IL277989B2 - Characterization and detection of anomalies in an integrated circuit - Google Patents

Characterization and detection of anomalies in an integrated circuit

Info

Publication number
IL277989B2
IL277989B2 IL277989A IL27798920A IL277989B2 IL 277989 B2 IL277989 B2 IL 277989B2 IL 277989 A IL277989 A IL 277989A IL 27798920 A IL27798920 A IL 27798920A IL 277989 B2 IL277989 B2 IL 277989B2
Authority
IL
Israel
Prior art keywords
values
sensor
distance
classification
dies
Prior art date
Application number
IL277989A
Other languages
English (en)
Hebrew (he)
Other versions
IL277989A (en
IL277989B1 (en
Inventor
Evelyn Landman
Shai Cohen
Yahel David
Eyal Fayneh
Yair Talker
Original Assignee
Proteantecs Ltd
Evelyn Landman
Shai Cohen
Yahel David
Eyal Fayneh
Yair Talker
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Proteantecs Ltd, Evelyn Landman, Shai Cohen, Yahel David, Eyal Fayneh, Yair Talker filed Critical Proteantecs Ltd
Publication of IL277989A publication Critical patent/IL277989A/en
Publication of IL277989B1 publication Critical patent/IL277989B1/en
Publication of IL277989B2 publication Critical patent/IL277989B2/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/3183Generation of test inputs, e.g. test vectors, patterns or sequences
    • G01R31/318307Generation of test inputs, e.g. test vectors, patterns or sequences computer-aided, e.g. automatic test program generator [ATPG], program translations, test program debugging
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2803Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] by means of functional tests, e.g. logic-circuit-simulation or algorithms therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2894Aspects of quality control [QC]
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2896Testing of IC packages; Test features related to IC packages
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/31707Test strategies
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/31718Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/3183Generation of test inputs, e.g. test vectors, patterns or sequences
    • G01R31/318342Generation of test inputs, e.g. test vectors, patterns or sequences by preliminary fault modelling, e.g. analysis, simulation
    • G01R31/318357Simulation
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00Machine learning
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00Computing arrangements based on biological models
    • G06N3/004Artificial life, i.e. computing arrangements simulating life
    • G06N3/006Artificial life, i.e. computing arrangements simulating life based on simulated virtual individual or collective life forms, e.g. social simulations or particle swarm optimisation [PSO]
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00Computing arrangements based on biological models
    • G06N3/02Neural networks
    • G06N3/08Learning methods
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N7/00Computing arrangements based on specific mathematical models
    • G06N7/01Probabilistic graphical models, e.g. probabilistic networks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Software Systems (AREA)
  • Mathematical Physics (AREA)
  • Artificial Intelligence (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Computing Systems (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Biophysics (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computational Linguistics (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Medical Informatics (AREA)
  • Probability & Statistics with Applications (AREA)
  • Algebra (AREA)
  • Computational Mathematics (AREA)
  • Pure & Applied Mathematics (AREA)
  • Mathematical Optimization (AREA)
  • Mathematical Analysis (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
IL277989A 2018-04-16 2019-04-16 Characterization and detection of anomalies in an integrated circuit IL277989B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862657986P 2018-04-16 2018-04-16
PCT/IL2019/050433 WO2019202595A1 (en) 2018-04-16 2019-04-16 Integrated circuit profiling and anomaly detection

Publications (3)

Publication Number Publication Date
IL277989A IL277989A (en) 2020-11-30
IL277989B1 IL277989B1 (en) 2024-04-01
IL277989B2 true IL277989B2 (en) 2024-08-01

Family

ID=68239218

Family Applications (1)

Application Number Title Priority Date Filing Date
IL277989A IL277989B2 (en) 2018-04-16 2019-04-16 Characterization and detection of anomalies in an integrated circuit

Country Status (8)

Country Link
US (2) US11762013B2 (https=)
EP (1) EP3781958A4 (https=)
JP (2) JP7602373B2 (https=)
KR (1) KR102936996B1 (https=)
CN (1) CN112262320A (https=)
IL (1) IL277989B2 (https=)
TW (1) TWI828676B (https=)
WO (1) WO2019202595A1 (https=)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI806927B (zh) 2017-11-15 2023-07-01 以色列商普騰泰克斯有限公司 積體電路邊限測量和故障預測裝置
US12282058B2 (en) 2017-11-23 2025-04-22 Proteantecs Ltd. Integrated circuit pad failure detection
CN116736185A (zh) 2017-11-23 2023-09-12 普罗泰克斯公司 集成电路焊盘故障检测
EP3737953B1 (en) 2018-01-08 2026-03-04 Proteantecs Ltd. Integrated circuit workload, temperature and/or sub-threshold leakage sensor
US11740281B2 (en) 2018-01-08 2023-08-29 Proteantecs Ltd. Integrated circuit degradation estimation and time-of-failure prediction using workload and margin sensing
TWI828676B (zh) 2018-04-16 2024-01-11 以色列商普騰泰克斯有限公司 用於積體電路剖析及異常檢測之方法和相關的電腦程式產品
EP3811246A4 (en) 2018-06-19 2022-03-23 Proteantecs Ltd. EFFICIENT SIMULATION AND TESTING OF AN INTEGRATED CIRCUIT
KR102796090B1 (ko) 2018-12-30 2025-04-16 프로틴텍스 엘티디. 집적 회로 i/o 무결성 및 열화 모니터링
TW202127252A (zh) 2019-12-04 2021-07-16 以色列商普騰泰克斯有限公司 記憶體裝置退化偵測
EP4139697A4 (en) 2020-04-20 2024-05-22 Proteantecs Ltd. MONITORING THE CONNECTION BETWEEN CHIPS
US11443092B2 (en) * 2020-05-11 2022-09-13 Synopsys, Inc. Defect weight formulas for analog defect simulation
IL299556A (en) 2020-07-06 2023-02-01 Proteantecs Ltd Integrated circuit margin measurement for structural testing
TWI792086B (zh) * 2020-10-30 2023-02-11 友達光電股份有限公司 行動式設備診斷裝置及設備診斷資訊顯示方法
CN112698185B (zh) * 2020-12-31 2023-07-21 海光信息技术股份有限公司 器件窗口检验方法、装置、设备和存储介质
WO2022215076A1 (en) 2021-04-07 2022-10-13 Proteantecs Ltd. Adaptive frequency scaling based on clock cycle time measurement
US11798827B2 (en) * 2021-05-06 2023-10-24 Kla Corporation Systems and methods for semiconductor adaptive testing using inline defect part average testing
US11624775B2 (en) * 2021-06-07 2023-04-11 Kla Corporation Systems and methods for semiconductor defect-guided burn-in and system level tests
TWI778683B (zh) * 2021-06-24 2022-09-21 英業達股份有限公司 基於產品配置訊息以提供測試時間預估建議系統及其方法
DE102021120345A1 (de) 2021-07-02 2023-01-05 Taiwan Semiconductor Manufacturing Co., Ltd. Verfahren zur prüfung einer integrierten schaltung und eines testsystems
CN115308563B (zh) * 2021-07-02 2025-08-12 台积电(南京)有限公司 测试集成电路的方法和测试系统
CN113641882A (zh) * 2021-07-06 2021-11-12 深圳天狼芯半导体有限公司 确定工艺角晶片的方法、装置、电子设备及可读存储介质
US12007428B2 (en) 2021-10-08 2024-06-11 Advantest Corporation Systems and methods for multidimensional dynamic part average testing
US12530515B1 (en) * 2021-10-28 2026-01-20 Synopsys, Inc. Maximizing detectable defect coverage of analog circuits in integrated circuit design
US12293504B2 (en) 2022-05-06 2025-05-06 Viasat, Inc. Semiconductor package inspection with predictive model for wirebond radio frequency performance
US11815551B1 (en) 2022-06-07 2023-11-14 Proteantecs Ltd. Die-to-die connectivity monitoring using a clocked receiver
CN115308573A (zh) * 2022-08-10 2022-11-08 湖南北云科技有限公司 组合导航板卡的检测方法、装置、系统及相关设备
US20240230755A9 (en) * 2022-10-20 2024-07-11 Mediatek Inc. Outlier Integrated Circuit Detection Method and Outlier Integrated Circuit Detection System by Using Machine Learning Frameworks
US12013800B1 (en) 2023-02-08 2024-06-18 Proteantecs Ltd. Die-to-die and chip-to-chip connectivity monitoring
KR102806610B1 (ko) * 2023-04-07 2025-05-13 에이치디현대일렉트릭 주식회사 전자기기 고장 진단 방법 및 장치
CN116581043B (zh) * 2023-04-20 2023-12-12 深圳市晶存科技有限公司 芯片分类方法、装置、电子设备及计算机可读存储介质
US12123908B1 (en) 2023-09-12 2024-10-22 Proteantecs Ltd. Loopback testing of integrated circuits
US12461143B2 (en) 2024-01-24 2025-11-04 Proteantecs Ltd. Integrated circuit margin measurement
US20250390401A1 (en) * 2024-06-19 2025-12-25 Dell Products L.P. Channel warnings on device insertion issues

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170038265A1 (en) * 2013-06-11 2017-02-09 Intel Corporation Self-calibrated thermal sensors of an integrated circuit die
US20170364818A1 (en) * 2016-06-17 2017-12-21 Business Objects Software Ltd. Automatic condition monitoring and anomaly detection for predictive maintenance

Family Cites Families (239)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3001512A (en) 1960-04-01 1961-09-26 John D Cochin Packaged vehicle lift
JPS57116228A (en) 1981-01-09 1982-07-20 Citizen Watch Co Ltd Temperature detector
JPS5994086A (ja) 1982-11-19 1984-05-30 Advantest Corp 論理回路試験装置
US5548539A (en) 1993-11-05 1996-08-20 Analogy, Inc. Analysis mechanism for system performance simulator
JP3699723B2 (ja) 1994-06-25 2005-09-28 パナリティカル ベー ヴィ 材料サンプルの分析
US5818251A (en) 1996-06-11 1998-10-06 National Semiconductor Corporation Apparatus and method for testing the connections between an integrated circuit and a printed circuit board
US5966527A (en) 1996-10-28 1999-10-12 Advanced Micro Devices, Inc. Apparatus, article of manufacture, method and system for simulating a mass-produced semiconductor device behavior
US5956497A (en) 1997-02-26 1999-09-21 Advanced Micro Devices, Inc. Methodology for designing an integrated circuit using a reduced cell library for preliminary synthesis
US5774403A (en) 1997-06-12 1998-06-30 Hewlett-Packard PVT self aligning internal delay line and method of operation
US6182253B1 (en) 1997-07-16 2001-01-30 Tanisys Technology, Inc. Method and system for automatic synchronous memory identification
US5895629A (en) 1997-11-25 1999-04-20 Science & Technology Corp Ring oscillator based chemical sensor
US6175928B1 (en) 1997-12-31 2001-01-16 Intel Corporation Reducing timing variance of signals from an electronic device
US6229402B1 (en) 1998-05-28 2001-05-08 Canon Kabushiki Kaisha Driving circuit for vibration type actuator apparatus
US6219813B1 (en) 1998-06-29 2001-04-17 International Business Machines Corporation Programmable timing circuit for testing the cycle time of functional circuits on an integrated circuit chip
US6140833A (en) * 1998-11-16 2000-10-31 Siemens Aktiengesellschaft In-situ measurement method and apparatus for semiconductor processing
JP4204685B2 (ja) 1999-01-19 2009-01-07 株式会社ルネサステクノロジ 同期型半導体記憶装置
JP2001075671A (ja) 1999-09-08 2001-03-23 Nec Corp 位相補償回路
US6643787B1 (en) 1999-10-19 2003-11-04 Rambus Inc. Bus system optimization
US6586921B1 (en) 2000-05-12 2003-07-01 Logicvision, Inc. Method and circuit for testing DC parameters of circuit input and output nodes
US7067335B2 (en) 2000-08-25 2006-06-27 Kla-Tencor Technologies Corporation Apparatus and methods for semiconductor IC failure detection
JP3597786B2 (ja) 2001-02-16 2004-12-08 Necマイクロシステム株式会社 半導体集積回路の異常検出回路および異常検出装置
US6873926B1 (en) 2001-02-27 2005-03-29 Cisco Technology, Inc. Methods and apparatus for testing a clock signal
US8417477B2 (en) 2001-05-24 2013-04-09 Test Acuity Solutions, Inc. Methods and apparatus for local outlier detection
US6695475B2 (en) 2001-05-31 2004-02-24 Stmicroelectronics, Inc. Temperature sensing circuit and method
KR20040082376A (ko) 2001-11-20 2004-09-24 주식회사 아도반테스토 위상 조정 장치 및 반도체 시험 장치
US7003742B2 (en) 2002-01-10 2006-02-21 Pdf Solutions, Inc. Methodology for the optimization of testing and diagnosis of analog and mixed signal ICs and embedded cores
US7076678B2 (en) 2002-02-11 2006-07-11 Micron Technology, Inc. Method and apparatus for data transfer
US6882172B1 (en) 2002-04-16 2005-04-19 Transmeta Corporation System and method for measuring transistor leakage current with a ring oscillator
WO2004003582A1 (en) 2002-07-01 2004-01-08 University Of North Carolina At Charlotte Methods for delay-fault testing in field-programmable gate arrays
US6880136B2 (en) 2002-07-09 2005-04-12 International Business Machines Corporation Method to detect systematic defects in VLSI manufacturing
US6807503B2 (en) * 2002-11-04 2004-10-19 Brion Technologies, Inc. Method and apparatus for monitoring integrated circuit fabrication
US6683484B1 (en) 2002-12-19 2004-01-27 Lsi Logic Corporation Combined differential and single-ended input buffer
KR100505664B1 (ko) * 2003-01-07 2005-08-04 삼성전자주식회사 공정 중의 칩 상의 변화를 용이하게 모니터링할 수 있는스피드 비닝 테스트 회로를 구비한 반도체 장치, 및 그테스트 방법
US7369893B2 (en) 2004-12-01 2008-05-06 Medtronic, Inc. Method and apparatus for identifying lead-related conditions using prediction and detection criteria
US7512503B2 (en) 2003-05-12 2009-03-31 Simmonds Precision Products, Inc. Wire fault detection
US7139957B2 (en) 2003-06-30 2006-11-21 Intel Corporation Automatic self test of an integrated circuit component via AC I/O loopback
US7254507B2 (en) 2003-08-27 2007-08-07 Matsushita Electric Industrial Co., Ltd. Analog circuit automatic calibration system
JP2012088322A (ja) 2003-08-27 2012-05-10 Nec Corp 測定結果管理システム、管理サーバ、及び半導体集積回路装置
US8073667B2 (en) * 2003-09-30 2011-12-06 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process
JP4671261B2 (ja) 2003-11-14 2011-04-13 ルネサスエレクトロニクス株式会社 半導体装置
US7742887B2 (en) 2003-11-24 2010-06-22 Qualcomm Incorporated Identifying process and temperature of silicon chips
US6948388B1 (en) 2003-12-18 2005-09-27 The United States Of America As Represented By The Secretary Of The Navy Wireless remote sensor
US20050134350A1 (en) 2003-12-19 2005-06-23 Huang Lawrence L. Analog delay circuit
US7205854B2 (en) 2003-12-23 2007-04-17 Intel Corporation On-chip transistor degradation monitoring
GB0403481D0 (en) * 2004-02-17 2004-03-24 Transense Technologies Plc Interrogation method for passive sensor monitoring system
US20060007248A1 (en) 2004-06-29 2006-01-12 Damoder Reddy Feedback control system and method for operating a high-performance stabilized active-matrix emissive display
US7723995B2 (en) 2004-02-27 2010-05-25 Infineon Technologies Ag Test switching circuit for a high speed data interface
US7109768B2 (en) 2004-06-29 2006-09-19 Intel Corporation Closed-loop control of driver slew rate
US20060049886A1 (en) 2004-09-08 2006-03-09 Agostinelli Victor M Jr On-die record-of-age circuit
US7443189B2 (en) 2005-02-02 2008-10-28 Texas Instruments Incorporated Method to detect and predict metal silicide defects in a microelectronic device during the manufacture of an integrated circuit
US7501832B2 (en) 2005-02-28 2009-03-10 Ridgetop Group, Inc. Method and circuit for the detection of solder-joint failures in a digital electronic package
JP4655683B2 (ja) 2005-03-01 2011-03-23 日本電気株式会社 スルーレート調整回路およびスルーレート調整方法
KR100611742B1 (ko) 2005-03-31 2006-08-11 한국전자통신연구원 Rc 추출에 의한 ibis 모델의 spice동작모델로의 전환방법
WO2007007409A1 (ja) 2005-07-14 2007-01-18 Fujitsu Limited データ復号方法及び,これを適用するデータ復号装置
ATE524896T1 (de) 2005-07-15 2011-09-15 Nxp Bv Verfahren und vorrichtung zum prüfen eines sende- und empfangssystems
KR100703976B1 (ko) 2005-08-29 2007-04-06 삼성전자주식회사 동기식 메모리 장치
WO2007026670A1 (ja) 2005-09-02 2007-03-08 Matsushita Electric Industrial Co., Ltd. 半導体集積回路
US7455450B2 (en) 2005-10-07 2008-11-25 Advanced Micro Devices, Inc. Method and apparatus for temperature sensing in integrated circuits
US20070110199A1 (en) 2005-11-15 2007-05-17 Afshin Momtaz Receive equalizer with adaptive loops
US20070182456A1 (en) 2005-11-21 2007-08-09 Texas Instruments Incorporated Reducing Pin Count When the Digital Output is to be Provided in Differential or Single-ended Form
KR100800470B1 (ko) 2006-01-11 2008-02-01 삼성전자주식회사 링 오실레이터로 구현된 온도 센서 및 이를 이용한 온도검출 방법
US8121237B2 (en) 2006-03-16 2012-02-21 Rambus Inc. Signaling system with adaptive timing calibration
US20070288183A1 (en) 2006-06-07 2007-12-13 Cherik Bulkes Analog signal transition detector
JP4843034B2 (ja) 2006-06-09 2011-12-21 富士通株式会社 温度センサ用リングオシレータ、温度センサ回路及びこれを備える半導体装置
US7908538B2 (en) 2006-08-24 2011-03-15 Nec Corporation Failure prediction circuit and method, and semiconductor integrated circuit
US7649559B2 (en) 2006-08-30 2010-01-19 Aptina Imaging Corporation Amplifier offset cancellation devices, systems, and methods
US20080071489A1 (en) 2006-09-15 2008-03-20 International Business Machines Corporation Integrated circuit for measuring set-up and hold times for a latch element
JP2008072045A (ja) 2006-09-15 2008-03-27 Oki Electric Ind Co Ltd 半導体集積回路
US20080231310A1 (en) 2006-10-20 2008-09-25 Stmicroelectronics Pvt. Ltd. Flexible on chip testing circuit for i/o's characterization
JP2008147245A (ja) 2006-12-06 2008-06-26 Toshiba Corp 劣化診断回路及び半導体集積回路
US7415387B2 (en) 2006-12-19 2008-08-19 Qimonda North America Corp. Die and wafer failure classification system and method
US20080144243A1 (en) 2006-12-19 2008-06-19 Ridgetop Group, Inc. Method and circuit for low-power detection of solder-joint network failures in digital electronic packages
US8115508B2 (en) 2007-01-09 2012-02-14 International Business Machines Corporation Structure for time based driver output transition (slew) rate compensation
US7474974B2 (en) 2007-01-31 2009-01-06 Mcgill University Embedded time domain analyzer for high speed circuits
US7779235B2 (en) 2007-02-06 2010-08-17 International Business Machines Corporation Using performance data for instruction thread direction
US7936153B2 (en) 2007-02-06 2011-05-03 International Business Machines Corporation On-chip adaptive voltage compensation
US7560945B2 (en) 2007-02-06 2009-07-14 International Business Machines Corporation Integrated circuit failure prediction
US7877657B1 (en) 2007-03-29 2011-01-25 Integrated Device Technology, Inc. Look-ahead built-in self tests
US20080262769A1 (en) 2007-04-23 2008-10-23 Daniel Kadosh Using multivariate health metrics to determine market segment and testing requirements
CN101675349A (zh) 2007-05-02 2010-03-17 Nxp股份有限公司 Ic测试方法和设备
EP2006784A1 (en) 2007-06-22 2008-12-24 Interuniversitair Microelektronica Centrum vzw Methods for characterization of electronic circuits under process variability effects
US8001512B1 (en) * 2007-06-26 2011-08-16 Cadence Design Systems, Inc. Method and system for implementing context simulation
JP5242959B2 (ja) 2007-07-11 2013-07-24 シャープ株式会社 異常要因特定方法およびシステム、上記異常要因特定方法をコンピュータに実行させるためのプログラム、並びに上記プログラムを記録したコンピュータ読み取り可能な記録媒体
JP2009021378A (ja) 2007-07-11 2009-01-29 Nec Electronics Corp 半導体集積回路の生産方法、設計方法及び設計システム
US8010310B2 (en) 2007-07-27 2011-08-30 Advanced Micro Devices, Inc. Method and apparatus for identifying outliers following burn-in testing
US8132136B2 (en) 2007-08-06 2012-03-06 International Business Machines Corporation Dynamic critical path detector for digital logic circuit paths
JP2009065533A (ja) 2007-09-07 2009-03-26 Renesas Technology Corp ジッタ検出回路及び半導体装置
JP2009074921A (ja) 2007-09-20 2009-04-09 Panasonic Corp 半導体装置
TWI342403B (en) 2007-09-29 2011-05-21 Ind Tech Res Inst Jitter measuring system and method
WO2009058790A1 (en) 2007-10-30 2009-05-07 Rambus Inc. Signaling with superimposed differential-mode and common-mode signals
JP4977045B2 (ja) 2008-01-16 2012-07-18 株式会社東芝 半導体集積回路及び半導体装置
US8103990B2 (en) 2008-02-28 2012-01-24 Arm Limited Characterising circuit cell performance variability in response to perturbations in manufacturing process parameters
US8912990B2 (en) 2008-04-21 2014-12-16 Apple Inc. Display having a transistor-degradation circuit
US8499230B2 (en) 2008-05-07 2013-07-30 Lsi Corporation Critical path monitor for an integrated circuit and method of operation thereof
US8204730B2 (en) 2008-06-06 2012-06-19 Synopsys, Inc. Generating variation-aware library data with efficient device mismatch characterization
WO2009150694A1 (ja) 2008-06-09 2009-12-17 株式会社アドバンテスト 半導体集積回路および試験装置
US8086978B2 (en) 2008-06-20 2011-12-27 Cadence Design Systems, Inc. Method and system for performing statistical leakage characterization, analysis, and modeling
US7701246B1 (en) 2008-07-17 2010-04-20 Actel Corporation Programmable delay line compensated for process, voltage, and temperature
US8008954B2 (en) 2008-10-03 2011-08-30 Micron Technology, Inc. Multi-phase signal generator and method
US20100153896A1 (en) 2008-12-12 2010-06-17 Lsi Corporation Real-time critical path margin violation detector, a method of monitoring a path and an ic incorporating the detector or method
US8138840B2 (en) 2009-01-23 2012-03-20 International Business Machines Corporation Optimal dithering of a digitally controlled oscillator with clock dithering for gain and bandwidth control
CN102292912A (zh) 2009-01-27 2011-12-21 艾格瑞系统有限公司 用于性能监视的关键路径电路
US8365115B2 (en) 2009-03-06 2013-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for performance modeling of integrated circuits
US8547131B2 (en) 2009-04-03 2013-10-01 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for observing threshold voltage variations
US8417754B2 (en) 2009-05-11 2013-04-09 Empire Technology Development, Llc Identification of integrated circuits
US8825158B2 (en) 2009-08-25 2014-09-02 Lamda Nu, Llc Method and apparatus for detection of lead conductor anomalies using dynamic electrical parameters
US8271931B2 (en) 2009-10-20 2012-09-18 Synopsys, Inc. Integrated circuit optimization modeling technology
US8154353B2 (en) 2009-11-03 2012-04-10 Arm Limited Operating parameter monitor for an integrated circuit
NL1037457C2 (en) 2009-11-10 2011-05-12 Jtag Technologies Bv A method of and an arrangement for testing connections on a printed circuit board.
JP5529555B2 (ja) 2010-01-20 2014-06-25 ルネサスエレクトロニクス株式会社 半導体集積回路、動作電圧制御方法
US8228106B2 (en) 2010-01-29 2012-07-24 Intel Mobile Communications GmbH On-chip self calibrating delay monitoring circuitry
JP5601860B2 (ja) 2010-03-26 2014-10-08 ピーエスフォー ルクスコ エスエイアールエル 半導体装置
KR101939406B1 (ko) * 2010-05-03 2019-01-16 오로라 솔라 테크놀로지스 (캐나다) 인크. 반도체 층의 도펀트 함유량의 비접촉 측정
JP5418408B2 (ja) 2010-05-31 2014-02-19 富士通株式会社 シミュレーションパラメータ校正方法、装置及びプログラム
JP2012007978A (ja) 2010-06-24 2012-01-12 On Semiconductor Trading Ltd 半導体集積回路
CN101915625B (zh) 2010-07-14 2012-07-25 北京北大众志微系统科技有限责任公司 温度传感器
US8680874B2 (en) 2010-07-30 2014-03-25 Imec On-chip testing using time-to-digital conversion
JP5377438B2 (ja) 2010-08-03 2013-12-25 株式会社神戸製鋼所 センサのモニタリング装置
US8384430B2 (en) 2010-08-16 2013-02-26 Taiwan Semiconductor Manufacturing Company, Ltd. RC delay detectors with high sensitivity for through substrate vias
TWI422847B (zh) 2010-09-01 2014-01-11 Univ Nat Chiao Tung 全晶片上寬工作電壓溫度製程電壓的感測系統
US8418103B2 (en) 2010-09-23 2013-04-09 Synopsys, Inc. Nonlinear approach to scaling circuit behaviors for electronic design automation
US8664968B2 (en) 2010-09-24 2014-03-04 Texas Instruments Incorporated On-die parametric test modules for in-line monitoring of context dependent effects
US8633722B1 (en) 2010-09-29 2014-01-21 Xilinx, Inc. Method and circuit for testing accuracy of delay circuitry
KR101232207B1 (ko) 2010-10-29 2013-02-12 고려대학교 산학협력단 온도 감지 회로 및 감지 방법
US8422303B2 (en) 2010-12-22 2013-04-16 HGST Netherlands B.V. Early degradation detection in flash memory using test cells
TWI421478B (zh) 2010-12-31 2014-01-01 Ind Tech Res Inst 溫度感測裝置及方法
US20120187991A1 (en) 2011-01-25 2012-07-26 Advanced Micro Devices, Inc. Clock stretcher for voltage droop mitigation
US9618569B2 (en) * 2011-02-23 2017-04-11 Marvell Israel (M.I.S.L) Ltd. Method and apparatus for testing IC
US8471567B2 (en) 2011-02-25 2013-06-25 Raytheon Company Circuit for detection of failed solder-joints on array packages
US9140754B2 (en) 2011-02-28 2015-09-22 Texas Instruments Incorporated Scan-based MCM interconnecting testing
US8847777B2 (en) 2011-03-25 2014-09-30 Apple Inc. Voltage supply droop detector
JPWO2013027739A1 (ja) 2011-08-24 2015-03-19 日本電気株式会社 劣化診断回路および劣化診断方法
US9448125B2 (en) 2011-11-01 2016-09-20 Nvidia Corporation Determining on-chip voltage and temperature
WO2013070218A1 (en) 2011-11-09 2013-05-16 Intel Corporation Compensation for digitally controlled oscillator apparatus and method
US8996937B2 (en) 2011-12-28 2015-03-31 Stmicroelectronics International N.V. Apparatus for monitoring operating conditions of a logic circuit
CN103310028B (zh) 2012-03-07 2017-08-15 飞思卡尔半导体公司 考虑器件老化的设计集成电路的方法
US8857714B2 (en) 2012-03-15 2014-10-14 Flir Systems, Inc. Ballistic sight system
KR101996292B1 (ko) 2012-03-30 2019-07-05 에스케이하이닉스 주식회사 클럭 생성 회로
KR102048398B1 (ko) 2012-05-04 2019-11-26 온세미컨덕터코리아 주식회사 스위치 제어기, 스위치 제어 방법 및 스위치 제어기를 포함하는 전력 공급 장치
US8896978B2 (en) 2012-06-15 2014-11-25 Texas Instruments Incorporated Integrated circuit with automatic deactivation upon exceeding a specific ion linear energy transfer (LET) value
US9714966B2 (en) 2012-10-05 2017-07-25 Texas Instruments Incorporated Circuit aging sensor
EP2722680B1 (en) 2012-10-19 2018-10-10 IMEC vzw Transition delay detector for interconnect test
US9229051B2 (en) 2012-11-15 2016-01-05 Freescale Semiconductor, Inc. Integrated circuit with degradation monitoring
US9329229B2 (en) 2012-11-15 2016-05-03 Freescale Semiconductors, Inc. Integrated circuit with degradation monitoring
US9710012B2 (en) 2012-11-21 2017-07-18 Sandisk Technologies Llc Timing optimized implementation of algorithm to reduce switching rate on high throughput wide buses
US9110134B2 (en) 2012-12-27 2015-08-18 Intel Corporation Input/output delay testing for devices utilizing on-chip delay generation
US9494649B2 (en) 2012-12-31 2016-11-15 Advanced Micro Devices, Inc. Adaptive digital delay line for characterization of clock uncertainties
EP2770313B1 (en) 2013-02-21 2015-04-08 ST-Ericsson SA Temperature sensing method generating a temperature dependent and a temperature independent output frequencies
US9275706B2 (en) 2013-02-28 2016-03-01 Sandisk Technologies Inc. Auto-calibration for high speed input/output
US10020931B2 (en) 2013-03-07 2018-07-10 Intel Corporation Apparatus for dynamically adapting a clock generator with respect to changes in power supply
US9267988B2 (en) 2013-03-14 2016-02-23 Taiwan Semiconductor Manufacturing Co., Ltd. On-chip eye diagram capture
US20140303912A1 (en) * 2013-04-07 2014-10-09 Kla-Tencor Corporation System and method for the automatic determination of critical parametric electrical test parameters for inline yield monitoring
WO2014166549A1 (en) 2013-04-12 2014-10-16 Advantest (Singapore) Pte. Ltd. Scan speed optimization of input and output paths
US9500705B2 (en) 2013-08-28 2016-11-22 Wisconsin Alumni Research Foundation Integrated circuit providing fault prediction
KR102124966B1 (ko) 2013-08-30 2020-06-22 에스케이하이닉스 주식회사 반도체 장치 및 반도체 장치의 동작방법
US9366709B2 (en) 2013-09-16 2016-06-14 Taiwan Semiconductor Manufactruring Company Ltd. Circuit and method for delay difference measurement
US9222971B2 (en) 2013-10-30 2015-12-29 Freescale Semiconductor, Inc. Functional path failure monitor
US9411668B2 (en) 2014-01-14 2016-08-09 Nvidia Corporation Approach to predictive verification of write integrity in a memory driver
KR20150096197A (ko) 2014-02-14 2015-08-24 삼성전자주식회사 반도체 집적회로의 누설전류 측정 회로
CN103856952A (zh) * 2014-02-27 2014-06-11 上海大学 一种工业无线传感器网络Pareto多目标部署优化方法
JP6526695B6 (ja) * 2014-03-10 2019-06-26 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 多重荷電粒子ビームリソグラフィのためのピクセルブレンディング
US10290092B2 (en) * 2014-05-15 2019-05-14 Applied Materials Israel, Ltd System, a method and a computer program product for fitting based defect detection
US9816872B2 (en) 2014-06-09 2017-11-14 Qualcomm Incorporated Low power low cost temperature sensor
JP2016005085A (ja) 2014-06-16 2016-01-12 ルネサスエレクトロニクス株式会社 半導体集積回路装置およびそれを用いる電子装置の製造方法
US9977078B2 (en) 2014-07-23 2018-05-22 Qualcomm Incorporated Systems and methods for wafer-level loopback test
KR102232922B1 (ko) 2014-08-11 2021-03-29 삼성전자주식회사 쓰기 보조 회로를 포함하는 스태틱 랜덤 액세스 메모리 장치
DE102014216786B3 (de) 2014-08-14 2015-10-22 Continental Automotive Gmbh Integrierte Diagnoseschaltung und Schaltungsanordnung mit der Diagnoseschaltung und einem Schaltelement
JP2016057820A (ja) 2014-09-09 2016-04-21 株式会社東芝 半導体装置及び半導体装置のテスト方法
TWI565211B (zh) 2014-09-12 2017-01-01 Alpha And Omega Semiconductor (Cayman) Ltd Constant on-time switching converter means
JP6481307B2 (ja) 2014-09-24 2019-03-13 株式会社ソシオネクスト アナログデジタル変換器、半導体集積回路、及びアナログデジタル変換方法
TWI524079B (zh) 2014-10-15 2016-03-01 旺宏電子股份有限公司 晶片對資料庫的接觸窗檢測方法
US10235686B2 (en) * 2014-10-30 2019-03-19 Microsoft Technology Licensing, Llc System forecasting and improvement using mean field
US10067000B2 (en) 2014-12-01 2018-09-04 Mediatek Inc. Inverter and ring oscillator with high temperature sensitivity
US10026712B2 (en) 2014-12-02 2018-07-17 Texas Instruments Incorporated ESD protection circuit with stacked ESD cells having parallel active shunt
KR102280526B1 (ko) 2014-12-08 2021-07-21 삼성전자주식회사 저전력 작은-면적 고속 마스터-슬레이브 플립-플롭 회로와, 이를 포함하는 장치들
JP6415285B2 (ja) 2014-12-08 2018-10-31 セイコーNpc株式会社 温度電圧センサ
US9760672B1 (en) 2014-12-22 2017-09-12 Qualcomm Incorporated Circuitry and method for critical path timing speculation to enable process variation compensation via voltage scaling
WO2016112209A1 (en) 2015-01-09 2016-07-14 Ecorithm, Inc. Machine learning-based fault detection system
US9424952B1 (en) 2015-02-07 2016-08-23 The Trustees Of Columbia University In The City Of New York Circuits, methods, and media for detecting and countering aging degradation in memory cells
US9479148B2 (en) 2015-02-26 2016-10-25 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Serial data signal edge detection
US9564883B1 (en) 2015-04-13 2017-02-07 Qualcomm Incorporated Circuitry and method for timing speculation via toggling functional critical paths
US9536038B1 (en) 2015-04-13 2017-01-03 Qualcomm Incorporated Method and algorithm for functional critical paths selection and critical path sensors and controller insertion
US9564884B1 (en) 2015-04-13 2017-02-07 Qualcomm Incorporated Circuitry and method for measuring negative bias temperature instability (NBTI) and hot carrier injection (HCI) aging effects using edge sensitive sampling
US9490787B1 (en) 2015-06-11 2016-11-08 Infineon Technologies Ag System and method for integrated circuit clock distribution
US10234336B2 (en) 2015-08-06 2019-03-19 Sandisk Technologies Llc Ring oscillators for temperature detection in wideband supply noise environments
US9866215B2 (en) 2015-09-30 2018-01-09 Silicon Laboratories Inc. High speed low current voltage comparator
US9991879B2 (en) 2015-11-23 2018-06-05 Mediatek Inc. Apparatus for detecting variation in transistor threshold voltage
US11131706B2 (en) 2015-12-08 2021-09-28 International Business Machines Corporation Degradation monitoring of semiconductor chips
US9997551B2 (en) 2015-12-20 2018-06-12 Apple Inc. Spad array with pixel-level bias control
US10527503B2 (en) 2016-01-08 2020-01-07 Apple Inc. Reference circuit for metrology system
US10161967B2 (en) 2016-01-09 2018-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. On-chip oscilloscope
US9843439B2 (en) 2016-01-27 2017-12-12 Ciena Corporation System and method for managing holdover
FR3050037B1 (fr) 2016-04-12 2018-03-23 Commissariat A L'energie Atomique Et Aux Energies Alternatives Systeme et procede de test d'un circuit integre
US10296076B2 (en) 2016-05-16 2019-05-21 Qualcomm Incorporated Supply voltage droop management circuits for reducing or avoiding supply voltage droops
JP6817888B2 (ja) 2016-05-27 2021-01-20 ヌヴォトンテクノロジージャパン株式会社 不揮発性メモリ装置
US10635159B2 (en) 2016-05-27 2020-04-28 Qualcomm Incorporated Adaptive voltage modulation circuits for adjusting supply voltage to reduce supply voltage droops and minimize power consumption
JP6738682B2 (ja) 2016-08-01 2020-08-12 日本ルメンタム株式会社 光送受信器、光送信集積回路及び光受信集積回路
JP6332397B2 (ja) 2016-10-14 2018-05-30 日本電気株式会社 スルーレート調整回路、及びスルーレート調整方法
US10382014B2 (en) 2016-12-23 2019-08-13 Ati Technologies Ulc Adaptive oscillator for clock generation
US9791834B1 (en) 2016-12-28 2017-10-17 Intel Corporation Fast digital to time converter linearity calibration to improve clock jitter performance
JP6686151B2 (ja) 2017-01-27 2020-04-22 三菱日立パワーシステムズ株式会社 モデルパラメータ値推定装置及び推定方法、プログラム、プログラムを記録した記録媒体、モデルパラメータ値推定システム
CN106959400B (zh) * 2017-02-28 2020-03-31 中国南方电网有限责任公司 一种基于异常点监测和大数据分析的二次设备隐患故障诊断方法
US10380879B2 (en) 2017-06-14 2019-08-13 Allegro Microsystems, Llc Sensor integrated circuits and methods for safety critical applications
CN107451004B (zh) * 2017-07-01 2020-07-31 南京理工大学 一种基于定性趋势分析的道岔故障诊断方法
JP6916441B2 (ja) 2017-10-19 2021-08-11 株式会社ソシオネクスト 半導体集積回路及び呼吸運動検査装置
TWI806927B (zh) 2017-11-15 2023-07-01 以色列商普騰泰克斯有限公司 積體電路邊限測量和故障預測裝置
US12282058B2 (en) 2017-11-23 2025-04-22 Proteantecs Ltd. Integrated circuit pad failure detection
CN116736185A (zh) 2017-11-23 2023-09-12 普罗泰克斯公司 集成电路焊盘故障检测
US10684325B2 (en) 2017-11-29 2020-06-16 Taiwan Semiconductor Manufacturing Co., Ltd. Jitter monitoring circuit
US11740281B2 (en) 2018-01-08 2023-08-29 Proteantecs Ltd. Integrated circuit degradation estimation and time-of-failure prediction using workload and margin sensing
EP3737953B1 (en) 2018-01-08 2026-03-04 Proteantecs Ltd. Integrated circuit workload, temperature and/or sub-threshold leakage sensor
US10530347B2 (en) 2018-03-23 2020-01-07 Sandisk Technologies Llc Receiver-side setup and hold time calibration for source synchronous systems
US10840322B2 (en) 2018-03-29 2020-11-17 Texas Instruments Incorporated Thin film resistor and top plate of capacitor sharing a layer
TWI828676B (zh) * 2018-04-16 2024-01-11 以色列商普騰泰克斯有限公司 用於積體電路剖析及異常檢測之方法和相關的電腦程式產品
CN108534866B (zh) 2018-06-06 2024-11-05 珠海市洁源电器有限公司 一种可隔空监测液位的高灵敏度高精度电子液位感应器
EP3811246A4 (en) 2018-06-19 2022-03-23 Proteantecs Ltd. EFFICIENT SIMULATION AND TESTING OF AN INTEGRATED CIRCUIT
US10587250B2 (en) 2018-07-18 2020-03-10 Qualcomm Incorporated Current-starving in tunable-length delay (TLD) circuits employable in adaptive clock distribution (ACD) systems for compensating supply voltage droops in integrated circuits (ICs)
US10490547B1 (en) 2018-08-03 2019-11-26 Texas Instruments Incorporated IC with larger and smaller width contacts
US10509104B1 (en) 2018-08-13 2019-12-17 Analog Devices Global Unlimited Company Apparatus and methods for synchronization of radar chips
US10664027B2 (en) 2018-10-09 2020-05-26 Intel Corporation Methods, systems and apparatus for dynamic temperature aware functional safety
US20200203333A1 (en) 2018-12-21 2020-06-25 Texas Instruments Incorporated Vertical bipolar transistor for esd protection and method for fabricating
CN111371433B (zh) 2018-12-26 2023-04-11 杭州广立微电子股份有限公司 一种可重构的全数字温度传感器及其应用
KR102796090B1 (ko) 2018-12-30 2025-04-16 프로틴텍스 엘티디. 집적 회로 i/o 무결성 및 열화 모니터링
US11187746B2 (en) 2019-03-26 2021-11-30 Nuvoton Technology Corporation Contact quality testing
US11233503B2 (en) 2019-03-28 2022-01-25 University Of Utah Research Foundation Temperature sensors and methods of use
US20220343048A1 (en) 2019-05-13 2022-10-27 Proteantecs Ltd. Determination of unknown bias and device parameters of integrated circuits by measurement and simulation
US20220268644A1 (en) 2019-07-29 2022-08-25 Proteantecs Ltd. On-die thermal sensing network for integrated circuits
TW202127252A (zh) 2019-12-04 2021-07-16 以色列商普騰泰克斯有限公司 記憶體裝置退化偵測
US11079428B2 (en) 2019-12-13 2021-08-03 Taiwan Semiconductor Manufacturing Company Ltd. Test circuit and method
US11409323B2 (en) 2019-12-20 2022-08-09 Arm Limited Delay monitoring scheme for critical path timing margin
EP4139697A4 (en) 2020-04-20 2024-05-22 Proteantecs Ltd. MONITORING THE CONNECTION BETWEEN CHIPS
WO2021214562A1 (en) 2020-04-20 2021-10-28 Proteantecs Ltd. Die-to-die connectivity monitoring
US11081193B1 (en) 2020-06-16 2021-08-03 Sandisk Technologies Llc Inverter based delay chain for calibrating data signal to a clock
IL299556A (en) 2020-07-06 2023-02-01 Proteantecs Ltd Integrated circuit margin measurement for structural testing
WO2022215076A1 (en) 2021-04-07 2022-10-13 Proteantecs Ltd. Adaptive frequency scaling based on clock cycle time measurement
CN113466670B (zh) 2021-09-03 2022-01-18 绅克半导体科技(苏州)有限公司 延时测量电路、ac校准装置及ic测量装置
US12524589B2 (en) 2021-09-17 2026-01-13 Synopsys, Inc. Functional safety mechanisms for input/output (IO) cells
US11815551B1 (en) 2022-06-07 2023-11-14 Proteantecs Ltd. Die-to-die connectivity monitoring using a clocked receiver
US12013800B1 (en) 2023-02-08 2024-06-18 Proteantecs Ltd. Die-to-die and chip-to-chip connectivity monitoring

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170038265A1 (en) * 2013-06-11 2017-02-09 Intel Corporation Self-calibrated thermal sensors of an integrated circuit die
US20170364818A1 (en) * 2016-06-17 2017-12-21 Business Objects Software Ltd. Automatic condition monitoring and anomaly detection for predictive maintenance

Also Published As

Publication number Publication date
JP7602373B2 (ja) 2024-12-18
JP2024138448A (ja) 2024-10-08
US20240003968A1 (en) 2024-01-04
TW201945923A (zh) 2019-12-01
EP3781958A4 (en) 2022-01-05
TWI828676B (zh) 2024-01-11
IL277989A (en) 2020-11-30
IL277989B1 (en) 2024-04-01
US12320844B2 (en) 2025-06-03
US11762013B2 (en) 2023-09-19
JP2021521646A (ja) 2021-08-26
EP3781958A1 (en) 2021-02-24
CN112262320A (zh) 2021-01-22
KR102936996B1 (ko) 2026-03-11
WO2019202595A1 (en) 2019-10-24
US20210173007A1 (en) 2021-06-10
KR20200143699A (ko) 2020-12-24

Similar Documents

Publication Publication Date Title
US12320844B2 (en) Integrated circuit profiling and anomaly detection
US12216976B2 (en) Efficient integrated circuit simulation and testing
CN111587378A (zh) 集成电路裕度测量和故障预测设备
US20180046902A1 (en) Enhanced restricted boltzmann machine with prognosibility regularization for prognostics and health assessment
US20140214354A1 (en) System and method of detection and analysis for semiconductor condition prediction
US20080262769A1 (en) Using multivariate health metrics to determine market segment and testing requirements
US20080231307A1 (en) Testing method using a scalable parametric measurement macro
US10474774B2 (en) Power and performance sorting of microprocessors from first interconnect layer to wafer final test
Reda et al. Analyzing the impact of process variations on parametric measurements: Novel models and applications
Dong et al. Wafer yield prediction using derived spatial variables
Yelten et al. Scalable and efficient analog parametric fault identification
Huang et al. Towards smarter diagnosis: A learning-based diagnostic outcome previewer
US8190391B2 (en) Determining die performance by incorporating neighboring die performance metrics
Eiki et al. Improving efficiency and robustness of Gaussian process based outlier detection via ensemble learning
Biswas et al. Reducing test execution cost of integrated, heterogeneous systems using continuous test data
Pan et al. Wafer-level adaptive testing based on dual-predictor collaborative decision
Bae et al. Edge characteristics metric-guided latent defect chip detection model in semiconductor fabrication
Kovacs et al. A metamodel-based adaptive sampling approach for efficient failure region characterization of integrated circuits
Helinski et al. Electronic forensic techniques for manufacturer attribution
Wang Data learning based diagnosis
Krishnan et al. A robust metric for screening outliers from analogue product manufacturing tests responses
Hsu Test data analytics: Exploration of hidden patterns for test cost reduction and silicon characterization
Niranjan et al. MACHINE LEARNING-DRIVEN YIELD OPTIMIZATION IN ANALOG/RF INTEGRATED CIRCUITS TO COUNTER THE EFFECTS OF PROCESS VARIATION
Ahmadi Applications of Machine Learning in Test Cost Reduction, Yield Estimation and Fab-Of-Origin Attestation of Integrated Circuits
Stoyanov et al. Data analytics approach for optimal qualification testing of electronic components