HK1178688A1 - 連接結構體的製造方法 - Google Patents
連接結構體的製造方法Info
- Publication number
- HK1178688A1 HK1178688A1 HK13105305.4A HK13105305A HK1178688A1 HK 1178688 A1 HK1178688 A1 HK 1178688A1 HK 13105305 A HK13105305 A HK 13105305A HK 1178688 A1 HK1178688 A1 HK 1178688A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- production
- connected structure
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0242—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections comprising means for controlling the temperature, e.g. making use of the curie point
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
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- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
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- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24826—Spot bonds connect components
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wire Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2010136180A JP5540916B2 (ja) | 2010-06-15 | 2010-06-15 | 接続構造体の製造方法 |
PCT/JP2011/062779 WO2011158666A1 (ja) | 2010-06-15 | 2011-06-03 | 接続構造体の製造方法 |
Publications (1)
Publication Number | Publication Date |
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HK1178688A1 true HK1178688A1 (zh) | 2013-09-13 |
Family
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Family Applications (1)
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HK13105305.4A HK1178688A1 (zh) | 2010-06-15 | 2013-05-02 | 連接結構體的製造方法 |
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US (1) | US8835772B2 (zh) |
JP (1) | JP5540916B2 (zh) |
KR (1) | KR101355709B1 (zh) |
CN (1) | CN102939645B (zh) |
HK (1) | HK1178688A1 (zh) |
TW (1) | TWI480966B (zh) |
WO (1) | WO2011158666A1 (zh) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5673444B2 (ja) * | 2010-10-19 | 2015-02-18 | 信越化学工業株式会社 | 熱圧着用シリコーンゴムシート及び電気・電子機器部品の接合方法 |
JP5703061B2 (ja) * | 2011-02-23 | 2015-04-15 | 積水化学工業株式会社 | 接続構造体の製造方法 |
JP6231257B2 (ja) * | 2011-12-15 | 2017-11-15 | デクセリアルズ株式会社 | 導電性接着剤、及び電子部品の接続方法 |
KR101488916B1 (ko) * | 2011-12-23 | 2015-02-02 | 제일모직 주식회사 | 이방성 도전 필름 및 반도체 장치 |
JP2014026963A (ja) * | 2012-06-18 | 2014-02-06 | Sekisui Chem Co Ltd | 接続構造体の製造方法 |
JP2014049646A (ja) * | 2012-08-31 | 2014-03-17 | Panasonic Corp | 部品実装方法および部品実装システム |
JP6115060B2 (ja) | 2012-09-21 | 2017-04-19 | 富士通株式会社 | 電子デバイスの製造方法 |
JP6061642B2 (ja) * | 2012-09-24 | 2017-01-18 | 株式会社タムラ製作所 | 異方性導電性ペーストおよびそれを用いたプリント配線基板 |
JP6061645B2 (ja) * | 2012-09-24 | 2017-01-18 | 株式会社タムラ製作所 | 異方性導電性ペーストおよびそれを用いたプリント配線基板 |
JP6068106B2 (ja) * | 2012-09-24 | 2017-01-25 | 株式会社タムラ製作所 | 異方性導電性ペーストおよびそれを用いたプリント配線基板 |
JP6061643B2 (ja) * | 2012-09-24 | 2017-01-18 | 株式会社タムラ製作所 | 異方性導電性ペーストおよびそれを用いたプリント配線基板 |
JP6243111B2 (ja) * | 2012-11-14 | 2017-12-06 | 日本電産サンキョー株式会社 | 磁気センサ装置およびその製造方法 |
JP5887304B2 (ja) * | 2013-06-21 | 2016-03-16 | 株式会社タムラ製作所 | 異方性導電性ペーストおよびそれを用いたプリント配線基板 |
US9997491B2 (en) | 2013-07-08 | 2018-06-12 | Sony Corporation | Method of determining curing conditions, method of producing circuit device, and circuit device |
JP6393039B2 (ja) * | 2014-02-12 | 2018-09-19 | デクセリアルズ株式会社 | 接続体の製造方法、接続方法及び接続体 |
JP6430148B2 (ja) * | 2014-05-23 | 2018-11-28 | デクセリアルズ株式会社 | 接着剤及び接続構造体 |
US10435601B2 (en) | 2014-05-23 | 2019-10-08 | Dexerials Corporation | Adhesive agent and connection structure |
JP6419457B2 (ja) * | 2014-05-23 | 2018-11-07 | デクセリアルズ株式会社 | 接着剤及び接続構造体 |
JP2016035044A (ja) * | 2014-06-03 | 2016-03-17 | 太陽インキ製造株式会社 | 導電性接着剤および電子部品 |
KR102334672B1 (ko) * | 2014-06-03 | 2021-12-06 | 다이요 잉키 세이조 가부시키가이샤 | 경화성 조성물 및 전자 부품 |
JP5860191B1 (ja) * | 2014-06-05 | 2016-02-16 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
JP6181038B2 (ja) * | 2014-12-26 | 2017-08-16 | 株式会社タムラ製作所 | 異方性導電性ペーストおよびそれを用いたプリント配線基板の製造方法 |
CN106716550B (zh) * | 2014-12-26 | 2019-04-19 | 积水化学工业株式会社 | 导电糊剂、连接结构体及连接结构体的制造方法 |
JP2016148012A (ja) * | 2015-02-05 | 2016-08-18 | 太陽インキ製造株式会社 | 硬化性組成物および電子部品 |
KR20240018694A (ko) * | 2015-03-09 | 2024-02-13 | 가부시끼가이샤 레조낙 | 접속 구조체의 제조 방법 |
JP6493968B2 (ja) * | 2015-03-18 | 2019-04-03 | デクセリアルズ株式会社 | 接続方法、接合体、異方性導電フィルム、及び接合体の前駆体 |
WO2016148004A1 (ja) * | 2015-03-18 | 2016-09-22 | デクセリアルズ株式会社 | 発光装置製造方法 |
JP6187918B2 (ja) * | 2015-04-23 | 2017-08-30 | パナソニックIpマネジメント株式会社 | 回路部材の接続構造、接続方法および接続材料 |
JP6710120B2 (ja) * | 2015-09-30 | 2020-06-17 | 太陽インキ製造株式会社 | 導電性接着剤、電子部品および電子部品の製造方法 |
JP7321979B2 (ja) * | 2015-12-18 | 2023-08-07 | 株式会社レゾナック | 導電性接着剤組成物、接続構造体及び半導体発光素子搭載フレキシブル配線基板 |
JP6782413B2 (ja) * | 2015-12-18 | 2020-11-11 | 昭和電工マテリアルズ株式会社 | 導電性接着剤組成物、接続構造体及び半導体発光素子搭載フレキシブル配線基板 |
JP6587107B2 (ja) | 2016-05-12 | 2019-10-09 | パナソニックIpマネジメント株式会社 | 回路部材の接続方法 |
JP6772012B2 (ja) * | 2016-09-28 | 2020-10-21 | 株式会社タムラ製作所 | 異方性導電フィルムの製造方法 |
JP6474008B2 (ja) * | 2017-03-29 | 2019-02-27 | パナソニックIpマネジメント株式会社 | 接続材料 |
JP6536968B2 (ja) * | 2017-07-20 | 2019-07-03 | パナソニックIpマネジメント株式会社 | 接続材料 |
JP6709944B2 (ja) * | 2018-10-01 | 2020-06-17 | 株式会社弘輝 | 接合構造体の製造方法 |
WO2020085372A1 (ja) * | 2018-10-24 | 2020-04-30 | 住友ベークライト株式会社 | 導電性樹脂組成物および半導体装置 |
JP6691998B1 (ja) * | 2019-12-24 | 2020-05-13 | 株式会社鈴木 | 半導体装置の製造方法及び半導体装置の製造装置 |
CN111261053B (zh) * | 2020-01-20 | 2023-10-13 | 京东方科技集团股份有限公司 | 微型发光二极管显示面板及其制备方法和显示装置 |
JP7405196B2 (ja) * | 2020-07-14 | 2023-12-26 | 株式会社レゾナック | 導電性接着剤組成物、接続構造体及び半導体発光素子搭載フレキシブル配線基板 |
KR20240014821A (ko) * | 2022-07-26 | 2024-02-02 | 에스케이온 주식회사 | Pcb와 fpcb가 접합된 도전성 접합부를 포함하는 배터리 모듈 및 그 접합 방법 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3636159B2 (ja) * | 1992-09-08 | 2005-04-06 | セイコーエプソン株式会社 | 液晶表示装置、半導体チップの実装構造、電子光学装置および電子印字装置 |
JP3417110B2 (ja) | 1994-12-30 | 2003-06-16 | カシオ計算機株式会社 | 電子部品の接続方法 |
JPH08325543A (ja) * | 1995-06-05 | 1996-12-10 | Soken Chem & Eng Co Ltd | 異方導電性接着剤 |
KR100539060B1 (ko) * | 1997-10-28 | 2007-04-25 | 소니 케미카루 가부시키가이샤 | 이방도전성접착제및접착용막 |
JP2001015551A (ja) * | 1999-06-29 | 2001-01-19 | Toshiba Corp | 半導体装置およびその製造方法 |
TW492215B (en) * | 2000-03-23 | 2002-06-21 | Sony Corp | Electric connection material and electric connection method |
JP3966516B2 (ja) | 2001-06-20 | 2007-08-29 | 東レエンジニアリング株式会社 | 実装方法および装置 |
JP2003147287A (ja) * | 2001-11-14 | 2003-05-21 | Hitachi Chem Co Ltd | 回路接続用接着フィルム |
JP3968516B2 (ja) * | 2002-09-10 | 2007-08-29 | 井関農機株式会社 | 農作業機 |
US7034403B2 (en) | 2003-04-10 | 2006-04-25 | 3M Innovative Properties Company | Durable electronic assembly with conductive adhesive |
JP4399005B2 (ja) * | 2005-02-03 | 2010-01-13 | パナソニック株式会社 | フリップチップ実装方法及びバンプ形成方法 |
WO2006098268A1 (ja) * | 2005-03-16 | 2006-09-21 | Matsushita Electric Industrial Co., Ltd. | 導電性粒子を用いたフリップチップ実装方法およびバンプ形成方法 |
EP1865550A4 (en) * | 2005-03-29 | 2012-07-11 | Panasonic Corp | FLIPCHIP APPLICATION METHOD AND METHOD FOR CONNECTING SUBSTRATES |
JP5329028B2 (ja) * | 2006-09-15 | 2013-10-30 | パナソニック株式会社 | 電子部品実装構造体の製造方法 |
KR101079946B1 (ko) * | 2006-11-28 | 2011-11-04 | 파나소닉 주식회사 | 전자 부품 실장 구조체와 그 제조 방법 |
TW200839895A (en) * | 2007-03-16 | 2008-10-01 | Int Semiconductor Tech Ltd | Method for flip-chip bonding with non-conductive paste |
JP5093482B2 (ja) * | 2007-06-26 | 2012-12-12 | ソニーケミカル&インフォメーションデバイス株式会社 | 異方性導電材料、接続構造体及びその製造方法 |
JP2009141269A (ja) * | 2007-12-10 | 2009-06-25 | Sony Chemical & Information Device Corp | 電気部品の実装方法及び実装装置 |
JP5533663B2 (ja) * | 2008-11-06 | 2014-06-25 | 住友ベークライト株式会社 | 電子装置の製造方法 |
WO2010070779A1 (ja) * | 2008-12-19 | 2010-06-24 | パナソニック株式会社 | 異方性導電樹脂、基板接続構造及び電子機器 |
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CN102939645A (zh) | 2013-02-20 |
JP2010226140A (ja) | 2010-10-07 |
US20120255766A1 (en) | 2012-10-11 |
KR101355709B1 (ko) | 2014-01-27 |
US8835772B2 (en) | 2014-09-16 |
TW201207972A (en) | 2012-02-16 |
WO2011158666A1 (ja) | 2011-12-22 |
TWI480966B (zh) | 2015-04-11 |
KR20120136386A (ko) | 2012-12-18 |
CN102939645B (zh) | 2015-06-10 |
JP5540916B2 (ja) | 2014-07-02 |
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