IL108359A - Method and device for creating integrated circular devices - Google Patents
Method and device for creating integrated circular devicesInfo
- Publication number
- IL108359A IL108359A IL10835994A IL10835994A IL108359A IL 108359 A IL108359 A IL 108359A IL 10835994 A IL10835994 A IL 10835994A IL 10835994 A IL10835994 A IL 10835994A IL 108359 A IL108359 A IL 108359A
- Authority
- IL
- Israel
- Prior art keywords
- integrated circuit
- pads
- integrated circuits
- wafer
- circuit devices
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000005520 cutting process Methods 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 230000001681 protective effect Effects 0.000 claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 21
- 239000010703 silicon Substances 0.000 claims description 21
- 229910052710 silicon Inorganic materials 0.000 claims description 21
- 239000004593 Epoxy Substances 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 239000005022 packaging material Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 49
- 239000010410 layer Substances 0.000 description 25
- 238000005530 etching Methods 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 102000001708 Protein Isoforms Human genes 0.000 description 1
- 108010029485 Protein Isoforms Proteins 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000006664 bond formation reaction Methods 0.000 description 1
- 238000004532 chromating Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01018—Argon [Ar]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Dicing (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
- Transmitters (AREA)
Priority Applications (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL10835994A IL108359A (en) | 1994-01-17 | 1994-01-17 | Method and device for creating integrated circular devices |
AT95906334T ATE183020T1 (de) | 1994-01-17 | 1995-01-10 | Verfahren zur herstellung integrierter schaltungsbauelemente |
AU14564/95A AU1456495A (en) | 1994-01-17 | 1995-01-10 | Methods and apparatus for producing integrated circuit devices |
DE69511241T DE69511241T2 (de) | 1994-01-17 | 1995-01-10 | Verfahren zur herstellung integrierter schaltungsbauelemente |
US08/682,556 US6040235A (en) | 1994-01-17 | 1995-01-10 | Methods and apparatus for producing integrated circuit devices |
PCT/EP1995/000097 WO1995019645A1 (en) | 1994-01-17 | 1995-01-10 | Methods and apparatus for producing integrated circuit devices |
CA002181339A CA2181339A1 (en) | 1994-01-17 | 1995-01-10 | Methods and apparatus for producing integrated circuit devices |
SG1995001998A SG50376A1 (en) | 1994-01-17 | 1995-01-10 | Methods and apparatus for producing integrated circuit devices |
JP7518833A JPH09511097A (ja) | 1994-01-17 | 1995-01-10 | 集積回路素子の製造方法および製造装置 |
EP95906334A EP0740852B1 (en) | 1994-01-17 | 1995-01-10 | Method of producing integrated circuit devices |
MX9602801A MX9602801A (es) | 1994-01-17 | 1995-01-10 | Metodos y aparatos para produccion de dispositivos de circuito integrado. |
TW084100321A TW360957B (en) | 1994-01-17 | 1995-01-16 | Method and apparatus for producing integrated circuit devices |
MYPI95000096A MY130185A (en) | 1994-01-17 | 1995-01-16 | Method & apparatus for producing integrated circuit devices. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL10835994A IL108359A (en) | 1994-01-17 | 1994-01-17 | Method and device for creating integrated circular devices |
Publications (2)
Publication Number | Publication Date |
---|---|
IL108359A0 IL108359A0 (en) | 1994-04-12 |
IL108359A true IL108359A (en) | 2001-04-30 |
Family
ID=11065715
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL10835994A IL108359A (en) | 1994-01-17 | 1994-01-17 | Method and device for creating integrated circular devices |
Country Status (13)
Country | Link |
---|---|
US (1) | US6040235A (zh) |
EP (1) | EP0740852B1 (zh) |
JP (1) | JPH09511097A (zh) |
AT (1) | ATE183020T1 (zh) |
AU (1) | AU1456495A (zh) |
CA (1) | CA2181339A1 (zh) |
DE (1) | DE69511241T2 (zh) |
IL (1) | IL108359A (zh) |
MX (1) | MX9602801A (zh) |
MY (1) | MY130185A (zh) |
SG (1) | SG50376A1 (zh) |
TW (1) | TW360957B (zh) |
WO (1) | WO1995019645A1 (zh) |
Families Citing this family (114)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IL108359A (en) * | 1994-01-17 | 2001-04-30 | Shellcase Ltd | Method and device for creating integrated circular devices |
US6127245A (en) * | 1997-02-04 | 2000-10-03 | Micron Technology, Inc. | Grinding technique for integrated circuits |
US5789302A (en) * | 1997-03-24 | 1998-08-04 | Siemens Aktiengesellschaft | Crack stops |
DE19738549C1 (de) * | 1997-09-03 | 1998-12-10 | Siemens Ag | Verpackte integrierte Schaltung |
FR2771551B1 (fr) * | 1997-11-21 | 2000-01-28 | Ela Medical Sa | Composant microelectromecanique, tel que microcapteur ou microactionneur, reportable sur un substrat de circuit hybride |
IL123207A0 (en) * | 1998-02-06 | 1998-09-24 | Shellcase Ltd | Integrated circuit device |
US6624505B2 (en) | 1998-02-06 | 2003-09-23 | Shellcase, Ltd. | Packaged integrated circuits and methods of producing thereof |
JP4230543B2 (ja) | 1998-03-16 | 2009-02-25 | エヌエックスピー ビー ヴィ | 「チップサイズパッケージ」を有する半導体装置の製造方法 |
US6235612B1 (en) * | 1998-06-10 | 2001-05-22 | Texas Instruments Incorporated | Edge bond pads on integrated circuits |
FR2783354B1 (fr) * | 1998-08-25 | 2002-07-12 | Commissariat Energie Atomique | Procede collectif de conditionnement d'une pluralite de composants formes initialement dans un meme substrat |
FR2782840B1 (fr) * | 1998-08-25 | 2003-09-05 | Commissariat Energie Atomique | Circuit electronique et procede de realisation d'un circuit electronique integre comprenant au moins un composant electronique de puissance dans une plaque de substrat |
US6187611B1 (en) | 1998-10-23 | 2001-02-13 | Microsemi Microwave Products, Inc. | Monolithic surface mount semiconductor device and method for fabricating same |
US7208725B2 (en) | 1998-11-25 | 2007-04-24 | Rohm And Haas Electronic Materials Llc | Optoelectronic component with encapsulant |
JP3429718B2 (ja) * | 1999-10-28 | 2003-07-22 | 新光電気工業株式会社 | 表面実装用基板及び表面実装構造 |
IL133453A0 (en) | 1999-12-10 | 2001-04-30 | Shellcase Ltd | Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby |
EP2276075A1 (de) * | 2000-02-15 | 2011-01-19 | OSRAM Opto Semiconductors GmbH | Strahlung emittierendes Halbleiterbauelement und Verfahren zu dessen Herstellung |
DE10006738C2 (de) * | 2000-02-15 | 2002-01-17 | Osram Opto Semiconductors Gmbh | Lichtemittierendes Bauelement mit verbesserter Lichtauskopplung und Verfahren zu seiner Herstellung |
DE20111659U1 (de) * | 2000-05-23 | 2001-12-13 | Osram Opto Semiconductors Gmbh | Bauelement für die Optoelektronik |
KR100855015B1 (ko) | 2000-12-21 | 2008-08-28 | 테쎄라 테크놀로지스 헝가리 케이에프티. | 패키징된 집적회로 및 그 제조 방법 |
US20020117753A1 (en) * | 2001-02-23 | 2002-08-29 | Lee Michael G. | Three dimensional packaging |
US7498196B2 (en) | 2001-03-30 | 2009-03-03 | Megica Corporation | Structure and manufacturing method of chip scale package |
US6878608B2 (en) * | 2001-05-31 | 2005-04-12 | International Business Machines Corporation | Method of manufacture of silicon based package |
EP1435112A2 (en) * | 2001-06-19 | 2004-07-07 | Koninklijke Philips Electronics N.V. | Method of manufacturing a semiconductor device and semiconductor device |
JP2003197569A (ja) * | 2001-12-28 | 2003-07-11 | Disco Abrasive Syst Ltd | 半導体チップの製造方法 |
US6624003B1 (en) | 2002-02-06 | 2003-09-23 | Teravicta Technologies, Inc. | Integrated MEMS device and package |
US7591780B2 (en) * | 2002-03-18 | 2009-09-22 | Sterling Lc | Miniaturized imaging device with integrated circuit connector system |
US7787939B2 (en) * | 2002-03-18 | 2010-08-31 | Sterling Lc | Miniaturized imaging device including utility aperture and SSID |
US20060146172A1 (en) * | 2002-03-18 | 2006-07-06 | Jacobsen Stephen C | Miniaturized utility device having integrated optical capabilities |
US8614768B2 (en) * | 2002-03-18 | 2013-12-24 | Raytheon Company | Miniaturized imaging device including GRIN lens optically coupled to SSID |
WO2003088286A2 (en) * | 2002-04-16 | 2003-10-23 | Xloom Photonics Ltd. | Electro-optical circuitry having integrated connector and methods for the production thereof |
US20040021214A1 (en) * | 2002-04-16 | 2004-02-05 | Avner Badehi | Electro-optic integrated circuits with connectors and methods for the production thereof |
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US6908791B2 (en) * | 2002-04-29 | 2005-06-21 | Texas Instruments Incorporated | MEMS device wafer-level package |
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US7033664B2 (en) | 2002-10-22 | 2006-04-25 | Tessera Technologies Hungary Kft | Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby |
US7265045B2 (en) * | 2002-10-24 | 2007-09-04 | Megica Corporation | Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging |
JP4093018B2 (ja) * | 2002-11-08 | 2008-05-28 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
JP2004165191A (ja) * | 2002-11-08 | 2004-06-10 | Oki Electric Ind Co Ltd | 半導体装置、半導体装置の製造方法及びカメラシステム |
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TWI225696B (en) * | 2003-06-10 | 2004-12-21 | Advanced Semiconductor Eng | Semiconductor package and method for manufacturing the same |
US6972480B2 (en) | 2003-06-16 | 2005-12-06 | Shellcase Ltd. | Methods and apparatus for packaging integrated circuit devices |
KR101078621B1 (ko) | 2003-07-03 | 2011-11-01 | 테쎄라 테크놀로지스 아일랜드 리미티드 | 집적회로 디바이스를 패키징하기 위한 방법 및 장치 |
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JP4401181B2 (ja) * | 2003-08-06 | 2010-01-20 | 三洋電機株式会社 | 半導体装置及びその製造方法 |
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US7612443B1 (en) | 2003-09-04 | 2009-11-03 | University Of Notre Dame Du Lac | Inter-chip communication |
JP4248355B2 (ja) * | 2003-09-24 | 2009-04-02 | 三洋電機株式会社 | 半導体装置および半導体装置の製造方法 |
TWI226090B (en) * | 2003-09-26 | 2005-01-01 | Advanced Semiconductor Eng | Transparent packaging in wafer level |
US6972243B2 (en) * | 2003-09-30 | 2005-12-06 | International Business Machines Corporation | Fabrication of semiconductor dies with micro-pins and structures produced therewith |
US6943423B2 (en) * | 2003-10-01 | 2005-09-13 | Optopac, Inc. | Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof |
US6864116B1 (en) | 2003-10-01 | 2005-03-08 | Optopac, Inc. | Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof |
WO2005036226A1 (en) * | 2003-10-15 | 2005-04-21 | Xloom Photonics Ltd. | Electro-optical circuitry having integrated connector and methods for the production thereof |
US20050156330A1 (en) * | 2004-01-21 | 2005-07-21 | Harris James M. | Through-wafer contact to bonding pad |
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-
1994
- 1994-01-17 IL IL10835994A patent/IL108359A/en not_active IP Right Cessation
-
1995
- 1995-01-10 WO PCT/EP1995/000097 patent/WO1995019645A1/en active IP Right Grant
- 1995-01-10 JP JP7518833A patent/JPH09511097A/ja active Pending
- 1995-01-10 EP EP95906334A patent/EP0740852B1/en not_active Expired - Lifetime
- 1995-01-10 AU AU14564/95A patent/AU1456495A/en not_active Abandoned
- 1995-01-10 CA CA002181339A patent/CA2181339A1/en not_active Abandoned
- 1995-01-10 DE DE69511241T patent/DE69511241T2/de not_active Expired - Lifetime
- 1995-01-10 MX MX9602801A patent/MX9602801A/es unknown
- 1995-01-10 US US08/682,556 patent/US6040235A/en not_active Expired - Lifetime
- 1995-01-10 SG SG1995001998A patent/SG50376A1/en unknown
- 1995-01-10 AT AT95906334T patent/ATE183020T1/de not_active IP Right Cessation
- 1995-01-16 MY MYPI95000096A patent/MY130185A/en unknown
- 1995-01-16 TW TW084100321A patent/TW360957B/zh not_active IP Right Cessation
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JPH09511097A (ja) | 1997-11-04 |
MX9602801A (es) | 1997-12-31 |
DE69511241D1 (de) | 1999-09-09 |
AU1456495A (en) | 1995-08-01 |
WO1995019645A1 (en) | 1995-07-20 |
ATE183020T1 (de) | 1999-08-15 |
EP0740852A1 (en) | 1996-11-06 |
DE69511241T2 (de) | 2000-04-20 |
IL108359A0 (en) | 1994-04-12 |
TW360957B (en) | 1999-06-11 |
US6040235A (en) | 2000-03-21 |
CA2181339A1 (en) | 1995-07-20 |
SG50376A1 (en) | 1998-07-20 |
MY130185A (en) | 2007-06-29 |
EP0740852B1 (en) | 1999-08-04 |
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