HK56594A - Packaged semiconductor chip - Google Patents

Packaged semiconductor chip Download PDF

Info

Publication number
HK56594A
HK56594A HK56594A HK56594A HK56594A HK 56594 A HK56594 A HK 56594A HK 56594 A HK56594 A HK 56594A HK 56594 A HK56594 A HK 56594A HK 56594 A HK56594 A HK 56594A
Authority
HK
Hong Kong
Prior art keywords
conductors
chip
module
semiconductor chip
lead frame
Prior art date
Application number
HK56594A
Other languages
German (de)
English (en)
French (fr)
Inventor
P Pashby Richard
Douglas W Phelps, Jr.
J Samuelsen Sigvart
C Ward William
Original Assignee
International Business Machines Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corporation filed Critical International Business Machines Corporation
Publication of HK56594A publication Critical patent/HK56594A/en

Links

Classifications

    • H10W42/25—
    • H10W70/40—
    • H10W70/415—
    • H10W72/073—
    • H10W72/075—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/865—
    • H10W90/756—
    • H10W99/00—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
HK56594A 1985-04-18 1994-05-24 Packaged semiconductor chip HK56594A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US72473685A 1985-04-18 1985-04-18

Publications (1)

Publication Number Publication Date
HK56594A true HK56594A (en) 1994-06-03

Family

ID=24911697

Family Applications (1)

Application Number Title Priority Date Filing Date
HK56594A HK56594A (en) 1985-04-18 1994-05-24 Packaged semiconductor chip

Country Status (5)

Country Link
EP (1) EP0198194B1 (cg-RX-API-DMAC10.html)
JP (1) JPS61241959A (cg-RX-API-DMAC10.html)
CA (1) CA1238119A (cg-RX-API-DMAC10.html)
DE (1) DE3664022D1 (cg-RX-API-DMAC10.html)
HK (1) HK56594A (cg-RX-API-DMAC10.html)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1290676C (en) * 1987-03-30 1991-10-15 William Frank Graham Method for bonding integrated circuit chips
US5296074A (en) * 1987-03-30 1994-03-22 E. I. Du Pont De Nemours And Company Method for bonding small electronic components
US4796078A (en) * 1987-06-15 1989-01-03 International Business Machines Corporation Peripheral/area wire bonding technique
JPH0777226B2 (ja) * 1987-06-30 1995-08-16 株式会社日立製作所 半導体装置およびその製造方法
JP2644773B2 (ja) * 1987-10-28 1997-08-25 株式会社日立製作所 樹脂封止型半導体装置
JPH0724275B2 (ja) * 1987-11-06 1995-03-15 三菱電機株式会社 半導体装置
JP2706077B2 (ja) * 1988-02-12 1998-01-28 株式会社日立製作所 樹脂封止型半導体装置及びその製造方法
JP2708191B2 (ja) * 1988-09-20 1998-02-04 株式会社日立製作所 半導体装置
US5068712A (en) * 1988-09-20 1991-11-26 Hitachi, Ltd. Semiconductor device
US4937656A (en) * 1988-04-22 1990-06-26 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JP2647900B2 (ja) * 1988-05-12 1997-08-27 株式会社日立製作所 面実装超薄形半導体装置
JPH0215663A (ja) * 1988-07-04 1990-01-19 Tomoegawa Paper Co Ltd リードフレーム用両面接着テープ
JP2585738B2 (ja) * 1988-08-12 1997-02-26 株式会社日立製作所 半導体記憶装置
US4924291A (en) * 1988-10-24 1990-05-08 Motorola Inc. Flagless semiconductor package
JPH077816B2 (ja) * 1988-11-24 1995-01-30 株式会社東芝 半導体封止容器
JPH088329B2 (ja) * 1988-12-12 1996-01-29 三菱電機株式会社 半導体集積回路装置及びその製造方法
JP2809675B2 (ja) * 1989-03-20 1998-10-15 株式会社東芝 樹脂封止型半導体装置
US4916519A (en) * 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
EP0405330A3 (en) * 1989-06-29 1992-05-06 Motorola, Inc. Flagless leadframe, package and method
SG49886A1 (en) * 1989-06-30 1998-06-15 Texas Instruments Inc Balanced capacitance lead frame for integrated circuits
JPH088330B2 (ja) * 1989-07-19 1996-01-29 日本電気株式会社 Ｌｏｃ型リードフレームを備えた半導体集積回路装置
GB8918482D0 (en) * 1989-08-14 1989-09-20 Inmos Ltd Packaging semiconductor chips
US4965654A (en) * 1989-10-30 1990-10-23 International Business Machines Corporation Semiconductor package with ground plane
JP2567961B2 (ja) * 1989-12-01 1996-12-25 株式会社日立製作所 半導体装置及びリ−ドフレ−ム
JPH0724270B2 (ja) * 1989-12-14 1995-03-15 株式会社東芝 半導体装置及びその製造方法
JP2801319B2 (ja) * 1989-12-28 1998-09-21 株式会社日立製作所 半導体装置
JP2528991B2 (ja) * 1990-02-28 1996-08-28 株式会社日立製作所 樹脂封止型半導体装置及びリ―ドフレ―ム
EP0454447A3 (en) * 1990-04-26 1993-12-08 Hitachi Ltd Semiconductor device assembly
KR920020687A (ko) * 1991-04-16 1992-11-21 김광호 반도체 패키지
KR940006164B1 (ko) * 1991-05-11 1994-07-08 금성일렉트론 주식회사 반도체 패키지 및 그 제조방법
KR940003560B1 (ko) * 1991-05-11 1994-04-23 금성일렉트론 주식회사 적층형 반도체 패키지 및 그 제조방법.
JP2518569B2 (ja) * 1991-09-19 1996-07-24 三菱電機株式会社 半導体装置
JP2932785B2 (ja) * 1991-09-20 1999-08-09 富士通株式会社 半導体装置
KR940007757Y1 (ko) * 1991-11-14 1994-10-24 금성일렉트론 주식회사 반도체 패키지
US6372080B1 (en) 1993-03-29 2002-04-16 Hitachi Chemical Company, Ltd Process for fabricating a crack resistant resin encapsulated semiconductor chip package
US6046072A (en) 1993-03-29 2000-04-04 Hitachi Chemical Company, Ltd. Process for fabricating a crack resistant resin encapsulated semiconductor chip package
US5994169A (en) * 1994-10-27 1999-11-30 Texas Instruments Incorporated Lead frame for integrated circuits and process of packaging
JP2715965B2 (ja) * 1995-03-13 1998-02-18 株式会社日立製作所 樹脂封止型半導体装置
JP2788885B2 (ja) * 1995-12-21 1998-08-20 山口日本電気株式会社 半導体装置用リードフレームおよび半導体装置
JP2806851B2 (ja) * 1995-12-27 1998-09-30 山口日本電気株式会社 半導体集積回路装置およびその製造方法
JP2911409B2 (ja) * 1996-07-22 1999-06-23 株式会社日立製作所 半導体装置
JPH11265971A (ja) 1998-03-17 1999-09-28 Hitachi Ltd Ｔｓｏｐ型半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5421168A (en) * 1977-07-18 1979-02-17 Kyushu Nippon Electric Semiconductor
JPS5588356A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Semiconductor device
US4331831A (en) * 1980-11-28 1982-05-25 Bell Telephone Laboratories, Incorporated Package for semiconductor integrated circuits
JPS6112095A (ja) * 1984-06-27 1986-01-20 日本電気株式会社 混成集積回路装置

Also Published As

Publication number Publication date
JPS61241959A (ja) 1986-10-28
CA1238119A (en) 1988-06-14
EP0198194B1 (en) 1989-06-14
JPH0312781B2 (cg-RX-API-DMAC10.html) 1991-02-21
EP0198194A1 (en) 1986-10-22
DE3664022D1 (en) 1989-07-20

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PF Patent in force
PE Patent expired

Effective date: 20060303