JPS61241959A - 半導体モジユ−ル - Google Patents

半導体モジユ−ル

Info

Publication number
JPS61241959A
JPS61241959A JP61032066A JP3206686A JPS61241959A JP S61241959 A JPS61241959 A JP S61241959A JP 61032066 A JP61032066 A JP 61032066A JP 3206686 A JP3206686 A JP 3206686A JP S61241959 A JPS61241959 A JP S61241959A
Authority
JP
Japan
Prior art keywords
chip
semiconductor chip
lead frame
conductor
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61032066A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0312781B2 (cg-RX-API-DMAC10.html
Inventor
リチヤード・ポール・パシビイ
ダグラス・ウオーレス・フエルプ、ジユニア
シグバート・ジヨン・サムエルセン
ウイリアム・キヤロル・ワード
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS61241959A publication Critical patent/JPS61241959A/ja
Publication of JPH0312781B2 publication Critical patent/JPH0312781B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W42/25—
    • H10W70/40—
    • H10W70/415—
    • H10W72/073—
    • H10W72/075—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/865—
    • H10W90/756—
    • H10W99/00—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP61032066A 1985-04-18 1986-02-18 半導体モジユ−ル Granted JPS61241959A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US72473685A 1985-04-18 1985-04-18
US724736 1985-04-18

Publications (2)

Publication Number Publication Date
JPS61241959A true JPS61241959A (ja) 1986-10-28
JPH0312781B2 JPH0312781B2 (cg-RX-API-DMAC10.html) 1991-02-21

Family

ID=24911697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61032066A Granted JPS61241959A (ja) 1985-04-18 1986-02-18 半導体モジユ−ル

Country Status (5)

Country Link
EP (1) EP0198194B1 (cg-RX-API-DMAC10.html)
JP (1) JPS61241959A (cg-RX-API-DMAC10.html)
CA (1) CA1238119A (cg-RX-API-DMAC10.html)
DE (1) DE3664022D1 (cg-RX-API-DMAC10.html)
HK (1) HK56594A (cg-RX-API-DMAC10.html)

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS647628A (en) * 1987-06-30 1989-01-11 Hitachi Ltd Semiconductor device and manufacture thereof
JPS6428945A (en) * 1987-06-15 1989-01-31 Ibm Circuit package assembly
JPH01114058A (ja) * 1987-10-28 1989-05-02 Hitachi Ltd 樹脂封止型半導体装置
JPH01123428A (ja) * 1987-11-06 1989-05-16 Mitsubishi Electric Corp 半導体装置
JPH01286342A (ja) * 1988-05-12 1989-11-17 Hitachi Ltd 面実装超薄形半導体装置
JPH0215663A (ja) * 1988-07-04 1990-01-19 Tomoegawa Paper Co Ltd リードフレーム用両面接着テープ
JPH0250438A (ja) * 1988-08-12 1990-02-20 Hitachi Ltd 半導体記憶装置
JPH02143449A (ja) * 1988-11-24 1990-06-01 Toshiba Corp 半導体封止容器
JPH02158159A (ja) * 1988-12-12 1990-06-18 Mitsubishi Electric Corp 半導体集積回路装置及びその製造方法
JPH02246357A (ja) * 1989-03-20 1990-10-02 Toshiba Corp 樹脂封止型半導体装置
JPH0321047A (ja) * 1989-05-30 1991-01-29 Internatl Business Mach Corp <Ibm> カプセル封じされた半導体パツケージ
JPH03173464A (ja) * 1989-12-01 1991-07-26 Hitachi Ltd 半導体装置
JPH03201544A (ja) * 1989-12-28 1991-09-03 Hitachi Ltd 半導体装置
JPH03250654A (ja) * 1990-02-28 1991-11-08 Hitachi Ltd 樹脂封止型半導体装置及びリードフレーム
JPH05136202A (ja) * 1991-05-11 1993-06-01 Goldstar Electron Co Ltd 半導体パツケージ及びその製造方法
US5252853A (en) * 1991-09-19 1993-10-12 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device having tab tape and particular power distribution lead structure
US5358904A (en) * 1988-09-20 1994-10-25 Hitachi, Ltd. Semiconductor device
JPH07254677A (ja) * 1995-03-13 1995-10-03 Hitachi Ltd 樹脂封止型半導体装置
JPH08330345A (ja) * 1996-07-22 1996-12-13 Hitachi Ltd 半導体装置
JPH09172132A (ja) * 1995-12-21 1997-06-30 Nec Yamaguchi Ltd 半導体装置用リードフレームおよび半導体装置
JPH09181245A (ja) * 1995-12-27 1997-07-11 Nec Yamaguchi Ltd 半導体集積回路装置
US5863817A (en) * 1988-09-20 1999-01-26 Hitachi, Ltd. Semiconductor device
US6046072A (en) * 1993-03-29 2000-04-04 Hitachi Chemical Company, Ltd. Process for fabricating a crack resistant resin encapsulated semiconductor chip package
US6232653B1 (en) 1998-03-17 2001-05-15 Hitachi, Ltd. TSOP type semiconductor device
US6372080B1 (en) 1993-03-29 2002-04-16 Hitachi Chemical Company, Ltd Process for fabricating a crack resistant resin encapsulated semiconductor chip package

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1290676C (en) * 1987-03-30 1991-10-15 William Frank Graham Method for bonding integrated circuit chips
US5296074A (en) * 1987-03-30 1994-03-22 E. I. Du Pont De Nemours And Company Method for bonding small electronic components
JP2706077B2 (ja) * 1988-02-12 1998-01-28 株式会社日立製作所 樹脂封止型半導体装置及びその製造方法
US4937656A (en) * 1988-04-22 1990-06-26 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US4924291A (en) * 1988-10-24 1990-05-08 Motorola Inc. Flagless semiconductor package
EP0405330A3 (en) * 1989-06-29 1992-05-06 Motorola, Inc. Flagless leadframe, package and method
SG49886A1 (en) * 1989-06-30 1998-06-15 Texas Instruments Inc Balanced capacitance lead frame for integrated circuits
JPH088330B2 (ja) * 1989-07-19 1996-01-29 日本電気株式会社 Ｌｏｃ型リードフレームを備えた半導体集積回路装置
GB8918482D0 (en) * 1989-08-14 1989-09-20 Inmos Ltd Packaging semiconductor chips
US4965654A (en) * 1989-10-30 1990-10-23 International Business Machines Corporation Semiconductor package with ground plane
JPH0724270B2 (ja) * 1989-12-14 1995-03-15 株式会社東芝 半導体装置及びその製造方法
EP0454447A3 (en) * 1990-04-26 1993-12-08 Hitachi Ltd Semiconductor device assembly
KR920020687A (ko) * 1991-04-16 1992-11-21 김광호 반도체 패키지
KR940003560B1 (ko) * 1991-05-11 1994-04-23 금성일렉트론 주식회사 적층형 반도체 패키지 및 그 제조방법.
JP2932785B2 (ja) * 1991-09-20 1999-08-09 富士通株式会社 半導体装置
KR940007757Y1 (ko) * 1991-11-14 1994-10-24 금성일렉트론 주식회사 반도체 패키지
US5994169A (en) * 1994-10-27 1999-11-30 Texas Instruments Incorporated Lead frame for integrated circuits and process of packaging

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5421168A (en) * 1977-07-18 1979-02-17 Kyushu Nippon Electric Semiconductor
JPS6112095A (ja) * 1984-06-27 1986-01-20 日本電気株式会社 混成集積回路装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588356A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Semiconductor device
US4331831A (en) * 1980-11-28 1982-05-25 Bell Telephone Laboratories, Incorporated Package for semiconductor integrated circuits

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5421168A (en) * 1977-07-18 1979-02-17 Kyushu Nippon Electric Semiconductor
JPS6112095A (ja) * 1984-06-27 1986-01-20 日本電気株式会社 混成集積回路装置

Cited By (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6428945A (en) * 1987-06-15 1989-01-31 Ibm Circuit package assembly
JPS647628A (en) * 1987-06-30 1989-01-11 Hitachi Ltd Semiconductor device and manufacture thereof
JPH01114058A (ja) * 1987-10-28 1989-05-02 Hitachi Ltd 樹脂封止型半導体装置
JPH01123428A (ja) * 1987-11-06 1989-05-16 Mitsubishi Electric Corp 半導体装置
US6081023A (en) * 1988-03-20 2000-06-27 Hitachi, Ltd. Semiconductor device
US6130114A (en) * 1988-03-20 2000-10-10 Hitachi, Ltd. Semiconductor device
US6072231A (en) * 1988-03-20 2000-06-06 Hitachi, Ltd. Semiconductor device
JPH01286342A (ja) * 1988-05-12 1989-11-17 Hitachi Ltd 面実装超薄形半導体装置
JPH0215663A (ja) * 1988-07-04 1990-01-19 Tomoegawa Paper Co Ltd リードフレーム用両面接着テープ
JPH0250438A (ja) * 1988-08-12 1990-02-20 Hitachi Ltd 半導体記憶装置
US6720208B2 (en) 1988-09-20 2004-04-13 Renesas Technology Corporation Semiconductor device
US6100580A (en) * 1988-09-20 2000-08-08 Hitachi, Ltd. Semiconductor device having all outer leads extending from one side of a resin member
US6018191A (en) * 1988-09-20 2000-01-25 Hitachi, Ltd. Semiconductor device
US6531760B1 (en) 1988-09-20 2003-03-11 Gen Murakami Semiconductor device
US6326681B1 (en) 1988-09-20 2001-12-04 Hitachi, Ltd Semiconductor device
US6303982B2 (en) 1988-09-20 2001-10-16 Hitachi, Ltd. Semiconductor device
US5358904A (en) * 1988-09-20 1994-10-25 Hitachi, Ltd. Semiconductor device
US5981315A (en) * 1988-09-20 1999-11-09 Hitachi, Ltd. Semiconductor device
US6124629A (en) * 1988-09-20 2000-09-26 Hitachi, Ltd. Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip
US6100115A (en) * 1988-09-20 2000-08-08 Hitachi, Ltd. Semiconductor device
US6919622B2 (en) 1988-09-20 2005-07-19 Renesas Technology Corp. Semiconductor device
US5914530A (en) * 1988-09-20 1999-06-22 Hitachi, Ltd. Semiconductor device
US5863817A (en) * 1988-09-20 1999-01-26 Hitachi, Ltd. Semiconductor device
JPH02143449A (ja) * 1988-11-24 1990-06-01 Toshiba Corp 半導体封止容器
JPH02158159A (ja) * 1988-12-12 1990-06-18 Mitsubishi Electric Corp 半導体集積回路装置及びその製造方法
JPH02246357A (ja) * 1989-03-20 1990-10-02 Toshiba Corp 樹脂封止型半導体装置
JPH0321047A (ja) * 1989-05-30 1991-01-29 Internatl Business Mach Corp <Ibm> カプセル封じされた半導体パツケージ
US5585665A (en) * 1989-12-01 1996-12-17 Hitachi, Ltd. Packaged semiconductor device and a leadframe therefor
US6030859A (en) * 1989-12-01 2000-02-29 Hitachi, Ltd. Method of making a packaged semiconductor device and a lead-frame therefor
JPH03173464A (ja) * 1989-12-01 1991-07-26 Hitachi Ltd 半導体装置
JPH03201544A (ja) * 1989-12-28 1991-09-03 Hitachi Ltd 半導体装置
JPH03250654A (ja) * 1990-02-28 1991-11-08 Hitachi Ltd 樹脂封止型半導体装置及びリードフレーム
JPH05136202A (ja) * 1991-05-11 1993-06-01 Goldstar Electron Co Ltd 半導体パツケージ及びその製造方法
US5252853A (en) * 1991-09-19 1993-10-12 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device having tab tape and particular power distribution lead structure
US6248613B1 (en) 1993-03-29 2001-06-19 Hitachi Chemical Company, Ltd. Process for fabricating a crack resistant resin encapsulated semiconductor chip package
US6372080B1 (en) 1993-03-29 2002-04-16 Hitachi Chemical Company, Ltd Process for fabricating a crack resistant resin encapsulated semiconductor chip package
US6046072A (en) * 1993-03-29 2000-04-04 Hitachi Chemical Company, Ltd. Process for fabricating a crack resistant resin encapsulated semiconductor chip package
US6558791B2 (en) 1993-03-29 2003-05-06 Hitachi Chemical Company Heat-resistant adhesive sheet
JPH07254677A (ja) * 1995-03-13 1995-10-03 Hitachi Ltd 樹脂封止型半導体装置
JPH09172132A (ja) * 1995-12-21 1997-06-30 Nec Yamaguchi Ltd 半導体装置用リードフレームおよび半導体装置
JPH09181245A (ja) * 1995-12-27 1997-07-11 Nec Yamaguchi Ltd 半導体集積回路装置
JPH08330345A (ja) * 1996-07-22 1996-12-13 Hitachi Ltd 半導体装置
US6232653B1 (en) 1998-03-17 2001-05-15 Hitachi, Ltd. TSOP type semiconductor device

Also Published As

Publication number Publication date
DE3664022D1 (en) 1989-07-20
JPH0312781B2 (cg-RX-API-DMAC10.html) 1991-02-21
CA1238119A (en) 1988-06-14
EP0198194A1 (en) 1986-10-22
EP0198194B1 (en) 1989-06-14
HK56594A (en) 1994-06-03

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term