan Color sensor integrated light emitting diode for LED backlight
RU2407110C2 (ru) 2006-01-24 2010-12-20 Конинклейке Филипс Электроникс Н.В. Светоизлучающее устройство
DE102006005042A1 (de) * 2006-02-03 2007-08-09 Tridonic Optoelectronics Gmbh Licht emittierende Vorrichtung mit nicht-aktiviertem Leuchtstoff
USD572670S1 (en) 2006-03-30 2008-07-08 Nichia Corporation Light emitting diode
JP2007273763A (ja) 2006-03-31 2007-10-18 Sony Corp 半導体装置およびその製造方法
JP2007287981A (ja) 2006-04-18 2007-11-01 Konica Minolta Opto Inc 発光装置
JP2007299905A (ja) 2006-04-28 2007-11-15 Nichia Chem Ind Ltd 半導体装置
US20070269586A1 (en) 2006-05-17 2007-11-22 3M Innovative Properties Company Method of making light emitting device with silicon-containing composition
KR100904152B1 (ko) 2006-06-30 2009-06-25 서울반도체 주식회사 히트싱크 지지부를 갖는 리드프레임, 그것을 사용한 발광다이오드 패키지 제조방법 및 그것에 의해 제조된 발광다이오드 패키지
US7960819B2 (en) 2006-07-13 2011-06-14 Cree, Inc. Leadframe-based packages for solid state emitting devices
TWM303325U (en) 2006-07-13 2006-12-21 Everlight Electronics Co Ltd Light emitting diode package
US7820075B2 (en) 2006-08-10 2010-10-26 Intematix Corporation Phosphor composition with self-adjusting chromaticity
USD572210S1 (en) 2006-11-01 2008-07-01 Lg Innotek Co., Ltd. Light-emitting diode (LED)
US7999283B2 (en) 2007-06-14 2011-08-16 Cree, Inc. Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes
USD576574S1 (en) 2007-07-17 2008-09-09 Rohm Co., Ltd. Light emitting diode module
US11114594B2 (en) * 2007-08-24 2021-09-07 Creeled, Inc. Light emitting device packages using light scattering particles of different size
US7791093B2 (en) 2007-09-04 2010-09-07 Koninklijke Philips Electronics N.V. LED with particles in encapsulant for increased light extraction and non-yellow off-state color
CN101388161A (zh) 2007-09-14 2009-03-18 科锐香港有限公司 Led表面安装装置和并入有此装置的led显示器
TW200921929A (en) * 2007-11-02 2009-05-16 Innolux Display Corp Light emitting diode
US7524087B1 (en) 2007-11-16 2009-04-28 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Optical device
RU2481672C2 (ru) 2007-12-11 2013-05-10 Конинклейке Филипс Электроникс Н.В. Устройство для бокового излучения с гибридным верхним отражателем
CN101567366A (zh) 2008-04-25 2009-10-28 展晶科技(深圳)有限公司 发光二极管
US8049230B2 (en) 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
DE102008064073A1 (de) 2008-12-19 2010-06-24 Osram Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung einer Mehrzahl von LED-Beleuchtungsvorrichtungen und LED-Beleuchtungsvorrichtung
JP2013502047A (ja) 2009-08-14 2013-01-17 キユーデイー・ビジヨン・インコーポレーテツド 照明装置、照明装置用光学部品および方法
US8384103B2 (en) 2010-03-04 2013-02-26 Intellectual Discovery Co., Ltd. Increasing contrast in electronic color displays via surface texturing of LEDs
JP2011204657A (ja) 2010-03-26 2011-10-13 Enplas Corp 光束制御部材およびこれを用いた照明装置
CN102237469A (zh) 2010-04-29 2011-11-09 展晶科技(深圳)有限公司 发光二极管的封装结构
US8354784B2 (en) 2010-09-28 2013-01-15 Intematix Corporation Solid-state light emitting devices with photoluminescence wavelength conversion
CN103155024B (zh) 2010-10-05 2016-09-14 英特曼帝克司公司 具光致发光波长转换的固态发光装置及标牌

Also Published As

Publication number Publication date
KR20120097477A (ko) 2012-09-04
JP5676599B2 (ja) 2015-02-25
US8415692B2 (en) 2013-04-09
CN102473822A (zh) 2012-05-23
EP2452374A1 (en) 2012-05-16
CN102473822B (zh) 2016-09-28
JP2012532473A (ja) 2012-12-13
TW201130169A (en) 2011-09-01
WO2011005300A1 (en) 2011-01-13
EP2452374B1 (en) 2019-11-27
US20110001151A1 (en) 2011-01-06

Similar Documents

Publication Publication Date Title
IN2012DN00988A (zh)
BR112012008267A2 (zh)
BR112012003062A2 (zh)
BR112012008195A2 (zh)
BR112012000607A2 (zh)
BRPI0925311A2 (zh)
BR112012003080A2 (zh)
BR112012000665A2 (zh)
BR112012009446A2 (zh)
BR112012009703A2 (zh)
BR112012007656A2 (zh)
BR112012001263A2 (zh)
BR112012002627A2 (zh)
BR112012000159A2 (zh)
BRPI1004942A2 (zh)
BR112012007672A2 (zh)
BR112012007654A2 (zh)
BR112012005951A2 (zh)
BR112012000255A2 (zh)
BR112012009404A2 (zh)
BR112012000156A2 (zh)
BR112012007671A2 (zh)
BR112012000689A2 (zh)
BR112012003654A2 (zh)
BR112012009701A2 (zh)