MX9602801A - Metodos y aparatos para produccion de dispositivos de circuito integrado. - Google Patents

Metodos y aparatos para produccion de dispositivos de circuito integrado.

Info

Publication number
MX9602801A
MX9602801A MX9602801A MX9602801A MX9602801A MX 9602801 A MX9602801 A MX 9602801A MX 9602801 A MX9602801 A MX 9602801A MX 9602801 A MX9602801 A MX 9602801A MX 9602801 A MX9602801 A MX 9602801A
Authority
MX
Mexico
Prior art keywords
integrated circuit
devices
circuit devices
prepackaged
disc
Prior art date
Application number
MX9602801A
Other languages
English (en)
Inventor
Pierre Badehi
Original Assignee
Shellcase Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shellcase Ltd filed Critical Shellcase Ltd
Publication of MX9602801A publication Critical patent/MX9602801A/es

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

Landscapes

  • Dicing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Transmitters (AREA)

Abstract

Un método para producir dispositivos de circuito integrado que incluye las etapas de producir una pluralidad de circuitos integrados sobre un disco que tiene primera y segundas superficies planas, cada uno de los circuitos integrados incluyendo una multiplicidad de almohadillas, unir en forma de disco ambas superficies del disco una capa de material protector, cortando parcialemente dentro del disco y el material protector unido al mismo, para definir de esta manera muescas a lo largo de los perfiles de una pluralidad de dispositivos de circuito integrado preempaquetados, formando contactos metálicos sobre la pluralidad de dispositivos de circuito integrado preempaquetado en tanto que están unidos todavía sobre el disco, por lo menos una porcion de dichos contactos metálicos extendiéndose dentro de las muescas y separando posteriormente la pluralidad de dispositivo de circuito integrado preempaquetados en dispositivos individuales; también se describen y reivindican los circuitos producidos de conformidad con el método.
MX9602801A 1994-01-17 1995-01-10 Metodos y aparatos para produccion de dispositivos de circuito integrado. MX9602801A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL10835994A IL108359A (en) 1994-01-17 1994-01-17 Method and apparatus for producing integrated circuit devices
PCT/EP1995/000097 WO1995019645A1 (en) 1994-01-17 1995-01-10 Methods and apparatus for producing integrated circuit devices

Publications (1)

Publication Number Publication Date
MX9602801A true MX9602801A (es) 1997-12-31

Family

ID=11065715

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9602801A MX9602801A (es) 1994-01-17 1995-01-10 Metodos y aparatos para produccion de dispositivos de circuito integrado.

Country Status (13)

Country Link
US (1) US6040235A (es)
EP (1) EP0740852B1 (es)
JP (1) JPH09511097A (es)
AT (1) ATE183020T1 (es)
AU (1) AU1456495A (es)
CA (1) CA2181339A1 (es)
DE (1) DE69511241T2 (es)
IL (1) IL108359A (es)
MX (1) MX9602801A (es)
MY (1) MY130185A (es)
SG (1) SG50376A1 (es)
TW (1) TW360957B (es)
WO (1) WO1995019645A1 (es)

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Also Published As

Publication number Publication date
EP0740852B1 (en) 1999-08-04
EP0740852A1 (en) 1996-11-06
DE69511241D1 (de) 1999-09-09
CA2181339A1 (en) 1995-07-20
WO1995019645A1 (en) 1995-07-20
JPH09511097A (ja) 1997-11-04
IL108359A (en) 2001-04-30
US6040235A (en) 2000-03-21
AU1456495A (en) 1995-08-01
TW360957B (en) 1999-06-11
MY130185A (en) 2007-06-29
ATE183020T1 (de) 1999-08-15
IL108359A0 (en) 1994-04-12
DE69511241T2 (de) 2000-04-20
SG50376A1 (en) 1998-07-20

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